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CY62168EV30LL-45BVXI

Infineon Technologies

CY62168EV30LL-45BVXI by Infineon Technologies

Infineon's CY62168EV30LL-45BVXI is a 2MX8 SRAM with 3.6V max supply voltage, 45ns access time, and 1.5V min standby voltage. Ideal for industrial applications requiring fast and reliable memory storage in a compact grid array package with very thin profile and fine pitch design.

Median Price

$10.122

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,332 parts In-Stock

1+ parts

$12.610

100+ parts

$11.330

1k+ parts

$10.980

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1,332

$12.610

$11.330

$10.980

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DigiKey

USA . 807 parts In-Stock

1+ parts

$15.930

100+ parts

$13.633

1k+ parts

$12.870

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807

$15.930

$13.633

$12.870

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Rochester

USA . 1,476 parts In-Stock

1+ parts

-

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$8.740

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$7.820

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$7.360

1,476

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$8.740

$7.820

$7.360

Avnet

USA . 960 parts In-Stock

1+ parts

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$8.178

10k+ parts

$7.878

960

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$8.178

$7.878

Verical

USA . 916 parts In-Stock

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-

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$10.925

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$9.775

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$9.200

916

-

$10.925

$9.775

$9.200

Flip Electronics (Authorized)

USA . 759 parts In-Stock

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Future Electronics

Canada . 480 parts In-Stock

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$9.320

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480

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$9.320

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Distributors (In-Stock)

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Digiode

USA . 909 parts In-Stock

1+ parts

$9.224

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909

$9.224

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Chip Stock

USA . 2,915 parts In-Stock

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2,915

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Vyrian

USA . 889 parts In-Stock

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Flip Electronics

USA . 759 parts In-Stock

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Resion

USA . 682 parts In-Stock

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IBS Electronics

USA . 480 parts In-Stock

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$14.516

1k+ parts

$14.179

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480

-

$14.516

$14.179

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

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450

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Cyclops Electronics Ltd

UK . 305 parts In-Stock

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305

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Electronics Depot

USA . 29 parts In-Stock

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ComSIT Distribution GmbH

Germany . 4 parts In-Stock

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4

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 6,188 parts In-Stock

1+ parts

$2.320

100+ parts

$2.227

1k+ parts

$2.134

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-

6,188

$2.320

$2.227

$2.134

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Aztec Data Supply Inc.

USA . 182 parts In-Stock

1+ parts

$4.043

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182

$4.043

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Corohmni

South Africa . 294 parts In-Stock

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$5.822

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294

$5.822

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Semicontronic

India . 914 parts In-Stock

1+ parts

$7.650

100+ parts

$7.459

1k+ parts

$7.420

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914

$7.650

$7.459

$7.420

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Ampacity Inc.

Singapore . 634 parts In-Stock

1+ parts

$8.250

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634

$8.250

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Corphita

USA . 489 parts In-Stock

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$8.739

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489

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Lixinc

USA . 17,575 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,267 parts In-Stock

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Robosynatics

Brazil . 4,698 parts In-Stock

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$3.733

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$3.657

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$3.657

4,698

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$3.733

$3.657

$3.657

Lucentia Tech

USA . 4,698 parts In-Stock

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$3.733

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$3.657

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$3.657

4,698

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$3.657

Continental Prestige Electronics

USA . 4,619 parts In-Stock

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Argo Parts USA

USA . 4,488 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,178 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 1,568 parts In-Stock

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RC Electronics

USA . 1,211 parts In-Stock

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$11.870

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$10.840

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$10.510

1,211

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$11.870

$10.840

$10.510

ChipstoGo Electronic ltd

UK . 1,046 parts In-Stock

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GreenTree Electronics

Israel . 816 parts In-Stock

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Kepictronics

USA . 146 parts In-Stock

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146

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unleash the power of reliable and high-quality SRAM with the CY62168EV30LL-45BVXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch products that cater to a wide range of applications. This versatile SRAM offers customers unparalleled value and benefits, ensuring seamless performance and efficiency. Experience the advantages of Infineon's cutting-edge technology and elevate your projects to new heights with the CY62168EV30LL-45BVXI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, making the product long-lasting.

Nominal Supply Voltage / Vsup (V): 3

Compatible with common supply voltages, ensuring ease of integration into existing systems.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Compact design allows for space-saving and efficient PCB layout.

Maximum Operating Temperature: 85 °C

Can operate in a wide range of temperatures, suitable for industrial applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high performance.

Memory Density: 16777216 bit

Offers high memory density, suitable for storing a large amount of data.

Output Enable: YES

Enables control over the output, providing flexibility in data handling.

Maximum Access Time: 45 ns

Provides fast access to data, optimizing system performance.

Technical Specifications

SRAM CY62168EV30LL-45BVXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

48

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX8

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CY62168EV30LL-45BVXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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