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FF150R12KS4

Infineon Technologies

FF150R12KS4 by Infineon Technologies

FF150R12KS4 by Infineon Technologies is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements, featuring a Max VCEsat of 3.7V and Max IC of 225A. Ideal for high-power applications requiring fast switching such as industrial motor drives and renewable energy systems due to its low turn-off time of 590ns and high power dissipation capability of 1200W.

Median Price

$130.052

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 8 parts In-Stock

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$139.830

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RS (Exports)

UK . 8 parts In-Stock

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$120.275

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$120.275

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Digiode

USA . 42 parts In-Stock

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$120.412

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Forefront Electronics and Design

USA . 3 parts In-Stock

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$147.000

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USA . 3,500 parts In-Stock

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Rutronik

Germany . 190 parts In-Stock

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$116.660

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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Q Components

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Modulus Dynamics

Lithuania . 23,136 parts In-Stock

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$0.855

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$0.821

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$0.787

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AZTECH Wire

Italy . 460 parts In-Stock

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$11.484

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Andel Nordic

Denmark . 5,443 parts In-Stock

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$19.280

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$13.495

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Corphita

USA . 481 parts In-Stock

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$114.075

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A-Z Elektronik GmbH

Germany . 830 parts In-Stock

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830

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Perfect Parts

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Bastille Electronics

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Authorized Procurement Solutions

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Overview

Elevate your power management with the FF150R12KS4 from Infineon Technologies, a leading manufacturer in electronics. This insulated gate bipolar transistor (IGBT) offers superior performance and reliability for a wide range of applications. With a maximum collector-emitter voltage of 1200V and a maximum collector current of 225A, this N-channel transistor is designed to handle high-power requirements with ease. Trust in the quality and innovation that Infineon brings to the table and experience the value and benefits that the FF150R12KS4 can offer to your projects.

Feature Benefit Bullets

Polarity/Channel Type: N-CHANNEL

N-CHANNEL IGBTs offer higher efficiency and faster switching speeds compared to P-CHANNEL IGBTs, making them suitable for various high power applications.

Maximum VCEsat: 3.7 V

Low VCEsat voltage helps in reducing power losses in the IGBT, leading to higher efficiency and improved performance.

Maximum Power Dissipation (Abs): 1200 W

High power dissipation rating allows the IGBT to handle large amounts of power without overheating, ensuring reliability in high-power applications.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating enables the IGBT to be used in high voltage circuits and applications, providing versatility and flexibility in design.

Maximum Collector Current (IC): 225 A

High collector current rating allows the IGBT to carry large currents, making it suitable for high power applications such as motor control and inverters.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF150R12KS4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

FAST

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

590 ns

Nominal Turn On Time (ton):

180 ns

Maximum VCEsat:

3.7 V

Trade Compliance

FF150R12KS4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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