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IS61WV51232BLL-10BLI

Integrated Silicon Solution

IS61WV51232BLL-10BLI by Integrated Silicon Solution

IS61WV51232BLL-10BLI by Integrated Silicon Solution is a 512Kx32 SRAM with 10ns access time, operating at 3.3V. It features a low profile grid array package and is ideal for industrial applications requiring fast and reliable parallel memory storage. With a memory density of 16Mbit, it offers high-speed data retrieval in harsh environments.

Median Price

$21.310

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$18.680

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Vyrian

USA . 7,275 parts In-Stock

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7,275

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NAC Semi

USA . 480 parts In-Stock

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$23.940

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$23.940

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Chip Stock

USA . 159 parts In-Stock

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GLYN GmbH & Co. KG

Germany . 15 parts In-Stock

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J2 Sourcing AB

Sweden . 10 parts In-Stock

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Kiltronic GmbH

Germany . 6 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 248 parts In-Stock

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$7.714

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Netroflash

USA . 100 parts In-Stock

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$18.680

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$17.746

10k+ parts

$17.372

100

$18.680

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$17.746

$17.372

Futuretech Components

Singapore . 5,000 parts In-Stock

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Eastek

USA . 720 parts In-Stock

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$22.720

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Kepictronics

USA . 298 parts In-Stock

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Infinite Electronics LLP (Excess)

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GreenTree Electronics

Israel . 50 parts In-Stock

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iodParts Technologies Inc.

India . 15 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the IS61WV51232BLL-10BLI from Integrated Silicon Solution. As a leading manufacturer in the semiconductor industry, ISS delivers top-notch SRAM memory solutions for a wide range of applications. With a focus on quality and innovation, this product offers customers valuable benefits such as fast access times, low power consumption, and industrial-grade durability. Upgrade your projects with the cutting-edge technology and superior performance of the IS61WV51232BLL-10BLI SRAM memory.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making this product a reliable choice.

Surface Mount: YES

Being surface mountable makes installation easier and more space-efficient, making this product ideal for compact system designs.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a circuit board, making this product suitable for densely packed configurations.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for flexible and independent access to data, enhancing the versatility of this product.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage ensures compatibility with a wide range of systems, making this product versatile and easy to integrate.

No. of Terminals: 90

The high number of terminals provides ample connectivity options, allowing for versatile applications of this product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array and fine pitch design enhance signal integrity and reduce electromagnetic interference, making this product suitable for high-performance applications.

Maximum Operating Temperature: 85 °C

With a high operating temperature tolerance, this product is suitable for use in demanding environments.

Organization: 512KX32

The 512Kx32 organization offers a balance between memory capacity and data width, making this product versatile for various data processing tasks.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures performance even in extreme cold conditions, making this product reliable in diverse environments.

Technical Specifications

SRAM IS61WV51232BLL-10BLI attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

10 ns

JESD-30 Code:

R-PBGA-B90

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

32

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

90

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

10

Width:

8 mm

Trade Compliance

IS61WV51232BLL-10BLI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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