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IPB180N04S4L01ATMA1

Infineon Technologies

IPB180N04S4L01ATMA1 by Infineon Technologies

Infineon's IPB180N04S4L01ATMA1 is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 180A ID. Ideal for automotive applications, it features a built-in diode, 720A IDM, and 0.0012 ohm RDS(on) in a small outline package.

Median Price

$2.108

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,875 parts In-Stock

1+ parts

-

100+ parts

$1.990

1k+ parts

$1.780

10k+ parts

$1.670

15,875

-

$1.990

$1.780

$1.670

Verical

USA . 7,924 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.225

10k+ parts

$2.087

7,924

-

-

$2.225

$2.087

EBV Elektronik

Germany . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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5,000

-

-

-

-

Distributors (In-Stock)

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Digiode

USA . 948 parts In-Stock

1+ parts

$2.100

100+ parts

-

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948

$2.100

-

-

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Vyrian

USA . 5,959 parts In-Stock

1+ parts

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100+ parts

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5,959

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TME

Poland . 5,000 parts In-Stock

1+ parts

-

100+ parts

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$2.500

10k+ parts

-

5,000

-

-

$2.500

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Nova Conductors

Japan . 43 parts In-Stock

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43

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Distributors (Availability)

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Ampacity Inc.

Singapore . 9,425 parts In-Stock

1+ parts

$1.880

100+ parts

-

1k+ parts

-

10k+ parts

-

9,425

$1.880

-

-

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Modulus Dynamics

Lithuania . 13,833 parts In-Stock

1+ parts

$1.979

100+ parts

$1.900

1k+ parts

$1.821

10k+ parts

-

13,833

$1.979

$1.900

$1.821

-

Corphita

USA . 996 parts In-Stock

1+ parts

$1.989

100+ parts

-

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996

$1.989

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Microchip USA

USA . 8,275 parts In-Stock

1+ parts

$12.744

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8,275

$12.744

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AZTECH Wire

Italy . 674 parts In-Stock

1+ parts

$13.750

100+ parts

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674

$13.750

-

-

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Eastek

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.093

10k+ parts

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8,000

-

-

$3.093

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Netroflash

USA . 500 parts In-Stock

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500

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Overview

Unleash the power of cutting-edge technology with the IPB180N04S4L01ATMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon is known for its high-quality products that deliver unmatched performance. This Power Field Effect Transistor (FET) is designed to provide efficient power management solutions for a variety of applications. With a focus on reliability and innovation, this N-CHANNEL FET offers customers the value and benefits they need to stay ahead in their projects. Experience the advantages of enhanced mode operation, built-in diode, and low on-resistance. Upgrade your designs with the IPB180N04S4L01ATMA1 and discover a new level of efficiency and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides protection and durability to the transistor, making it ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower on-resistance and higher conductivity, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the circuit from voltage spikes and reverse current flow.

Surface Mount: YES

Surface mount capability allows for easier and space-efficient PCB mounting.

Minimum DS Breakdown Voltage: 40 V

Higher breakdown voltage ensures reliability and protection against high voltage spikes.

Maximum Pulsed Drain Current (IDM): 720 A

High pulsed drain current capability makes it suitable for applications requiring high power handling.

Avalanche Energy Rating (EAS): 550 mJ

High avalanche energy rating allows the transistor to withstand high energy spikes without damage.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency, fast switching speeds, and low power consumption.

Maximum Drain Current (ID): 180 A

High drain current rating allows for handling large current loads efficiently.

Maximum Drain-Source On Resistance: 0.0012 ohm

Low on-resistance results in lower power dissipation and improved efficiency.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures high quality and reliability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) IPB180N04S4L01ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

550 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

180 A

Maximum Drain-Source On Resistance:

.0012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

720 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPB180N04S4L01ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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