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72V2111L10PF9

Integrated Device Technology

72V2111L10PF9 by Integrated Device Technology

72V2111L10PF9 by Integrated Device Technology is a FIFO with 512Kx9 organization, operating at 3.3V. It features a cycle time of 10ns, synchronous mode, and parallel interface. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,212 parts In-Stock

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1,212

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Nova Conductors

Japan . 700 parts In-Stock

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700

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VNN

France . 300 parts In-Stock

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300

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Distributors (Availability)

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AZTECH Wire

Italy . 223 parts In-Stock

1+ parts

$6.137

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223

$6.137

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Ampacity Inc.

Singapore . 285 parts In-Stock

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$28.000

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Discover the 72V2111L10PF9 by Integrated Device Technology, a high-quality FIFO memory chip designed to meet your unique needs. With a focus on innovation and reliability, IDT is a trusted manufacturer known for producing top-of-the-line components. This versatile product is perfect for a wide range of applications, offering fast cycle times and a synchronous operating mode. Experience the value and benefits that this product brings to your projects, with advantages like low profile packaging and efficient data storage. Upgrade your systems with the 72V2111L10PF9 and unlock new possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable makes this product easy to install and reduces the need for additional hardware, saving time and effort during assembly.

Cycle Time: 10 ns

The quick cycle time ensures fast data processing and efficient operation, making it suitable for high-speed applications.

Package Shape: SQUARE

The square shape allows for efficient use of space on a circuit board, making it ideal for compact designs.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise and coordinated data transfers, making it a dependable choice for synchronized systems.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is within the standard range for many electronic devices, ensuring compatibility with a wide range of systems.

No. of Terminals: 64

With 64 terminals, this product can accommodate multiple connections, enhancing versatility and compatibility with various configurations.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile style saves space and allows for efficient heat dissipation, making it suitable for compact and heat-sensitive applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance ensures reliability and stability even in elevated temperature environments.

Organization: 512KX9

The organization of 512KX9 offers a balance between capacity and speed, making it suitable for a wide range of memory storage and retrieval applications.

Technical Specifications

FIFO 72V2111L10PF9 attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

6.5 ns

Additional Features:

RETRANSMIT; AUTO POWER DOWN

Cycle Time:

10 ns

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e0

Length:

14 mm

Memory Density:

4718592 bit

Memory Width:

9

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX9

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

72V2111L10PF9 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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