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FF150R12KE3G

Infineon Technologies

FF150R12KE3G by Infineon Technologies

FF150R12KE3G by Infineon Technologies is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements, featuring a Max VCEsat of 2.15V and Max Collector Current of 225A. It is commonly used in applications requiring high power dissipation up to 780W, such as industrial motor drives and renewable energy systems due to its high operating temperature of 150°C.

Median Price

$104.660

Lifecycle Status

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6

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1k+

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Mouser Electronics

USA . 14 parts In-Stock

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Vyrian

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Digiode

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

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Modulus Dynamics

Lithuania . 15,406 parts In-Stock

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$1.561

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$1.499

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$1.436

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AZTECH Wire

Italy . 898 parts In-Stock

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$5.393

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Ampacity Inc.

Singapore . 46 parts In-Stock

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$88.500

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Corphita

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Bastille Electronics

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Overview

Elevate your power electronics projects with the FF150R12KE3G by Infineon Technologies. As a trusted manufacturer in the industry, Infineon Technologies delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are reliable and efficient. The FF150R12KE3G features a N-CHANNEL polarity with a series connected, center tap configuration, making it ideal for a wide range of applications. With a maximum collector-emitter voltage of 1200 V and a maximum collector current of 225 A, this IGBT offers high performance and durability. Say goodbye to overheating issues with its maximum power dissipation of 780 W and enjoy seamless operation with its fast turn on and turn off times. Trust in Infineon Technologies to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Polarity:

N-CHANNEL - Provides efficient switching and low power loss.

Configuration:

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE - Allows for improved performance and reliability.

Maximum VCEsat:

2.15 V - Ensures low saturation voltage for reduced power dissipation.

Package Shape:

RECTANGULAR - Allows for easy mounting and installation in various applications.

No. of Elements:

2 - Provides redundancy and improves overall system reliability.

Nominal Turn Off Time (toff):

830 ns - Enables fast switching speeds for higher efficiency.

No. of Terminals:

7 - Offers flexibility in connection options for customized setups.

Maximum Power Dissipation (Abs):

780 W - Handles high power levels without overheating.

Package Style (Meter):

FLANGE MOUNT - Makes it easy to integrate into existing systems.

Maximum Operating Temperature:

150 °C - Can withstand high temperatures for extended use.

Maximum Collector-Emitter Voltage:

1200 V - Supports high voltage applications with ease.

Transistor Element Material:

SILICON - Ensures durability and reliability in operation.

Maximum Gate-Emitter Voltage:

20 V - Protects the transistor from damage due to overvoltage.

Maximum Collector Current (IC):

225 A - Handles high current loads for efficient operation.

Terminal Position:

UPPER - Simplifies connection and installation in various setups.

Case Connection:

ISOLATED - Prevents electrical interference and ensures safe operation.

Nominal Turn On Time (ton):

400 ns - Enables quick turn-on for optimal performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF150R12KE3G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

830 ns

Nominal Turn On Time (ton):

400 ns

Maximum VCEsat:

2.15 V

Trade Compliance

FF150R12KE3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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