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IKY40N120CH3XKSA1

Infineon Technologies

IKY40N120CH3XKSA1 by Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Collector Current (IC): 80 A; JEDEC-95 Code: TO-247; Nominal Turn Off Time (toff): 439 ns;

Median Price

$6.342

Lifecycle Status

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10

In-Stock Inventory

1k+

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Chip1Stop

Japan . 236 parts In-Stock

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$4.590

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236

$4.590

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Farnell

UK . 238 parts In-Stock

1+ parts

$5.050

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$3.330

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238

$5.050

$3.330

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Arrow

USA . 150 parts In-Stock

1+ parts

$7.635

100+ parts

$5.073

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-

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150

$7.635

$5.073

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DigiKey

USA . 184 parts In-Stock

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$8.980

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$5.262

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$3.992

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184

$8.980

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$3.992

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Mouser Electronics

USA . 135 parts In-Stock

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$8.980

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$4.560

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135

$8.980

$4.560

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Newark

USA . 198 parts In-Stock

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$9.250

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$5.350

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$5.330

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198

$9.250

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$5.330

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Rochester

USA . 7,120 parts In-Stock

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-

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$3.990

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$3.570

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$3.360

7,120

-

$3.990

$3.570

$3.360

Verical

USA . 4,240 parts In-Stock

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-

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$4.987

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$4.463

10k+ parts

$4.200

4,240

-

$4.987

$4.463

$4.200

Distributors (In-Stock)

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Digiode

USA . 694 parts In-Stock

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$4.588

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694

$4.588

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Vyrian

USA . 6,382 parts In-Stock

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6,382

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Modulus Dynamics

Lithuania . 5,117 parts In-Stock

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$1.957

100+ parts

$1.879

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$1.800

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-

5,117

$1.957

$1.879

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$2.021

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$1.839

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$1.657

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500

$2.021

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Corphita

USA . 285 parts In-Stock

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$4.347

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$4.347

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Andel Nordic

Denmark . 414 parts In-Stock

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$20.690

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$14.481

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$14.481

414

$20.690

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$14.481

$14.481

QUARKTWIN TECHNOLOGY LTD

USA . 28,111 parts In-Stock

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Microchip USA

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4,431

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 538 parts In-Stock

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538

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Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKY40N120CH3XKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

439 ns

Nominal Turn On Time (ton):

61 ns

Trade Compliance

IKY40N120CH3XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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