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IS25LQ032B-JBLE-TR

Integrated Silicon Solution

IS25LQ032B-JBLE-TR by Integrated Silicon Solution

IS25LQ032B-JBLE-TR by Integrated Silicon Solution is a 32Mbit Flash Memory with synchronous operation, operating at up to 104MHz clock frequency. It has a small outline package and is suitable for industrial temperature grade applications. With a memory density of 33554432 bits, it offers reliable data storage in various electronic devices.

Median Price

$1.307

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 4,500 parts In-Stock

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Vyrian

USA . 2,092 parts In-Stock

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Bristol Electronics

USA . 145 parts In-Stock

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$1.307

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145

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$1.307

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 176 parts In-Stock

1+ parts

$4.010

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$4.010

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Corohmni

South Africa . 707 parts In-Stock

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$4.382

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707

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AZTECH Wire

Italy . 319 parts In-Stock

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$16.662

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Continental Prestige Electronics

USA . 4,247 parts In-Stock

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Argo Parts USA

USA . 395 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock the power of efficient data storage and retrieval with the IS25LQ032B-JBLE-TR by Integrated Silicon Solution. This high-quality flash memory offers unparalleled reliability and performance for a variety of applications. With its compact design and advanced technology, this product ensures seamless operation at an affordable price point. Upgrade your systems today and experience the benefits of cutting-edge memory solutions.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the flash memory chip.

Surface Mount:

YES - Allows for easy and convenient installation on a circuit board.

Package Shape:

SQUARE - Helps save space and facilitates efficient layout of components.

Operating Mode:

SYNCHRONOUS - Enhances data transfer speed and efficiency.

Nominal Supply Voltage / Vsup (V):

3 - Ensures stable and reliable power supply for optimal performance.

No. of Terminals:

8 - Provides multiple connection points for seamless integration into a system.

Package Style (Meter):

SMALL OUTLINE - Ideal for compact devices with limited space for components.

Maximum Operating Temperature:

105 °C - Ensures reliability in various environmental conditions.

Organization:

32MX1 - Organized layout for efficient data storage and retrieval.

Minimum Operating Temperature:

40 °C - Allows for operation in extreme temperature conditions.

Terminal Position:

DUAL - Provides flexibility in mounting options for versatile applications.

Maximum Seated Height:

2.16 mm - Low profile design for space-saving installation.

Maximum Clock Frequency (fCLK):

104 MHz - Supports high-speed data processing for improved efficiency.

Width:

5.28 mm - Compact size for easy integration into various electronic devices.

Minimum Supply Voltage (Vsup):

2.3 V - Allows for operation even with lower power supply levels.

Length:

5.28 mm - Compact and standardized dimensions for easy compatibility.

Programming Voltage (V):

2.7 - Provides appropriate voltage for programming the memory chip.

Temperature Grade:

INDUSTRIAL - Suitable for industrial applications with demanding conditions.

Technology:

CMOS - Ensures low power consumption and efficient performance.

Parallel or Serial:

SERIAL - Offers sequential data transfer for efficient operation.

Terminal Form:

GULL WING - Allows for secure and reliable soldering connections.

No. of Words:

33554432 words - Provides ample storage capacity for data processing.

Terminal Pitch:

1.27 mm - Standardized spacing for easy and accurate connection.

No. of Words Code:

32M - Indicates high memory capacity for storing large amounts of data.

Maximum Supply Voltage (Vsup):

3.6 V - Supports higher voltage levels for enhanced performance.

Memory Density:

33554432 bit - High memory density for storing a large volume of data.

Memory IC Type:

FLASH - Reliable and fast data storage technology.

Technical Specifications

Flash Memory IS25LQ032B-JBLE-TR attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

Maximum Clock Frequency (fCLK):

104 MHz

JESD-30 Code:

S-PDSO-G8

Length:

5.28 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

2.7

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.28 mm

Trade Compliance

IS25LQ032B-JBLE-TR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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