Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 286; Package Code: VFBGA; Package Shape: RECTANGULAR;
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Other Function Telecom Interface ICs CYW4339XKWBG attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
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CYW4339XKWBG Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
EU2B-YS3303C
Idec
ROTARY SWITCH;
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
1N4148
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
1N4148WT
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Onsemi
Eic Semiconductor
2N2222A
Semitronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Digitron Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM2931Z-5.0RPG
LM2931Z-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V Nominal Output Voltage, 0.1A Max Output Current, and 6V Min Input Voltage. It operates in temperatures ranging from -40 to 125 °C and is ideal for applications requiring stable voltage regulation in electronic circuits.
Zetex Plc
LM7805CT
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Min): 0 Cel; Technology: BIPOLAR;
BSS138W-7-F
Diodes Incorporated
Diodes Inc.'s BSS138W-7-F is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. With 0.2A max drain current and 3.5 ohm RDS(on), it's UL recognized and suitable for small outline packages at temperatures ranging from -55 to 150°C.
BSS138LT3G
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ZED-F9R-01B
U-blox Ag
TELECOM CIRCUIT; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 4;
SX1502I087TRT
Semtech
Semtech's SX1502I087TRT is a telecom IC with 20 terminals in a square chip carrier package. Operating from -40 to 85°C, it has a nominal voltage of 3.3V and matte tin terminal finish. Ideal for telecom circuits, this IC is surface mountable and features an industrial temperature grade.
BT8510EPJC
Conexant Systems
Conexant Systems' BT8510EPJC is a CMOS telecom IC with 68 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, requiring 5V supply voltage and drawing 0.1mA current. Ideal for CEPT PCM-30/E-1 applications, it features tin/lead terminal finish and quad position.
LBCA2HNZYZ-711
Murata Manufacturing
Murata Manufacturing's LBCA2HNZYZ-711 is a telecom IC with 37 terminals, operating b/w -40°C to 85°C. It has a compact rectangular package measuring 7mm x 7.4mm and a low seated height of 1mm. Ideal for industrial applications requiring a nominal voltage of 2.5V and MSL level of 3.
RN41-I/RM615
Microchip Technology's RN41-I/RM615 is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and matte tin finish, suitable for industrial applications. This surface-mount IC in rectangular package measures 13.2mm x 25.8mm with a seated height of 2.2mm, ideal for telecom interface functions.
MAX2771ETI+
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;
WT32I-A-AI6-APTX
Silicon Labs
WT32I-A-AI6-APTX by Silicon Labs is a surface mount telecom interface IC with 1 function and 50 terminals. It has a rectangular package shape, measuring 23.9mm in length, 15.9mm in width, and 2.55mm in max seated height. With an operating temperature range of -40 to 85°C, it is suitable for industrial applications requiring reliable telecom circuit performance.
NEO-M8N
TELECOM CIRCUIT;
HT12D(18DIP)
Holtek Semiconductor
HT12D(18DIP) by Holtek Semiconductor is a CMOS telecom IC with 18 terminals. It operates at temperatures from -20°C to 70°C and supports power supplies of 2.4V to 12V. This rectangular, plastic package is ideal for telecom circuit applications.
RFFC2071ATR13
Qorvo
RFFC2071ATR13 by Qorvo is a surface mount telecom interface IC with 32 terminals. It operates in an industrial temperature range of -40 to 85 °C and has a very thin profile with a seated height of 0.95 mm. This CMOS technology chip carrier is commonly used in telecom circuits with a nominal voltage of 3 V.
CYBLE-222014-01
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 22; Package Shape: SQUARE; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
PN5321A3HN/C106
NXP Semiconductors
PN5321A3HN/C106 by NXP Semiconductors is a telecom IC with 40 terminals in a square chip carrier package. Operating from -30 to 85°C, it features nickel palladium gold terminal finish and quad position. With a compact size of 6x6mm and 0.5mm pitch, it's ideal for telecom circuit applications.
NEO-M8N-0-10
NEO-M8N-0-10 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. With a supply voltage of 3V, it's ideal for industrial applications requiring AEC-Q100 screening and MSL level 4 moisture sensitivity. Measuring 12.2mm x 16mm in a rectangular package style, it offers precise positioning capabilities in compact designs.
XCC2642R1FRGZR
XCC2642R1FRGZR by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. Ideal for telecom circuit applications, it features nickel palladium gold terminal finish and very thin profile design.
RN4870-I/RM128
RN4870-I/RM128 by Microchip Technology is a telecom IC with 33 terminals, operating temperature range of -40 to 85°C, and data rate of 0.01 Mbps. It is used in industrial applications requiring a nominal voltage of 3.3V for wireless communication.
XB3-24DMCM-J
Digi International
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
CC2640R2FTWRGZRQ1
CC2640R2FTWRGZRQ1 by Texas Instruments is a telecom IC with 48 terminals, operating temperature range of -40 to 105°C, and data rate of 1 Mbps. It is used in industrial applications requiring a supply voltage of 3V, such as telecom circuits needing a compact chip carrier package with matte tin finish.
ATWILC3000-MR110CA
ATWILC3000-MR110CA by Microchip Technology is a telecom IC with 65 Mbps data rate, operating at -40 to 85°C. It has 36 terminals in a rectangular package style, suitable for surface mount applications. With a nominal voltage of 3.3V, it is ideal for various telecom interface functions.
NEO-M8U-0-10
NEO-M8U-0-10 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. Its compact MICROELECTRONIC ASSEMBLY package makes it ideal for industrial applications requiring a 3V supply voltage. AEC-Q100 and TS 16949 screening ensure high reliability in automotive and telecom systems.
LMH0384SQ/NOPB
National Semiconductor
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: QCCN; Package Shape: SQUARE;
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CYW43439KUBGT
Infineon Technologies
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1;
CYW43438KUBGT
CYW43438KUBGT by Infineon is a telecom IC with 63 terminals in a grid array package. Operating temp range from -30 to 70°C, with supply voltage of 1.2V. Ideal for telecom circuit applications due to its thin profile and fine pitch design.
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR;
CYW43364KUBGT
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 74; Package Code: VFBGA; Package Shape: RECTANGULAR;
CYW43364KUBGT by Infineon Technologies is a telecom interface IC with 74 terminals in a rectangular grid array package. It operates b/w -30°C to 70°C, with a nominal voltage of 1.2V. This IC is suitable for telecom circuit applications due to its thin profile and fine pitch design.
CYW43455XKUBGT
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 140; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA140,11X13,16;
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 140; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Pitch: .4 mm;
CYW43340XKUBG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 141; Package Code: VFBGA; Package Shape: RECTANGULAR;
CYW4334WKWBG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 208; Package Code: VFBGA; Package Shape: RECTANGULAR;
CYW4339XKUBG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 145; Package Code: VFBGA; Package Shape: RECTANGULAR;
CYW43012C0WKWBGT
Other Telecom ICs;
CYW43143KMLG
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;
CYW43362KUBG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 69; Package Code: VFBGA; Package Shape: RECTANGULAR;
CYW4339NKFFBG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 160; Package Code: VFBGA; Package Shape: SQUARE;
CYW43012TC0KFFBH
CYW43362KUBGT
CYW43143KMLGT
CYW43362SKUBG
CYW43362SKUBGT
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