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IHW40N120R5XKSA1

Infineon Technologies

IHW40N120R5XKSA1 by Infineon Technologies

IHW40N120R5XKSA1 by Infineon Technologies is an N-Channel IGBT with VCEsat of 1.85V, toff of 440ns, and Pmax of 394W. It operates at temperatures up to 175°C, has a VCE max of 1200V, and IC max of 80A. Ideal for high-power applications requiring fast switching capabilities.

Median Price

$4.080

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 645 parts In-Stock

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$4.060

100+ parts

$2.220

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645

$4.060

$2.220

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Mouser Electronics

USA . 2,419 parts In-Stock

1+ parts

$4.070

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$1.840

1k+ parts

$1.590

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2,419

$4.070

$1.840

$1.590

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Farnell

UK . 231 parts In-Stock

1+ parts

$4.080

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$1.840

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$1.530

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231

$4.080

$1.840

$1.530

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DigiKey

USA . 5,369 parts In-Stock

1+ parts

$4.740

100+ parts

$2.637

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$1.835

10k+ parts

$1.701

5,369

$4.740

$2.637

$1.835

$1.701

Arrow

USA . 448 parts In-Stock

1+ parts

$4.747

100+ parts

$2.288

1k+ parts

$1.967

10k+ parts

$1.881

448

$4.747

$2.288

$1.967

$1.881

Newark

USA . 63 parts In-Stock

1+ parts

$4.770

100+ parts

$2.540

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$2.250

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63

$4.770

$2.540

$2.250

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Element14

Singapore . 231 parts In-Stock

1+ parts

$5.890

100+ parts

$2.310

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$2.100

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231

$5.890

$2.310

$2.100

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RS (Exports)

UK . 2,404 parts In-Stock

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$3.211

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$3.076

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$3.076

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Verical

USA . 540 parts In-Stock

1+ parts

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$1.724

1k+ parts

$1.472

10k+ parts

$1.425

540

-

$1.724

$1.472

$1.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 209 parts In-Stock

1+ parts

$2.059

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-

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209

$2.059

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Digiode

USA . 513 parts In-Stock

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$2.422

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513

$2.422

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Cyclops Electronics Ltd

UK . 1,385 parts In-Stock

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1,385

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ComSIT Distribution GmbH

Germany . 180 parts In-Stock

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IBS Electronics

USA . 97 parts In-Stock

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100+ parts

$2.258

1k+ parts

$4.264

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97

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$2.258

$4.264

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Rutronik

Germany . 60 parts In-Stock

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Nova Conductors

Japan . 37 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 78 parts In-Stock

1+ parts

$0.802

100+ parts

$0.770

1k+ parts

$0.738

10k+ parts

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78

$0.802

$0.770

$0.738

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Ampacity Inc.

Singapore . 857 parts In-Stock

1+ parts

$1.750

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857

$1.750

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Corphita

USA . 809 parts In-Stock

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$2.295

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809

$2.295

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Continental Prestige Electronics

USA . 200 parts In-Stock

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$4.450

100+ parts

$2.790

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$2.550

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200

$4.450

$2.790

$2.550

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Microchip USA

USA . 3,110 parts In-Stock

1+ parts

$15.430

100+ parts

$15.210

1k+ parts

$15.100

10k+ parts

$14.990

3,110

$15.430

$15.210

$15.100

$14.990

QUARKTWIN TECHNOLOGY LTD

USA . 28,793 parts In-Stock

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GreenTree Electronics

Israel . 24,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Perfect Parts

USA . 1,776 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Futuretech Components

Singapore . 500 parts In-Stock

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Eastek

USA . 4 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the IHW40N120R5XKSA1 by Infineon Technologies. As a trusted leader in the industry, Infineon delivers top-notch quality and reliability. This Insulated Gate Bipolar Transistor (IGBT) offers exceptional performance in a variety of applications. With its N-Channel design and high power dissipation capability, this transistor provides unmatched efficiency and durability. Experience the benefits of Infineon's cutting-edge technology, from its fast turn-off time to its superior thermal management. Upgrade your devices with the IHW40N120R5XKSA1 and take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-Channel

N-Channel IGBTs are commonly used in high power applications due to their efficiency and reliability.

Maximum VCEsat: 1.85 V

Low VCEsat ensures minimal power dissipation and heat generation, leading to higher efficiency.

Nominal Turn Off Time (toff): 440 ns

Fast turn-off time enhances the switching speed of the transistor, making it suitable for high frequency applications.

Maximum Power Dissipation (Abs): 394 W

High power dissipation capability allows the transistor to handle large amounts of power without overheating.

Maximum Operating Temperature: 175 °C

Wide operating temperature range ensures the IGBT can perform reliably in various environmental conditions.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating allows the transistor to be used in high voltage circuits.

Transistor Element Material: SILICON

Silicon-based IGBTs are known for their high efficiency, reliability, and temperature stability.

Maximum Gate-Emitter Voltage: 20 V

Wide gate-emitter voltage rating provides flexibility in driving the IGBT and helps prevent damage from overvoltage.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the IGBT can operate in cold environments without performance issues.

Maximum Collector Current (IC): 80 A

High collector current rating allows the IGBT to handle large current loads without overheating.

Maximum Gate-Emitter Threshold Voltage: 6.4 V

Low gate-emitter threshold voltage ensures the IGBT can be easily turned on and off, improving efficiency and speed.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IHW40N120R5XKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Terminal Finish:

TIN

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

440 ns

Maximum VCEsat:

1.85 V

Trade Compliance

IHW40N120R5XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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