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BSP135L6327

Infineon Technologies

BSP135L6327 by Infineon Technologies

Infineon BSP135L6327 is a N-CHANNEL FET with 600V DS breakdown voltage. Ideal for power applications, it features a built-in diode and operates in depletion mode. With 1.8W max power dissipation and 45 ohm RDS(on), it offers reliable performance in various electronic systems.

Median Price

$0.605

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

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$0.605

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450

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Chip Stock

USA . 180,700 parts In-Stock

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VNN

France . 25,998 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,685 parts In-Stock

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2,685

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Vyrian

USA . 1,561 parts In-Stock

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Greenchips

USA . 700 parts In-Stock

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700

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SIE Connect GmbH - GreenChips

Germany . 700 parts In-Stock

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700

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ACDS - Activité Composants Distribution Service

France . 670 parts In-Stock

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670

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Rebound Electronics

UK . 424 parts In-Stock

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424

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Ack Elektronik San.Tic.Ltd.Sti

. 183 parts In-Stock

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183

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Digiode

USA . 165 parts In-Stock

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165

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Cyclops Electronics Ltd

UK . 76 parts In-Stock

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76

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 8,549 parts In-Stock

1+ parts

$0.354

100+ parts

$0.340

1k+ parts

$0.326

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8,549

$0.354

$0.340

$0.326

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Continental Prestige Electronics

USA . 5,357 parts In-Stock

1+ parts

$0.605

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$0.593

5,357

$0.605

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$0.593

Argo Parts USA

USA . 4,659 parts In-Stock

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$0.605

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$0.587

4,659

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$0.587

Netroflash

USA . 100 parts In-Stock

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$0.605

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$0.575

10k+ parts

$0.563

100

$0.605

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$0.575

$0.563

Aztec Data Supply Inc.

USA . 2,824 parts In-Stock

1+ parts

$0.780

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2,824

$0.780

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Corohmni

South Africa . 557 parts In-Stock

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$1.461

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557

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AZTECH Wire

Italy . 628 parts In-Stock

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$13.702

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628

$13.702

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Semicontronic

India . 1,216 parts In-Stock

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$19.050

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$18.574

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$18.478

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1,216

$19.050

$18.574

$18.478

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Ampacity Inc.

Singapore . 1,582 parts In-Stock

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$49.050

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1,582

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Component Stockers USA

USA . 663 parts In-Stock

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$99.990

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663

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RC Electronics

USA . 26,000 parts In-Stock

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$2.800

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$2.600

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$2.500

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A-Z Elektronik GmbH

Germany . 8,370 parts In-Stock

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Kepictronics

USA . 5,500 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,900 parts In-Stock

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Lixinc

USA . 1,985 parts In-Stock

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Corphita

USA . 322 parts In-Stock

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Assy Fe

Spain . 50 parts In-Stock

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Overview

Experience superior performance and reliability with the BSP135L6327 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality Power Field Effect Transistors (FET) that are perfect for a wide range of applications. With a focus on innovation and cutting-edge technology, this N-CHANNEL transistor offers customers unmatched value, efficiency, and versatility. Whether you're looking for enhanced power management or improved circuit protection, the BSP135L6327 is the ideal solution for all your needs. Trust in Infineon Technologies to provide you with the best-in-class products that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the FET, ensuring long-term reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher electron mobility and faster switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET is capable of handling high voltages, making it ideal for power applications.

Maximum Pulsed Drain Current (IDM): 0.48 A

The high pulsed drain current rating allows for efficient handling of short-duration high current pulses, making this FET suitable for applications requiring high power output.

Maximum Power Dissipation (Abs): 1.8 W

With a high power dissipation rating, this FET can effectively dissipate heat generated during operation, ensuring stable performance under high load conditions.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows this FET to be used in a wide variety of environments without compromising performance, making it versatile and reliable.

Technical Specifications

Power Field Effect Transistors (FET) BSP135L6327 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

.12 A

Maximum Drain Current (ID):

.12 A

Maximum Drain-Source On Resistance:

45 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

.48 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSP135L6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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