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CY8C6144LQI-S4F92

Infineon Technologies

CY8C6144LQI-S4F92 by Infineon Technologies

Infineon's CY8C6144LQI-S4F92 is a 68-terminal, CMOS technology-based PROGRAMMABLE SoC with a supply voltage range of 1.7V to 3.6V. It operates b/w -40°C to 85°C and has a compact square package suitable for various applications requiring low-profile chips like IoT devices and wearables.

Median Price

$5.140

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 120 parts In-Stock

1+ parts

$1.810

100+ parts

$1.810

1k+ parts

$1.810

10k+ parts

-

120

$1.810

$1.810

$1.810

-

Farnell

UK . 114 parts In-Stock

1+ parts

$5.140

100+ parts

$3.340

1k+ parts

-

10k+ parts

-

114

$5.140

$3.340

-

-

Mouser Electronics

USA . 500 parts In-Stock

1+ parts

$7.690

100+ parts

$5.020

1k+ parts

$4.690

10k+ parts

$4.390

500

$7.690

$5.020

$4.690

$4.390

DigiKey

USA . 227 parts In-Stock

1+ parts

$7.690

100+ parts

$5.020

1k+ parts

$4.645

10k+ parts

$4.532

227

$7.690

$5.020

$4.645

$4.532

Element14

Singapore . 114 parts In-Stock

1+ parts

$12.030

100+ parts

$9.010

1k+ parts

$7.820

10k+ parts

-

114

$12.030

$9.010

$7.820

-

Rochester

USA . 541 parts In-Stock

1+ parts

-

100+ parts

$3.950

1k+ parts

$3.540

10k+ parts

$3.330

541

-

$3.950

$3.540

$3.330

Verical

USA . 281 parts In-Stock

1+ parts

-

100+ parts

$4.938

1k+ parts

$4.425

10k+ parts

$4.162

281

-

$4.938

$4.425

$4.162

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 304 parts In-Stock

1+ parts

$3.819

100+ parts

-

1k+ parts

-

10k+ parts

-

304

$3.819

-

-

-

Vyrian

USA . 13,171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,171

-

-

-

-

Flip Electronics

USA . 4,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,940

-

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 552 parts In-Stock

1+ parts

$3.618

100+ parts

-

1k+ parts

-

10k+ parts

-

552

$3.618

-

-

-

Ampacity Inc.

Singapore . 149 parts In-Stock

1+ parts

$7.440

100+ parts

-

1k+ parts

-

10k+ parts

-

149

$7.440

-

-

-

Continental Prestige Electronics

USA . 120 parts In-Stock

1+ parts

$7.800

100+ parts

$5.420

1k+ parts

-

10k+ parts

-

120

$7.800

$5.420

-

-

Modulus Dynamics

Lithuania . 4,741 parts In-Stock

1+ parts

$49.204

100+ parts

$47.236

1k+ parts

$45.268

10k+ parts

-

4,741

$49.204

$47.236

$45.268

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,398

-

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Overview

Unlock endless possibilities with the CY8C6144LQI-S4F92 by Infineon Technologies. This cutting-edge programmable SoC offers unparalleled quality and reliability, making it a top choice for various applications in the Other Function uPs,uCs & Peripheral ICs category. With a wide supply voltage range, compact square package shape, and advanced CMOS technology, this product delivers exceptional performance in extreme temperatures. Trust Infineon Technologies to provide innovative solutions that elevate your designs and enhance your products' functionalities. Experience the value and benefits of the CY8C6144LQI-S4F92 today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 3.6 V

Supports a relatively high supply voltage, providing flexibility in different application scenarios.

Package Shape: SQUARE

Square package shape can facilitate easier placement and routing on the PCB, optimizing space usage.

No. of Terminals: 68

Having a high number of terminals allows for multiple connections and functionalities, making the product versatile.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile enhances thermal performance and compact design.

Minimum Supply Voltage: 1.7 V

Supports a low minimum supply voltage, enabling operation in energy-efficient applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme cold environments without compromising functionality.

Terminal Position: QUAD

Quad terminal position enhances stability and electrical connections, ensuring robust performance.

Maximum Seated Height: 1 mm

Low seated height saves space and allows for slimmer device designs.

Width: 8 mm

Compact width facilitates efficient PCB layout and integration into various electronic devices.

Length: 8 mm

Optimal length dimension for compact and space-saving designs.

Peripheral IC Type: PROGRAMMABLE SoC

The programmable System-on-Chip (SoC) architecture offers versatility and customization options for different applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, improving overall performance.

Terminal Form: NO LEAD

No-lead terminal form ensures reliable electrical connections and long-term durability.

Nominal Supply Voltage: 1.8 V

Supported nominal supply voltage for efficient and stable operation.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting, maximizing board space utilization.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate reflow soldering temperature and time requirements, ensuring proper handling during assembly.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CY8C6144LQI-S4F92 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-XQCC-N68

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC68,.32SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

8 mm

Peripheral IC Type:

Trade Compliance

CY8C6144LQI-S4F92 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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