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IKQ40N120CH3XKSA1

Infineon Technologies

IKQ40N120CH3XKSA1 by Infineon Technologies

IKQ40N120CH3XKSA1 by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V and a max collector current of 80A. It is designed for power control applications and has a nominal turn-off time of 444ns.

Median Price

$8.070

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 228 parts In-Stock

1+ parts

$8.310

100+ parts

$4.520

1k+ parts

-

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228

$8.310

$4.520

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-

DigiKey

USA . 145 parts In-Stock

1+ parts

$9.070

100+ parts

$5.323

1k+ parts

$4.047

10k+ parts

-

145

$9.070

$5.323

$4.047

-

Mouser Electronics

USA . 199 parts In-Stock

1+ parts

$9.450

100+ parts

$5.550

1k+ parts

$4.950

10k+ parts

$4.630

199

$9.450

$5.550

$4.950

$4.630

Rochester

USA . 3,130 parts In-Stock

1+ parts

-

100+ parts

$4.050

1k+ parts

$3.620

10k+ parts

$3.410

3,130

-

$4.050

$3.620

$3.410

Verical

USA . 2,380 parts In-Stock

1+ parts

-

100+ parts

$5.063

1k+ parts

$4.525

10k+ parts

$4.263

2,380

-

$5.063

$4.525

$4.263

Future Electronics

Canada . 240 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.630

10k+ parts

$3.590

240

-

-

$3.630

$3.590

RS (Exports)

UK . 234 parts In-Stock

1+ parts

-

100+ parts

$8.070

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234

-

$8.070

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 456 parts In-Stock

1+ parts

$4.114

100+ parts

-

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456

$4.114

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$8.130

100+ parts

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870

$8.130

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Chip Stock

USA . 11,100 parts In-Stock

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11,100

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Vyrian

USA . 5,261 parts In-Stock

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5,261

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IBS Electronics

USA . 240 parts In-Stock

1+ parts

-

100+ parts

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$4.719

10k+ parts

$4.667

240

-

-

$4.719

$4.667

Distributors (Availability)

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Ampacity Inc.

Singapore . 770 parts In-Stock

1+ parts

$3.680

100+ parts

-

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770

$3.680

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Corphita

USA . 578 parts In-Stock

1+ parts

$3.897

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578

$3.897

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Component Stockers USA

USA . 1,462 parts In-Stock

1+ parts

$6.210

100+ parts

$5.260

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1,462

$6.210

$5.260

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Modulus Dynamics

Lithuania . 14,653 parts In-Stock

1+ parts

$6.730

100+ parts

$6.461

1k+ parts

$6.192

10k+ parts

-

14,653

$6.730

$6.461

$6.192

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Continental Prestige Electronics

USA . 480 parts In-Stock

1+ parts

$7.400

100+ parts

$5.140

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480

$7.400

$5.140

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Netroflash

USA . 50 parts In-Stock

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$8.130

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50

$8.130

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Microchip USA

USA . 6,374 parts In-Stock

1+ parts

$35.644

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6,374

$35.644

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GreenTree Electronics

Israel . 2,340 parts In-Stock

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2,340

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 806 parts In-Stock

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Overview

Experience superior power control with the IKQ40N120CH3XKSA1 by Infineon Technologies. As a leader in the industry, Infineon Technologies delivers top-quality products that are designed to meet your specific needs. The IKQ40N120CH3XKSA1 is an insulated gate bipolar transistor (IGBT) with a single built-in diode, offering you unparalleled performance and reliability. Whether you're looking for power control in industrial applications or renewable energy systems, this IGBT is the perfect choice. With its maximum collector-emitter voltage of 1200V and maximum collector current of 80A, you can trust that this product will provide you with the power you need. Upgrade your power control capabilities today with the IKQ40N120CH3XKSA1 from Infineon Technologies.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides good insulation and protection for the internal components of the IGBT, making it durable and reliable for various applications.

Channel Type:

N-CHANNEL - The N-channel configuration allows for efficient current conduction and low power losses, making it ideal for high-performance power control applications.

Configuration:

SINGLE WITH BUILT-IN DIODE - The built-in diode simplifies circuit design and improves efficiency by allowing for integrated freewheeling and reverse voltage protection.

Transistor Application:

POWER CONTROL - This IGBT is specifically designed for power control applications, providing precise and reliable control over high-power loads.

Package Shape:

RECTANGULAR - The rectangular package shape enables easy mounting and integration into electronic systems, enhancing the versatility and convenience of using this IGBT.

Terminal Form:

THROUGH-HOLE - The through-hole terminal form ensures secure and reliable connections, making it suitable for applications where mechanical stress may be encountered.

No. of Elements:

1 - With a single element, this IGBT simplifies circuit design and reduces complexity, ensuring ease of use and reliability.

Nominal Turn Off Time (toff):

444 ns - The quick turn-off time allows for rapid switching and reduces power dissipation, enabling efficient operation and minimizing heat generation.

No. of Terminals:

3 - With three terminals, this IGBT offers convenient connections, ensuring easy integration and flexibility in different circuit configurations.

Package Style (Meter):

FLANGE MOUNT - The flange mount package style provides a secure and stable mounting solution, suitable for applications where mechanical stability is crucial.

Maximum Collector-Emitter Voltage:

1200 V - With a high maximum voltage rating, this IGBT can tolerate high voltage levels, making it suitable for power control applications where voltage spikes or surges may occur.

Transistor Element Material:

SILICON - The use of silicon as the transistor element material ensures high performance, reliability, and compatibility with a wide range of electronic systems.

Minimum Operating Temperature:

40 °C - With a low minimum operating temperature, this IGBT can withstand extreme cold conditions, expanding its usability in diverse environments.

Maximum Collector Current (IC):

80 A - This IGBT is capable of handling high collector currents, making it well-suited for applications that require power control over large loads.

Terminal Finish:

TIN - The tin terminal finish provides good conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections and longevity of the IGBT.

Terminal Position:

SINGLE - The single terminal position simplifies installation and facilitates quick and accurate connections, enhancing the ease of use and reliability of this IGBT.

Nominal Turn On Time (ton):

76 ns - The fast turn-on time allows for rapid switching and precise control, improving the overall efficiency and performance of power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKQ40N120CH3XKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

444 ns

Nominal Turn On Time (ton):

76 ns

Trade Compliance

IKQ40N120CH3XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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