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CYW43455XKUBGT

Infineon Technologies

CYW43455XKUBGT by Infineon Technologies

CYW43455XKUBGT by Infineon is a telecom IC with 140 terminals in a grid array package. It operates b/w -30°C to 85°C, with a data rate of 433.3 Mbps. This IC is used in applications requiring high-speed communication and low power consumption.

Median Price

$6.781

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 15,000 parts In-Stock

1+ parts

$6.781

100+ parts

$6.700

1k+ parts

$6.619

10k+ parts

$6.565

15,000

$6.781

$6.700

$6.619

$6.565

DigiKey

USA . 4,975 parts In-Stock

1+ parts

$9.810

100+ parts

$7.448

1k+ parts

$6.688

10k+ parts

$6.057

4,975

$9.810

$7.448

$6.688

$6.057

Mouser Electronics

USA . 4,863 parts In-Stock

1+ parts

$9.810

100+ parts

$7.440

1k+ parts

$6.010

10k+ parts

$5.840

4,863

$9.810

$7.440

$6.010

$5.840

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

$5.906

1k+ parts

$5.400

10k+ parts

$5.161

15,000

-

$5.906

$5.400

$5.161

Chip1Stop

Japan . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$5.360

15,000

-

-

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$5.360

Flip Electronics (Authorized)

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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15,000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 762 parts In-Stock

1+ parts

$5.360

100+ parts

-

1k+ parts

-

10k+ parts

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762

$5.360

-

-

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Digiode

USA . 304 parts In-Stock

1+ parts

$7.742

100+ parts

-

1k+ parts

-

10k+ parts

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304

$7.742

-

-

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Rutronik

Germany . 180,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$7.790

180,000

-

-

-

$7.790

Flip Electronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

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15,000

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 12,685 parts In-Stock

1+ parts

$4.560

100+ parts

-

1k+ parts

-

10k+ parts

-

12,685

$4.560

-

-

-

Component Stockers USA

USA . 51,599 parts In-Stock

1+ parts

$6.720

100+ parts

$6.100

1k+ parts

$5.970

10k+ parts

$5.590

51,599

$6.720

$6.100

$5.970

$5.590

Corphita

USA . 768 parts In-Stock

1+ parts

$7.335

100+ parts

-

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10k+ parts

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768

$7.335

-

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Modulus Dynamics

Lithuania . 111 parts In-Stock

1+ parts

$11.859

100+ parts

$11.385

1k+ parts

$10.910

10k+ parts

-

111

$11.859

$11.385

$10.910

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Corohmni

South Africa . 44 parts In-Stock

1+ parts

$15.713

100+ parts

-

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10k+ parts

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44

$15.713

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Authorized Procurement Solutions

USA . 90,000 parts In-Stock

1+ parts

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90,000

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A-Z Elektronik GmbH

Germany . 5,781 parts In-Stock

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5,781

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Argo Parts USA

USA . 5,132 parts In-Stock

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5,132

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Futuretech Components

Singapore . 5,000 parts In-Stock

1+ parts

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5,000

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Alle Elektronik GmbH

Germany . 3,854 parts In-Stock

1+ parts

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100+ parts

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3,854

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Continental Prestige Electronics

USA . 2,090 parts In-Stock

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2,090

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Aranea Global

USA . 100 parts In-Stock

1+ parts

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100

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Overview

Elevate your tech projects with the CYW43455XKUBGT by Infineon Technologies, a cutting-edge Other Function Telecom Interface IC that promises top-notch quality and reliability. Infineon's reputation as a leading manufacturer ensures that this product meets the highest industry standards. With a wide range of applications in telecom circuits, this IC offers unmatched value and benefits to customers looking for seamless connectivity solutions. Experience the advantages of this innovative technology and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ideal for use in telecom applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easier assembly and space-saving on the PCB, making the product efficient and easy to integrate into designs.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and can easily fit into tight spaces on a PCB, making it a versatile choice for various telecom interface applications.

No. of Terminals: 140

Having 140 terminals allows for multiple connections and functionalities, making the product versatile and capable of handling diverse telecom interface requirements.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand demanding conditions, ensuring reliable performance in various environments.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30°C ensures that the product can operate in cold environments without any performance issues, making it a robust choice for telecom applications.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for easy and secure connections, ensuring a stable interface with other components in the system.

Maximum Seated Height: 0.6 mm

With a low maximum seated height of 0.6 mm, the product offers a slim profile, making it suitable for applications where space constraints are a concern.

Width: 4.47 mm

The compact width of 4.47 mm allows for efficient use of space on the PCB, enabling a high density of components and ensuring an optimized layout for telecom systems.

Length: 5.27 mm

The length of 5.27 mm provides a balanced form factor, making the product easy to integrate into different design layouts for telecom interfaces.

Terminal Form: BALL

The ball terminal form provides a reliable and robust connection, ensuring stable signal transmission in telecom applications where connectivity is critical.

Nominal Supply Voltage: 1.2 V

Operating at a nominal supply voltage of 1.2 V, the product offers energy efficiency and compatibility with various power systems commonly used in telecom applications.

Terminal Pitch: 0.4 mm

With a terminal pitch of 0.4 mm, the product allows for high-density routing on the PCB, optimizing signal integrity and performance in telecom interfaces.

Data Rate: 433.3 Mbps

Supporting a high data rate of 433.3 Mbps, the product enables fast and efficient communication in telecom systems, meeting the demands of modern high-speed connectivity requirements.

Technical Specifications

Other Function Telecom Interface ICs CYW43455XKUBGT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

Data Rate:

433.3 Mbps

JESD-30 Code:

R-PBGA-B140

Length:

5.27 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

140

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA140,11X13,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.6 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

4.47 mm

Trade Compliance

CYW43455XKUBGT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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