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BSP135L6327HTSA1

Infineon Technologies

BSP135L6327HTSA1 by Infineon Technologies

Infineon's BSP135L6327HTSA1 is a N-CHANNEL Power FET with 600V DS breakdown voltage. Ideal for power applications, it features a single configuration with built-in diode and operates in depletion mode. With a max drain current of 0.12A and on-resistance of 45 ohm, this MOSFET can handle up to 0.48A pulsed drain current efficiently at temperatures up to 150°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,107 parts In-Stock

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VNN

France . 2,843 parts In-Stock

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2,843

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Digiode

USA . 766 parts In-Stock

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766

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Nova Conductors

Japan . 95 parts In-Stock

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Modulus Dynamics

Lithuania . 595 parts In-Stock

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$0.667

100+ parts

$0.640

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$0.614

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595

$0.667

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$0.614

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Corohmni

South Africa . 453 parts In-Stock

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$0.877

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453

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Aztec Data Supply Inc.

USA . 102 parts In-Stock

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$1.290

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102

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$1.575

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$1.433

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$1.292

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350

$1.575

$1.433

$1.292

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AZTECH Wire

Italy . 725 parts In-Stock

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$5.368

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Semicontronic

India . 304 parts In-Stock

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$40.050

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$39.049

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$38.848

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304

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$38.848

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Ampacity Inc.

Singapore . 1,317 parts In-Stock

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$54.050

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QUARKTWIN TECHNOLOGY LTD

USA . 17,613 parts In-Stock

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Argo Parts USA

USA . 4,559 parts In-Stock

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Continental Prestige Electronics

USA . 1,421 parts In-Stock

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Corphita

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Microchip USA

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Unlock the power of your devices with the BSP135L6327HTSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Power Field Effect Transistors that offer unparalleled performance and reliability. Whether you're looking to enhance the efficiency of your power supply, motor control, or lighting applications, this N-CHANNEL FET with a built-in diode has got you covered. With a high breakdown voltage of 600V and low on-resistance, this transistor ensures optimal functionality even in challenging conditions. Elevate your projects with the BSP135L6327HTSA1 and experience the difference Infineon can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON-state resistance and faster switching speeds compared to P-channel FETs, making them a popular choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in preventing damage to the FET from reverse voltage spikes, enhancing the reliability of the device.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage of 600V ensures that the FET can handle high voltage applications without failure.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and allows for easy mounting on PCBs and efficient use of space.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliable connections, ensuring stability during operation.

Operating Mode: DEPLETION MODE

Depletion mode FETs are normally ON when no gate voltage is applied, making them suitable for specific applications where this behavior is desired.

Maximum Pulsed Drain Current (IDM): 0.48 A

The high maximum pulsed drain current of 0.48A allows the FET to handle short duration peak loads without overheating or damage.

No. of Terminals: 4

Having 4 terminals provides flexibility in circuit design and allows for the connection of additional components if needed.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFETs with metal-oxide semiconductor technology offer high switching speeds and low ON-state resistance, making them ideal for power electronics applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C ensures reliable performance even in high-temperature environments.

Transistor Element Material: SILICON

Silicon-based transistor elements offer good thermal conductivity and are widely used in semiconductor devices for their electrical properties.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and ensures reliable electrical connections during the manufacturing process.

Maximum Drain Current (ID): 0.12 A

The maximum drain current of 0.12A indicates the maximum continuous current that the FET can handle without exceeding its rated specifications.

Maximum Drain-Source On Resistance: 45 ohm

Having a low ON-resistance of 45 ohms reduces power loss and improves efficiency in the FET's operation.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and allows for easy connection of external components or devices.

Case Connection: DRAIN

The drain case connection provides a convenient point for heat dissipation, improving thermal management and reliability of the FET.

Technical Specifications

Power Field Effect Transistors (FET) BSP135L6327HTSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

.12 A

Maximum Drain-Source On Resistance:

45 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

.48 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSP135L6327HTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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