Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CYW43438KUBGT by Infineon is a telecom IC with 63 terminals in a grid array package. Operating temp range from -30 to 70°C, with supply voltage of 1.2V. Ideal for telecom circuit applications due to its thin profile and fine pitch design.
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The use of plastic/epoxy material makes this product lightweight and durable.
Being surface mountable allows for easy and efficient PCB assembly.
The rectangular shape of the package provides a compact design for space-saving applications.
With 63 terminals, this product can support a wide range of functions and features.
The grid array style with a thin profile and fine pitch enables high density mounting and improved signal integrity.
The high maximum operating temperature ensures reliable performance in various environments.
The low minimum operating temperature allows for use in cold conditions without compromising functionality.
The bottom terminal position facilitates easier connection to other components on the PCB.
The low maximum seated height helps in achieving a slim and compact overall product design.
The narrow width of the product allows for efficient use of space on the PCB.
The short length of the product provides a compact footprint for tight fitting applications.
The ball terminal form ensures reliable connectivity and signal transmission.
Specifically designed for telecom circuits, making it ideal for telecommunication applications.
The low nominal supply voltage helps in reducing power consumption and heat dissipation.
The small terminal pitch allows for high pin count and compact layout on the PCB.
Other Function Telecom Interface ICs CYW43438KUBGT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
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Telecom IC Type:
Temperature Grade:
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CYW43438KUBGT Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
LL4148
Weitron Technology
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Mde Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
North American Philips Discrete Products Div
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
General Semiconductor
1N4148
Vishay Intertechnology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Diotec Semiconductor Ag
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
NE555D
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
BAV99
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Surge Components
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
LM2675M-ADJ/NOPB
SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Goodwork Semiconductor
NUP2105LT1G
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
SS14
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
CC2530F32RHAT
Texas Instruments
CC2530F32RHAT by Texas Instruments is a 40-terminal telecom IC with a nominal voltage of 3V. It operates b/w -40 to 125°C, suitable for automotive applications. The chip carrier package style has a very thin profile and is surface mountable, making it ideal for compact designs.
WT12-A-AI3
Silicon Labs
Silicon Labs' WT12-A-AI3 is a telecom IC with 31 terminals, CMOS technology, and 3 Mbps data rate. It operates in industrial temperature range (-40 to 85°C) and requires a nominal voltage of 3.3V. This surface-mount rectangular package (14x25 mm) is ideal for telecom interface applications.
SI32170-C-GM1R
TELECOM CIRCUIT;
SJA1105EL
NXP Semiconductors
NXP Semiconductors' SJA1105EL is a telecom IC with 159 terminals in a low-profile grid array package. It operates b/w -40°C to 105°C, with a supply voltage of 1.2V. Suitable for telecom circuits, it has a terminal pitch of 0.8mm and meets AEC-Q100 screening standards.
AT86RF215M-ZU
Microchip Technology
AT86RF215M-ZU by Microchip is a RF and baseband circuit IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3V, it's ideal for telecom applications requiring surface mount technology.
ZOE-M8G-0
U-blox Ag
ZOE-M8G-0 by U-blox Ag is a telecom IC with 51 terminals in a square grid array package. It operates b/w -40°C to 85°C, suitable for industrial use. With a nominal voltage of 1.8V and thin profile design, it's ideal for telecom circuit applications.
EFR32BG13P632F512GM48-B
BGM111A256V21R
BGM111A256V21R by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.2mm, suitable for industrial applications requiring compact MICROELECTRONIC ASSEMBLY packages in surface mount form.
ADAR1000ACCZN-R7
Analog Devices
ADAR1000ACCZN-R7 by Analog Devices is a telecom IC with 88 terminals, operating temp range of -40 to 85°C. It has a nominal voltage of 3.3V and negative supply voltage of -5V. Ideal for telecom circuits, this IC comes in a square package style with surface mount feature.
BGSF18DM20E6327XUMA1
Infineon Technologies
Infineon's BGSF18DM20E6327XUMA1 is a 20-terminal IC with CMOS technology, operating b/w -30 to 85°C. Telecom circuit type with 3.5V supply voltage, it's surface-mountable and features gold nickel finish for telecom interface applications.
MGM240PA32VNN3
MCP2140-I/SO
MCP2140-I/SO by Microchip: Telecom IC with 18 terminals, CMOS tech, 3V supply voltage. Small outline package for telecom circuits, operates b/w -40 to 85°C. Ideal for industrial applications requiring TS 16949 screening level.
BLUENRG-M0L
BLUENRG-M0L by STMicroelectronics is a telecom IC with 11 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.27mm. This surface-mount rectangular package is ideal for industrial applications requiring reliable telecom circuit interfaces.
FUSB340TMX
FUSB340TMX by Onsemi is a Telecom Interface IC with 18 terminals in a rectangular chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3.6V, it is designed for telecom circuit applications.
ST25R3915-AQFT
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
XB3-24Z8UT-J
Digi International
The Digi International XB3-24Z8UT-J is an industrial-grade telecom circuit with 20 terminals in a through-hole package. It operates b/w -40°C to 85°C, making it suitable for various telecom interface applications. Its dual terminal position and microelectronic assembly style enhance its functionality in telecommunications systems.
88E6176-A1-TFJ2I000
Marvell Technology
Marvell Technology's 88E6176-A1-TFJ2I000 is a telecom circuit IC with 128 terminals in a square flatpack package. It features gull wing terminal form and quad terminal position, suitable for surface mount applications. Ideal for various functions in telecommunications interfaces.
NEO-M8Q-0-10
NEO-M8Q-0-10 by U-blox Ag is a MICROELECTRONIC ASSEMBLY with 24 terminals, operating from -40 to 85 °C. Ideal for TELECOM CIRCUIT applications due to its INDUSTRIAL temperature grade and 3V supply voltage requirement.
MGM240PB32VNN3
ISO508P
Burr-Brown Corporation
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
CYW43439KUBGT
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1;
CYW43438KUBGT
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR;
CYW43364KUBGT
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 74; Package Code: VFBGA; Package Shape: RECTANGULAR;
CYW43364KUBGT by Infineon Technologies is a telecom interface IC with 74 terminals in a rectangular grid array package. It operates b/w -30°C to 70°C, with a nominal voltage of 1.2V. This IC is suitable for telecom circuit applications due to its thin profile and fine pitch design.
CYW43455XKUBGT
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 140; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA140,11X13,16;
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 140; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Pitch: .4 mm;
CYW43340XKUBG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 141; Package Code: VFBGA; Package Shape: RECTANGULAR;
CYW4334WKWBG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 208; Package Code: VFBGA; Package Shape: RECTANGULAR;
CYW4339XKUBG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 145; Package Code: VFBGA; Package Shape: RECTANGULAR;
CYW4339XKWBG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 286; Package Code: VFBGA; Package Shape: RECTANGULAR;
CYW43012C0WKWBGT
Other Telecom ICs;
CYW43143KMLG
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;
CYW43362KUBG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 69; Package Code: VFBGA; Package Shape: RECTANGULAR;
CYW4339NKFFBG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 160; Package Code: VFBGA; Package Shape: SQUARE;
CYW43012TC0KFFBH
CYW43362KUBGT
CYW43143KMLGT
CYW43362SKUBG
CYW43362SKUBGT
CYW43438KUBG
Supply Digital Components
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