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BCX42

Infineon Technologies

BCX42 by Infineon Technologies

BCX42 by Infineon Technologies is a PNP BJT transistor with max. power dissipation of 0.35W and max. collector-emitter voltage of 125V, ideal for switching applications. It has a min. DC current gain of 40, operates at up to 150°C, and features a small outline package style suitable for surface mount configurations.

Median Price

$0.149

Lifecycle Status

EOL

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 19,300 parts In-Stock

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ComSIT Distribution GmbH

Germany . 12,000 parts In-Stock

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ComSIT USA

USA . 12,000 parts In-Stock

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Partservice

France . 3,000 parts In-Stock

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$0.149

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$0.027

3,000

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$0.149

$0.027

Fibra_Brandt Electronic GMBH

Germany . 2,190 parts In-Stock

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Halfin

Belgium . 2,090 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 1,912 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

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VNN

France . 895 parts In-Stock

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895

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Digiode

USA . 660 parts In-Stock

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660

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Vyrian

USA . 639 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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LWI Electronics Inc

India . 170 parts In-Stock

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Manotoh

Italy . 102 parts In-Stock

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GES GmbH

Germany . 23 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 304 parts In-Stock

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$0.606

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304

$0.606

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Modulus Dynamics

Lithuania . 25,283 parts In-Stock

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$0.780

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$0.749

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$0.718

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25,283

$0.780

$0.749

$0.718

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AZTECH Wire

Italy . 521 parts In-Stock

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$12.113

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521

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Ampacity Inc.

Singapore . 722 parts In-Stock

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$59.050

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722

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A-Z Elektronik GmbH

Germany . 7,800 parts In-Stock

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Continental Prestige Electronics

USA . 4,151 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Corphita

USA . 269 parts In-Stock

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Assy Fe

Spain . 145 parts In-Stock

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Argo Parts USA

USA . 103 parts In-Stock

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103

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Overview

Unlock the power of seamless switching with the BCX42 by Infineon Technologies. Crafted by a leading manufacturer in small signal bipolar junction transistors, this PNP transistor offers unparalleled quality and reliability. Ideal for various applications, this product is designed to optimize performance and efficiency. Experience the benefits of this transistor's high DC current gain, low power dissipation, and impressive collector-emitter voltage. Elevate your projects with the BCX42 and discover a new level of precision and control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and makes the transistor lightweight and cost-effective.

Polarity or Channel Type: PNP

Suitable for applications where PNP transistors are required.

Configuration: SINGLE

Simplifies circuit design and makes it easier to use in various applications.

Transistor Application: SWITCHING

Optimized for switching applications, making it efficient in those scenarios.

Surface Mount: YES

Enables easy and convenient PCB mounting, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

Facilitates easy handling and placement on the PCB.

Terminal Form: GULL WING

Improves thermal performance and allows for easy soldering during assembly.

No. of Terminals: 3

Simple and straightforward connection setup.

Maximum Power Dissipation (Abs): 0.35 W

Suitable for low power applications where efficiency is important.

Package Style (Meter): SMALL OUTLINE

Compact design suitable for space-constrained applications.

Minimum DC Current Gain (hFE): 40

Ensures reliable and consistent performance in various operating conditions.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, suitable for demanding environments.

Maximum Collector-Emitter Voltage: 125 V

Able to handle relatively high voltages, expanding its range of applications.

Transistor Element Material: SILICON

Provides good performance characteristics and reliability.

Maximum Collector Current (IC): 0.8 A

Capable of handling moderate currents, suitable for a variety of applications.

Terminal Position: DUAL

Provides flexibility in circuit design and layout.

Nominal Transition Frequency (fT): 150 MHz

Suitable for high-frequency applications such as amplification and signal processing.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) BCX42 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

125 V

Configuration:

Minimum DC Current Gain (hFE):

40

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BCX42 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

4930-99-208-4131, 4930992084131

NIIN

992084131

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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