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IKW40N65F5AXKSA1

Infineon Technologies

IKW40N65F5AXKSA1 by Infineon Technologies

IKW40N65F5AXKSA1 by Infineon Technologies is an N-CHANNEL IGBT with 650V VCE, 74A IC, and 30ns ton. It is used for POWER CONTROL applications due to its SINGLE configuration with BUILT-IN DIODE and AEC-Q101 reference standard compliance.

Median Price

$5.060

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$5.060

100+ parts

-

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150

$5.060

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Vyrian

USA . 6,191 parts In-Stock

1+ parts

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6,191

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Digiode

USA . 218 parts In-Stock

1+ parts

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218

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 17,971 parts In-Stock

1+ parts

$0.645

100+ parts

$0.619

1k+ parts

$0.593

10k+ parts

-

17,971

$0.645

$0.619

$0.593

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AZTECH Wire

Italy . 627 parts In-Stock

1+ parts

$8.044

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627

$8.044

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Ampacity Inc.

Singapore . 1,248 parts In-Stock

1+ parts

$63.050

100+ parts

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1,248

$63.050

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Corphita

USA . 546 parts In-Stock

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546

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Overview

Unleash the power of Infineon Technologies with the IKW40N65F5AXKSA1 Insulated Gate Bipolar Transistor. Designed for high-performance power control applications, this N-CHANNEL transistor offers a built-in diode for added convenience. With a maximum collector-emitter voltage of 650V and a nominal turn off time of just 200ns, this IGBT ensures efficient operation and reliable performance. Trust Infineon's reputation for quality and innovation to deliver the value and benefits you need for your next project. Experience the difference with the IKW40N65F5AXKSA1.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the internal components, making this IGBT suitable for various applications.

Polarity or Channel Type:

N-CHANNEL - Offers efficient power control capabilities, making it ideal for applications requiring high performance.

Configuration:

SINGLE WITH BUILT-IN DIODE - Simplifies circuit design and saves space, making this IGBT a cost-effective solution for power control applications.

Transistor Application:

POWER CONTROL - Designed specifically for power control applications, ensuring reliable and efficient performance.

Package Shape:

RECTANGULAR - Allows for easy installation and integration into electronic systems, making this IGBT versatile and user-friendly.

Terminal Form:

THROUGH-HOLE - Ensures secure and stable connections, providing reliable performance in various operating conditions.

Nominal Turn Off Time (toff):

200 ns - Offers fast switching speeds, improving overall efficiency and performance in power control applications.

No. of Terminals:

3 - Provides multiple connection points for flexible circuit design, enhancing the versatility of this IGBT.

Package Style (Meter):

FLANGE MOUNT - Allows for easy mounting and installation in various systems, making this IGBT a convenient choice for users.

Maximum Collector-Emitter Voltage:

650 V - Provides a high voltage rating for reliable operation in demanding applications, ensuring safety and performance.

Transistor Element Material:

SILICON - Offers high reliability and durability, ensuring long-lasting performance in power control applications.

Maximum Collector Current (IC):

74 A - Provides a high current rating for handling power loads, making this IGBT suitable for high-power applications.

Terminal Position:

SINGLE - Simplifies connection and installation processes, ensuring ease of use for users.

Case Connection:

COLLECTOR - Allows for efficient heat dissipation, enhancing the overall performance and longevity of this IGBT.

Nominal Turn On Time (ton):

30 ns - Offers fast turn-on speeds, improving response times and efficiency in power control applications.

Reference Standard:

AEC-Q101 - Complies with industry standards for quality and reliability, ensuring the performance and safety of this IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW40N65F5AXKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

200 ns

Nominal Turn On Time (ton):

30 ns

Trade Compliance

IKW40N65F5AXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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