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IPB042N10N3GE8187ATMA1

Infineon Technologies

IPB042N10N3GE8187ATMA1 by Infineon Technologies

Infineon's IPB042N10N3GE8187ATMA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.0042 ohm RDS(on), and 400A IDM. Ideal for switching applications, it operates in enhancement mode with a max temp of 175°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,487 parts In-Stock

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Digiode

USA . 378 parts In-Stock

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378

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Nova Conductors

Japan . 33 parts In-Stock

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Aztec Data Supply Inc.

USA . 117 parts In-Stock

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$0.410

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117

$0.410

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$0.716

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$0.708

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$0.680

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$0.716

$0.708

$0.680

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Modulus Dynamics

Lithuania . 2,219 parts In-Stock

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$0.921

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$0.884

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$0.847

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$0.921

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Corohmni

South Africa . 76 parts In-Stock

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$1.507

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Semicontronic

India . 485 parts In-Stock

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$2.050

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$1.999

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$1.988

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485

$2.050

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Ampacity Inc.

Singapore . 1,125 parts In-Stock

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$17.050

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$17.050

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AZTECH Wire

Italy . 501 parts In-Stock

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$17.725

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Continental Prestige Electronics

USA . 6,182 parts In-Stock

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Microchip USA

USA . 3,487 parts In-Stock

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Argo Parts USA

USA . 2,958 parts In-Stock

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Corphita

USA . 431 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock the power of innovation with the IPB042N10N3GE8187ATMA1 by Infineon Technologies. As a leading manufacturer in the field of Power Field Effect Transistors, Infineon delivers top-quality products that excel in applications like switching. With a maximum drain current of 100A and a low on-resistance of 0.0042 ohms, this N-Channel transistor offers unparalleled performance and reliability. Experience the benefits of enhanced efficiency and improved functionality with this state-of-the-art solution. Elevate your projects to new heights with the IPB042N10N3GE8187ATMA1 from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making the transistor resistant to physical damage.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching and control of power flow in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode, reducing the need for additional components.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Surface Mount: YES

Enables easy and compact installation on circuit boards, saving space and enhancing assembly efficiency.

Maximum Pulsed Drain Current (IDM): 400 A

Capable of handling high peak currents, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 340 mJ

Provides protection against high-energy transients, enhancing the overall robustness of the transistor.

Maximum Operating Temperature: 175 °C

Can operate effectively in high-temperature environments, increasing its versatility and reliability.

Maximum Drain Current (ID): 100 A

Can sustain high continuous currents, making it suitable for power-related applications.

Maximum Drain-Source On Resistance: 0.0042 ohm

Has low on-resistance, minimizing power loss and improving efficiency in power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) IPB042N10N3GE8187ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

340 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0042 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB042N10N3GE8187ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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