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IPB80N08S207ATMA1

Infineon Technologies

IPB80N08S207ATMA1 by Infineon Technologies

IPB80N08S207ATMA1 by Infineon Technologies is a N-CHANNEL FET with 75V DS Breakdown Voltage and 320A IDM. It is used in power applications due to its 0.0071 ohm Drain-Source On Resistance, making it suitable for high current loads. The device features a built-in diode and operates in Enhancement Mode, ideal for efficient power management systems.

Median Price

$4.000

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 100 parts In-Stock

1+ parts

$4.720

100+ parts

$3.210

1k+ parts

$2.440

10k+ parts

$2.290

100

$4.720

$3.210

$2.440

$2.290

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$6.300

100+ parts

-

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1,000

$6.300

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DigiKey

USA . 957 parts In-Stock

1+ parts

$6.320

100+ parts

$3.036

1k+ parts

$2.206

10k+ parts

-

957

$6.320

$3.036

$2.206

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Verical

USA . 14,000 parts In-Stock

1+ parts

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$2.646

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$2.646

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Rochester

USA . 1,134 parts In-Stock

1+ parts

-

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$2.190

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$1.960

10k+ parts

$1.850

1,134

-

$2.190

$1.960

$1.850

Farnell

UK . 54 parts In-Stock

1+ parts

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100+ parts

$2.380

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$2.100

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54

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$2.380

$2.100

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Element14

Singapore . 54 parts In-Stock

1+ parts

-

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$4.000

1k+ parts

$3.540

10k+ parts

-

54

-

$4.000

$3.540

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 293 parts In-Stock

1+ parts

$2.328

100+ parts

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293

$2.328

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Rotakorn

Sweden . 13,000 parts In-Stock

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Vyrian

USA . 3,350 parts In-Stock

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Nova Conductors

Japan . 48 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,308 parts In-Stock

1+ parts

$2.080

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2,308

$2.080

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Corphita

USA . 347 parts In-Stock

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$2.205

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347

$2.205

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Modulus Dynamics

Lithuania . 25,995 parts In-Stock

1+ parts

$3.436

100+ parts

$3.299

1k+ parts

$3.161

10k+ parts

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25,995

$3.436

$3.299

$3.161

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Microchip USA

USA . 9,868 parts In-Stock

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$17.666

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9,868

$17.666

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Continental Prestige Electronics

USA . 818 parts In-Stock

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$3.150

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$2.260

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$3.150

$2.260

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Netroflash

USA . 50 parts In-Stock

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Perfect Parts

USA . 10 parts In-Stock

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10

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Overview

Elevate your power management solutions with the IPB80N08S207ATMA1 by Infineon Technologies, a top-tier manufacturer known for delivering high-quality Power Field Effect Transistors. This N-CHANNEL FET boasts a single configuration with a built-in diode, making it ideal for a wide range of applications. With a maximum drain current of 80 A and low on-resistance, this transistor offers exceptional value and efficiency to customers in need of reliable power control. Trust Infineon Technologies to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility and are commonly used in high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can protect against reverse voltage spikes.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Minimum DS Breakdown Voltage: 75 V

This high breakdown voltage allows for reliable operation in high-power applications.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to mount and integrate into existing circuit designs.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections during PCB assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are easier to control and typically have lower on-resistance.

Maximum Pulsed Drain Current (IDM): 320 A

High pulsed drain current allows for handling transient loads and surges.

Avalanche Energy Rating (EAS): 810 mJ

High avalanche energy rating indicates the transistor's ability to withstand high voltage spikes.

No. of Terminals: 2

Simple two-terminal design simplifies circuit connections.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for higher component density.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and performance in power applications.

Transistor Element Material: SILICON

Silicon material provides good thermal and electrical properties for efficient operation.

Terminal Finish: TIN

Tin finish on terminals provides corrosion resistance and ensures good solderability.

Maximum Drain Current (ID): 80 A

High maximum drain current rating allows for handling high power loads.

Maximum Drain-Source On Resistance: 0.0071 ohm

Low on-resistance ensures efficient power transfer and minimal heat dissipation.

Terminal Position: SINGLE

Single terminal position simplifies circuit connections and ensures proper orientation.

Case Connection: DRAIN

Drain connection for efficient power flow and handling of high current levels.

Technical Specifications

Power Field Effect Transistors (FET) IPB80N08S207ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

810 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

75 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0071 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPB80N08S207ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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