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IS61C1024AL-12KLI-TR

Integrated Silicon Solution

IS61C1024AL-12KLI-TR by Integrated Silicon Solution

IS61C1024AL-12KLI-TR by Integrated Silicon Solution is a 128Kx8 SRAM with 12ns access time, operating at 5V. It features a small outline package, asynchronous operation, and 3-state output. Ideal for industrial applications requiring fast and reliable memory storage.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 18,500 parts In-Stock

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Vyrian

USA . 2,389 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Aztec Data Supply Inc.

USA . 500 parts In-Stock

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$4.400

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$4.400

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$5.645

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$5.137

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$4.629

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AZTECH Wire

Italy . 196 parts In-Stock

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$6.254

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Continental Prestige Electronics

USA . 3,171 parts In-Stock

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Argo Parts USA

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Aranea Global

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Authorized Procurement Solutions

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Overview

Upgrade your electronic devices with the IS61C1024AL-12KLI-TR SRAM from Integrated Silicon Solution. Known for their high-quality products, ISS offers reliable solutions for a wide range of applications. This versatile memory IC provides fast access times and low power consumption, making it perfect for industrial-grade systems. With a compact design and easy installation, this SRAM will enhance the performance of your electronics while ensuring long-term reliability. Trust ISS to deliver innovative technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the SRAM, ensuring long-term reliability.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster and more flexible data access, making the SRAM suitable for high-performance applications.

Nominal Supply Voltage: 5V

Operating at a standard 5V supply voltage ensures compatibility with a wide range of systems and devices.

Organization: 128KX8

The organization of 128Kx8 allows for efficient data handling and storage, making the SRAM an effective memory solution.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high speed performance, ideal for energy-efficient and high-speed applications.

Technical Specifications

SRAM IS61C1024AL-12KLI-TR attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

12 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-J32

Length:

20.95 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOJ

Package Equivalence Code:

SOJ32,.44

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.76 mm

Maximum Standby Current:

.00045 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

IS61C1024AL-12KLI-TR Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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