Loading...

BSP135L6906HTSA1

Infineon Technologies

BSP135L6906HTSA1 by Infineon Technologies

BSP135L6906HTSA1 by Infineon is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It features a built-in diode, operates in DEPLETION MODE, and has a max IDM of 0.48A. Ideal for applications requiring high voltage switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,916 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,916

-

-

-

-

VNN

France . 1,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,615

-

-

-

-

Digiode

USA . 386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

386

-

-

-

-

Nova Conductors

Japan . 67 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

67

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 4,147 parts In-Stock

1+ parts

$0.386

100+ parts

$0.371

1k+ parts

$0.355

10k+ parts

-

4,147

$0.386

$0.371

$0.355

-

Aztec Data Supply Inc.

USA . 2,793 parts In-Stock

1+ parts

$0.570

100+ parts

-

1k+ parts

-

10k+ parts

-

2,793

$0.570

-

-

-

Corohmni

South Africa . 885 parts In-Stock

1+ parts

$1.428

100+ parts

-

1k+ parts

-

10k+ parts

-

885

$1.428

-

-

-

Semicontronic

India . 403 parts In-Stock

1+ parts

$2.050

100+ parts

$1.999

1k+ parts

$1.988

10k+ parts

-

403

$2.050

$1.999

$1.988

-

AZTECH Wire

Italy . 231 parts In-Stock

1+ parts

$9.120

100+ parts

-

1k+ parts

-

10k+ parts

-

231

$9.120

-

-

-

Ampacity Inc.

Singapore . 1,479 parts In-Stock

1+ parts

$46.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,479

$46.050

-

-

-

Component Stockers USA

USA . 657 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

657

$99.990

-

-

-

Continental Prestige Electronics

USA . 5,072 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,072

-

-

-

-

Argo Parts USA

USA . 1,973 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,973

-

-

-

-

Corphita

USA . 845 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

845

-

-

-

-

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Microchip USA

USA . 235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

235

-

-

-

-

Overview

Discover the BSP135L6906HTSA1 by Infineon Technologies, a high-quality N-CHANNEL Power FET with a built-in diode. Perfect for various applications, this transistor offers reliability and efficiency. With a 600V minimum breakdown voltage and 45 ohm maximum on-resistance, this product ensures optimal performance. Upgrade your project with the trusted manufacturer Infineon Technologies and experience the benefits of this advanced technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring reliable performance over time.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high electron mobility and efficiency, making them ideal for a variety of power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can help protect the FET from reverse currents, enhancing reliability.

Surface Mount: YES

Surface mount FETs are easy to integrate into compact PCB designs, saving space and reducing overall system size.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high-power applications without the risk of voltage spikes damaging the device.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized form factor, making it easy to incorporate this FET into existing designs.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy soldering and secure connections, ensuring reliable electrical contact.

Operating Mode: DEPLETION MODE

Depletion mode FETs offer high input impedance and low current requirements, making them suitable for low-power applications.

Maximum Pulsed Drain Current (IDM): 0.48 A

The high maximum pulsed drain current rating allows this FET to handle short-term overloads without causing damage.

No. of Terminals: 4

Having four terminals provides flexibility in circuit connections and allows for unique configurations to be implemented.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for applications where board real estate is limited.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low power consumption, enhancing the overall efficiency of the FET.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand harsh environmental conditions and operate reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon-based FETs offer high reliability and performance, making them a popular choice for a wide range of power applications.

Maximum Drain Current (ID): 0.12 A

The high maximum drain current rating allows this FET to handle significant power loads, making it suitable for demanding applications.

Maximum Drain-Source On Resistance: 45 ohm

With a low on-resistance value, this FET minimizes power losses and heat generation, resulting in improved efficiency and performance.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in mounting and allows for easy integration into various circuit layouts.

Case Connection: DRAIN

The case connection at the drain terminal simplifies circuit design and thermal management, ensuring optimal performance under load.

Technical Specifications

Power Field Effect Transistors (FET) BSP135L6906HTSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

.12 A

Maximum Drain-Source On Resistance:

45 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

.48 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSP135L6906HTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19