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BCV62BE6327HTSA1

Infineon Technologies

BCV62BE6327HTSA1 by Infineon Technologies

BCV62BE6327HTSA1 by Infineon: PNP BJT with hFE of 220, VCE of 30V, and fT of 250MHz. Ideal for current mirror configurations in automotive applications due to AEC-Q101 compliance.

Median Price

$0.097

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 12,000 parts In-Stock

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$0.097

12,000

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$0.097

Verical

USA . 12,000 parts In-Stock

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$0.097

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$0.097

Distrelec

Netherlands . 3,000 parts In-Stock

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Rochester

USA . 67 parts In-Stock

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$0.142

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$0.118

10k+ parts

$0.105

67

-

$0.142

$0.118

$0.105

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 650 parts In-Stock

1+ parts

$0.069

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650

$0.069

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Nova Conductors

Japan . 100 parts In-Stock

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$0.154

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100

$0.154

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Vyrian

USA . 5,680 parts In-Stock

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5,680

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VNN

France . 3,585 parts In-Stock

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TME

Poland . 3,000 parts In-Stock

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$0.098

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NAC Semi

USA . 3,000 parts In-Stock

1+ parts

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$0.247

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$0.247

Rutronik

Germany . 3,000 parts In-Stock

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$0.098

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$0.098

Distributors (Availability)

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Ampacity Inc.

Singapore . 5,874 parts In-Stock

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$0.062

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$0.062

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Corphita

USA . 621 parts In-Stock

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$0.066

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621

$0.066

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Component Stockers USA

USA . 72,117 parts In-Stock

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$0.110

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$0.100

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$0.090

10k+ parts

$0.080

72,117

$0.110

$0.100

$0.090

$0.080

Continental Prestige Electronics

USA . 6,101 parts In-Stock

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$0.154

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$0.151

6,101

$0.154

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$0.151

Argo Parts USA

USA . 4,544 parts In-Stock

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$0.154

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$0.149

4,544

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$0.149

Netroflash

USA . 50 parts In-Stock

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$0.154

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$0.146

10k+ parts

$0.143

50

$0.154

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$0.146

$0.143

Aztec Data Supply Inc.

USA . 3,150 parts In-Stock

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$1.018

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$1.018

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Modulus Dynamics

Lithuania . 7,256 parts In-Stock

1+ parts

$1.397

100+ parts

$1.341

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$1.285

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7,256

$1.397

$1.341

$1.285

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Corohmni

South Africa . 856 parts In-Stock

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$1.915

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856

$1.915

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Eastek

USA . 33,000 parts In-Stock

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Perfect Parts

USA . 25,048 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Glotronic Ltd.

UK . 9,600 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the BCV62BE6327HTSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Small Signal Bipolar Junction Transistors that are perfect for a wide range of applications. With a PNP configuration and a maximum collector-emitter voltage of 30V, this transistor offers unmatched performance and reliability. Whether you're working on a current mirror circuit or any other project requiring precision and efficiency, the BCV62BE6327HTSA1 is the ideal choice. Trust Infineon to provide you with the best solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: PNP

Allows for easy integration with other PNP components in circuit design.

Configuration: CURRENT MIRROR

Ideal for applications where precise current matching is required, such as in audio amplifiers or sensor circuits.

Surface Mount: YES

Enables easy and efficient soldering onto PCBs, saving assembly time and reducing overall size of the circuit.

Terminal Form: GULL WING

Facilitates good thermal dissipation and helps with heat management during operation.

No. of Elements: 2

Allows for increased functionality and versatility in circuit design.

Minimum DC Current Gain (hFE): 220

Ensures reliable amplification of signals with minimal distortion.

Maximum Collector-Emitter Voltage: 30 V

Provides a good margin of safety for the transistor in various operating conditions.

Transistor Element Material: SILICON

Offers high performance and reliability compared to other material options.

Maximum Collector Current (IC): 0.1 A

Suitable for low to medium power applications, making it versatile for a range of circuit designs.

Terminal Finish: TIN

Provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Facilitates easy connection and routing of signals in circuit layout.

Reference Standard: AEC-Q101

Meets automotive quality standards, making the transistor suitable for automotive applications.

Nominal Transition Frequency (fT): 250 MHz

Enables high-frequency signal processing and amplification, making it suitable for RF applications.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) BCV62BE6327HTSA1 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

30 V

Configuration:

Minimum DC Current Gain (hFE):

220

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

4

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

PNP

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BCV62BE6327HTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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