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CYW43364KUBGT

Infineon Technologies

CYW43364KUBGT by Infineon Technologies

CYW43364KUBGT by Infineon Technologies is a telecom interface IC with 74 terminals in a rectangular grid array package. It operates b/w -30°C to 70°C, with a nominal voltage of 1.2V. This IC is suitable for telecom circuit applications due to its thin profile and fine pitch design.

Median Price

$3.607

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 4,983 parts In-Stock

1+ parts

$1.190

100+ parts

-

1k+ parts

-

10k+ parts

-

4,983

$1.190

-

-

-

Arrow

USA . 4,572 parts In-Stock

1+ parts

$3.607

100+ parts

$3.205

1k+ parts

$2.989

10k+ parts

$2.843

4,572

$3.607

$3.205

$2.989

$2.843

DigiKey

USA . 4,670 parts In-Stock

1+ parts

$5.770

100+ parts

$4.358

1k+ parts

$3.832

10k+ parts

$3.038

4,670

$5.770

$4.358

$3.832

$3.038

Verical

USA . 4,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,572

-

-

-

-

Flip Electronics (Authorized)

USA . 2,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,468

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 480 parts In-Stock

1+ parts

$0.170

100+ parts

-

1k+ parts

-

10k+ parts

-

480

$0.170

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$3.002

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$3.002

-

-

-

Lantek

USA . 4,871 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,871

-

-

-

-

Vyrian

USA . 3,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,970

-

-

-

-

Flip Electronics

USA . 2,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,468

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 844 parts In-Stock

1+ parts

$0.161

100+ parts

-

1k+ parts

-

10k+ parts

-

844

$0.161

-

-

-

Ampacity Inc.

Singapore . 3,643 parts In-Stock

1+ parts

$1.010

100+ parts

-

1k+ parts

-

10k+ parts

-

3,643

$1.010

-

-

-

Continental Prestige Electronics

USA . 4,555 parts In-Stock

1+ parts

$3.002

100+ parts

-

1k+ parts

-

10k+ parts

$2.942

4,555

$3.002

-

-

$2.942

Argo Parts USA

USA . 2,120 parts In-Stock

1+ parts

$3.002

100+ parts

-

1k+ parts

-

10k+ parts

-

2,120

$3.002

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.002

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$3.002

-

-

-

Modulus Dynamics

Lithuania . 2,235 parts In-Stock

1+ parts

$14.673

100+ parts

$14.086

1k+ parts

$13.499

10k+ parts

-

2,235

$14.673

$14.086

$13.499

-

Lixinc

USA . 11,308 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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11,308

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 7,735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,735

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,500

-

-

-

-

GreenTree Electronics

Israel . 4,871 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,871

-

-

-

-

Overview

Maximize your connectivity with the CYW43364KUBGT by Infineon Technologies. This cutting-edge Telecom Interface IC offers unparalleled quality and reliability, making it a top choice for a wide range of applications. With its advanced technology and innovative design, this product delivers superior performance and seamless integration. Experience the value and benefits of Infineon Technologies' expertise in every connection with the CYW43364KUBGT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to heat and chemicals, making the product reliable for long-term use in various environments.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Terminals: 74

With a high number of terminals, this product offers connectivity for multiple functions, enhancing its versatility and compatibility with various systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can perform effectively even in challenging conditions without overheating or malfunctioning.

Nominal Supply Voltage: 1.2 V

The low nominal supply voltage helps in reducing power consumption and improving energy efficiency, making the product cost-effective in the long run.

Technical Specifications

Other Function Telecom Interface ICs CYW43364KUBGT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PBGA-B74

JESD-609 Code:

e1

Length:

4.87 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

74

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.55 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

2.87 mm

Trade Compliance

CYW43364KUBGT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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