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IPB065N10N3GATMA1

Infineon Technologies

IPB065N10N3GATMA1 by Infineon Technologies

IPB065N10N3GATMA1 by Infineon is a N-CHANNEL FET with 100V DS Breakdown Voltage, 0.0065 ohm RDS(on), and 80A ID. It is used for SWITCHING applications in ENHANCEMENT MODE, featuring a built-in DIODE and GULL WING terminals for surface mount assembly.

Median Price

$1.387

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 230 parts In-Stock

1+ parts

$2.809

100+ parts

$2.097

1k+ parts

$1.514

10k+ parts

-

230

$2.809

$2.097

$1.514

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Rochester

USA . 21,056 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.040

21,056

-

$1.240

$1.110

$1.040

Verical

USA . 12,507 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.387

10k+ parts

$1.300

12,507

-

-

$1.387

$1.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 988 parts In-Stock

1+ parts

$1.302

100+ parts

-

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988

$1.302

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Vyrian

USA . 3,270 parts In-Stock

1+ parts

-

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3,270

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 77 parts In-Stock

1+ parts

$1.160

100+ parts

-

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77

$1.160

-

-

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Corphita

USA . 277 parts In-Stock

1+ parts

$1.233

100+ parts

-

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277

$1.233

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Modulus Dynamics

Lithuania . 2,113 parts In-Stock

1+ parts

$1.623

100+ parts

$1.558

1k+ parts

$1.493

10k+ parts

-

2,113

$1.623

$1.558

$1.493

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Corohmni

South Africa . 207 parts In-Stock

1+ parts

$1.940

100+ parts

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207

$1.940

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AZTECH Wire

Italy . 1,044 parts In-Stock

1+ parts

$21.150

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1,044

$21.150

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QUARKTWIN TECHNOLOGY LTD

USA . 29,788 parts In-Stock

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29,788

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Argo Parts USA

USA . 2,314 parts In-Stock

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2,314

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Continental Prestige Electronics

USA . 1,150 parts In-Stock

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1,150

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Unlock the power of efficiency with the IPB065N10N3GATMA1 by Infineon Technologies. This high-quality Power FET offers unparalleled performance and reliability for switching applications. Infineon, a trusted manufacturer in the industry, ensures that this N-CHANNEL transistor with built-in diode delivers outstanding value to customers. With a maximum pulsed drain current of 320A and a low on-resistance of 0.0065 ohm, this FET is designed to optimize energy consumption and enhance system performance. Say goodbye to inefficiency and hello to seamless operation with the IPB065N10N3GATMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the transistor, ensuring a longer lifespan.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easier circuit design and protection against reverse currents.

Transistor Application: SWITCHING

Designed specifically for switching applications, making it ideal for use in power control circuits.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this transistor can handle high voltage loads without failure.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides efficient power control and optimization.

Maximum Pulsed Drain Current (IDM): 320 A

High pulsed drain current capability allows for handling sudden spikes in current without damage.

Avalanche Energy Rating (EAS): 160 mJ

High avalanche energy rating ensures stability and protection against voltage spikes.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance and reliability.

Maximum Drain Current (ID): 80 A

High drain current capacity allows for handling of high current loads.

Maximum Drain-Source On Resistance: 0.0065 ohm

Low on-resistance minimizes power loss and heat generation during operation.

Technical Specifications

Power Field Effect Transistors (FET) IPB065N10N3GATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

160 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

320 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB065N10N3GATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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