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IPP055N03LGXKSA1

Infineon Technologies

IPP055N03LGXKSA1 by Infineon Technologies

IPP055N03LGXKSA1 by Infineon is a N-CHANNEL FET with 30V DS Breakdown Voltage, 0.0078 ohm Drain-Source On Resistance, and 50A Max Drain Current. Ideal for SWITCHING applications due to its 350A Pulsed Drain Current, ENHANCEMENT MODE operation, and built-in DIODE. Suitable for various industries requiring high-power performance in a FLANGE MOUNT package.

Median Price

$0.705

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 369 parts In-Stock

1+ parts

$1.270

100+ parts

$0.788

1k+ parts

$0.530

10k+ parts

$0.527

369

$1.270

$0.788

$0.530

$0.527

Farnell

UK . 57 parts In-Stock

1+ parts

$1.590

100+ parts

-

1k+ parts

-

10k+ parts

-

57

$1.590

-

-

-

Element14

Singapore . 621 parts In-Stock

1+ parts

$98.930

100+ parts

$62.990

1k+ parts

$40.910

10k+ parts

$39.000

621

$98.930

$62.990

$40.910

$39.000

Future Electronics

Canada . 2,050 parts In-Stock

1+ parts

-

100+ parts

$0.705

1k+ parts

-

10k+ parts

$0.650

2,050

-

$0.705

-

$0.650

Rochester

USA . 1,537 parts In-Stock

1+ parts

-

100+ parts

$0.604

1k+ parts

$0.501

10k+ parts

$0.447

1,537

-

$0.604

$0.501

$0.447

Verical

USA . 772 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.626

10k+ parts

$0.558

772

-

-

$0.626

$0.558

Chip1Stop

Japan . 165 parts In-Stock

1+ parts

-

100+ parts

$0.669

1k+ parts

-

10k+ parts

-

165

-

$0.669

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 797 parts In-Stock

1+ parts

$0.470

100+ parts

-

1k+ parts

-

10k+ parts

-

797

$0.470

-

-

-

TME

Poland . 20 parts In-Stock

1+ parts

$1.990

100+ parts

$0.710

1k+ parts

-

10k+ parts

-

20

$1.990

$0.710

-

-

Vyrian

USA . 2,266 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,266

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 658 parts In-Stock

1+ parts

$0.446

100+ parts

-

1k+ parts

-

10k+ parts

-

658

$0.446

-

-

-

Component Stockers USA

USA . 10,715 parts In-Stock

1+ parts

$0.500

100+ parts

$0.370

1k+ parts

$0.420

10k+ parts

-

10,715

$0.500

$0.370

$0.420

-

Continental Prestige Electronics

USA . 337 parts In-Stock

1+ parts

$1.130

100+ parts

$0.697

1k+ parts

$0.423

10k+ parts

-

337

$1.130

$0.697

$0.423

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Modulus Dynamics

Lithuania . 14,450 parts In-Stock

1+ parts

$1.628

100+ parts

$1.563

1k+ parts

$1.498

10k+ parts

-

14,450

$1.628

$1.563

$1.498

-

Microchip USA

USA . 2,080 parts In-Stock

1+ parts

$8.385

100+ parts

-

1k+ parts

-

10k+ parts

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2,080

$8.385

-

-

-

Perfect Parts

USA . 2,083 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

-

2,083

-

-

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-

Overview

Unleash the power of innovation with the IPP055N03LGXKSA1 by Infineon Technologies. As a leader in Power Field Effect Transistors, Infineon delivers unrivaled quality and reliability in every product. Designed for switching applications, this N-CHANNEL FET offers a maximum drain current of 50A and a low on-resistance of 0.0078 ohm, ensuring optimal performance in a variety of scenarios. Whether you're looking to enhance efficiency or maximize power output, the IPP055N03LGXKSA1 provides the value, benefits, and advantages you need to stay ahead of the competition. Elevate your projects with the cutting-edge technology of Infineon today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and lower resistance compared to P-channel FETs, making them more efficient for switching applications.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this FET can handle higher voltages without risking damage, increasing its versatility for various applications.

Maximum Pulsed Drain Current (IDM): 350 A

Capable of handling high current loads for short durations, making it suitable for power switching applications that require brief bursts of current.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making it a preferred choice for power FET applications.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without compromising performance, ensuring stability under challenging conditions.

Technical Specifications

Power Field Effect Transistors (FET) IPP055N03LGXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

60 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

50 A

Maximum Drain-Source On Resistance:

.0078 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

350 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP055N03LGXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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