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BSP135L6906

Infineon Technologies

BSP135L6906 by Infineon Technologies

Infineon BSP135L6906 is a N-CHANNEL Power FET with 600V DS breakdown voltage. It features single configuration with built-in diode, 45 ohm RDS(on), and 1.8W power dissipation. Ideal for applications requiring high voltage switching in depletion mode operation at up to 150°C.

Median Price

$0.838

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.838

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100

$0.838

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VNN

France . 4,354 parts In-Stock

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4,354

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Digiode

USA . 837 parts In-Stock

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837

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Vyrian

USA . 606 parts In-Stock

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606

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Chip Stock

USA . 125 parts In-Stock

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125

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 5,972 parts In-Stock

1+ parts

$0.809

100+ parts

$0.777

1k+ parts

$0.744

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-

5,972

$0.809

$0.777

$0.744

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Continental Prestige Electronics

USA . 3,170 parts In-Stock

1+ parts

$0.812

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$0.796

3,170

$0.812

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$0.796

Argo Parts USA

USA . 2,276 parts In-Stock

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$0.812

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2,276

$0.812

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Aztec Data Supply Inc.

USA . 1,949 parts In-Stock

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$1.340

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$1.340

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Corohmni

South Africa . 174 parts In-Stock

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$1.820

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174

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Microchip USA

USA . 7,528 parts In-Stock

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$5.655

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7,528

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AZTECH Wire

Italy . 664 parts In-Stock

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$15.665

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Andel Nordic

Denmark . 4,952 parts In-Stock

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$17.160

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$12.009

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$12.009

4,952

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$12.009

$12.009

Ampacity Inc.

Singapore . 1,076 parts In-Stock

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$25.050

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$25.050

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Semicontronic

India . 1,336 parts In-Stock

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$57.050

100+ parts

$55.624

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$55.338

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1,336

$57.050

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Lixinc

USA . 19,282 parts In-Stock

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Authorized Procurement Solutions

USA . 9,500 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Corphita

USA . 130 parts In-Stock

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130

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Overview

Enhance your electronic designs with the BSP135L6906 by Infineon Technologies, a top-tier manufacturer known for outstanding quality and reliability. As a Power Field Effect Transistor (FET) with N-CHANNEL polarity and a built-in diode, this component offers superior performance in various applications. With a high minimum DS breakdown voltage of 600V and a low maximum drain-source on resistance of 45 ohms, this FET ensures efficiency and durability. Trust in the BSP135L6906 to deliver exceptional results and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher electron mobility, resulting in faster switching speeds and lower ON-state resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse current flow.

Surface Mount: YES

Surface mount capability saves space on PCBs and simplifies the manufacturing process.

Minimum DS Breakdown Voltage: 600 V

This high voltage rating allows the FET to handle high-power applications safely.

Package Shape: RECTANGULAR

Rectangular packages are easy to handle and mount on PCBs, improving overall design efficiency.

Terminal Form: GULL WING

The gull wing terminals provide mechanical strength and secure connections for reliable performance.

Operating Mode: DEPLETION MODE

Depletion mode FETs are normally ON and can be turned OFF by applying a negative voltage, offering design flexibility.

Maximum Pulsed Drain Current (IDM): 0.48 A

The high pulsed drain current rating allows the FET to handle short-term power surges effectively.

Maximum Power Dissipation (Abs): 1.8 W

The high power dissipation capability ensures the FET can handle heat dissipation effectively for prolonged operation.

Package Style (Meter): SMALL OUTLINE

Small outline packages save space on the PCB, making them ideal for compact device designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance, low input current requirements, and fast switching speeds for efficient performance.

Maximum Operating Temperature: 150 °C

The high operating temperature tolerance allows the FET to operate reliably in demanding environments.

Transistor Element Material: SILICON

Silicon is a commonly used semiconductor material known for its reliability and performance in electronic devices.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and prevents oxidation for long-lasting connections.

Maximum Drain-Source On Resistance: 45 ohm

Low on-resistance results in minimal power loss and high efficiency in conducting current.

Terminal Position: DUAL

Dual terminal positioning allows for versatile PCB layouts and ease of connection to other components.

Case Connection: DRAIN

Drain connection simplifies circuit design and enhances thermal management for improved performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder joints during the manufacturing process for a robust final product.

Technical Specifications

Power Field Effect Transistors (FET) BSP135L6906 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

.12 A

Maximum Drain Current (ID):

.12 A

Maximum Drain-Source On Resistance:

45 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

.48 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSP135L6906 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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