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BF998E6327

Infineon Technologies

BF998E6327 by Infineon Technologies

BF998E6327 by Infineon Technologies is an N-CHANNEL RF FET with 12V DS Breakdown Voltage. Operating in DEPLETION MODE, it has a 0.03A Drain Current and 0.2W Power Dissipation. Ideal for ULTRA HIGH FREQUENCY applications, this DUAL GATE transistor operates at up to 150°C temperature.

Median Price

$0.070

Lifecycle Status

EOL

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,123 parts In-Stock

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$0.070

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$0.070

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$0.070

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12,123

$0.070

$0.070

$0.070

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Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 13,389 parts In-Stock

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VNN

France . 5,028 parts In-Stock

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Pegasus Components GmbH

Germany . 5,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,445 parts In-Stock

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Bristol Electronics

USA . 2,274 parts In-Stock

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2,274

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LIBRA Elektronik GmbH

Germany . 2,244 parts In-Stock

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Cogito LLC

Ukraine . 2,133 parts In-Stock

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A&K Electronics

USA . 1,654 parts In-Stock

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Rotakorn

Sweden . 1,654 parts In-Stock

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TME

Poland . 1,649 parts In-Stock

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$0.131

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$0.118

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$0.106

1,649

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$0.118

$0.106

ACDS - Activité Composants Distribution Service

France . 1,120 parts In-Stock

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Holdelec - ElecDif-Pro

France . 941 parts In-Stock

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Prism Electronics

USA . 762 parts In-Stock

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762

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Digiode

USA . 641 parts In-Stock

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641

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Inventory MP

USA . 620 parts In-Stock

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620

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Vyrian

USA . 486 parts In-Stock

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486

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Flip Electronics

USA . 250 parts In-Stock

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250

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Distributors (Availability)

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Corohmni

South Africa . 643 parts In-Stock

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$0.399

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643

$0.399

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Aztec Data Supply Inc.

USA . 50 parts In-Stock

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$0.888

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50

$0.888

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Modulus Dynamics

Lithuania . 25,064 parts In-Stock

1+ parts

$1.516

100+ parts

$1.455

1k+ parts

$1.395

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25,064

$1.516

$1.455

$1.395

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Ampacity Inc.

Singapore . 1,226 parts In-Stock

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$2.050

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$2.050

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AZTECH Wire

Italy . 671 parts In-Stock

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$5.779

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671

$5.779

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Andel Nordic

Denmark . 1,066 parts In-Stock

1+ parts

$14.750

100+ parts

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$10.328

10k+ parts

$10.328

1,066

$14.750

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$10.328

$10.328

A-Z Elektronik GmbH

Germany . 37,852 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,998 parts In-Stock

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Infinite Electronics LLP (Excess)

. 9,207 parts In-Stock

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Lixinc

USA . 9,136 parts In-Stock

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Continental Prestige Electronics

USA . 6,461 parts In-Stock

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Microchip USA

USA . 6,337 parts In-Stock

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Alle Elektronik GmbH

Germany . 6,161 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Assy Fe

Spain . 3,746 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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FE SAS

France . 1,800 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,120 parts In-Stock

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Kepictronics

USA . 935 parts In-Stock

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Corphita

USA . 879 parts In-Stock

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Argo Parts USA

USA . 841 parts In-Stock

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841

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Perfect Parts

USA . 236 parts In-Stock

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Metaverse IC Inc.

Canada . 220 parts In-Stock

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220

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GreenTree Electronics

Israel . 200 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the BF998E6327 by Infineon Technologies. As a leader in the industry, Infineon brings unparalleled quality and expertise to the RF Small Signal Field Effect Transistors category. Designed for ultra-high frequency applications, this N-CHANNEL transistor offers dual gate operation and depletion mode for maximum efficiency. With a sleek rectangular package shape and gull wing terminals, the BF998E6327 is perfect for a wide range of projects. Experience superior performance and reliability with this innovative product that provides exceptional value and unmatched benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ensuring reliable performance in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel provides efficient current flow and low ON resistance, making it suitable for high-performance applications.

Configuration: SINGLE

Single configuration simplifies the circuit design and integration process, making it easier to work with.

Surface Mount: YES

Surface mount capability allows for easy PCB assembly and space-saving design.

Operating Mode: DUAL GATE, DEPLETION MODE

Dual gate and depletion mode operation offer flexibility and control over the transistor's performance.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Ultra-high frequency band allows for fast signal processing and high-speed operation.

Maximum Drain Current (Abs) (ID): 0.03 A

Supports a maximum drain current of 0.03A, suitable for low-power applications.

Maximum Power Dissipation (Abs): 0.2 W

With a maximum power dissipation of 0.2W, it can handle moderate power levels efficiently.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures high performance and reliability in various operating conditions.

Maximum Operating Temperature: 150 °C

Operating temperature up to 150°C allows for use in a wide range of environments without compromising performance.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and contact reliability for easy assembly.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF998E6327 attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOW NOISE

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (Abs) (ID):

.03 A

Maximum Drain Current (ID):

.03 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

DUAL GATE, DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BF998E6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-620-5613, 5961016205613

NIIN

016205613

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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