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MC56F8367VVFE

Freescale Semiconductor

MC56F8367VVFE by Freescale Semiconductor

MC56F8367VVFE by Freescale Semiconductor is a 16-bit DSP with 120 MHz clock frequency, 524288 ROM words, and 36864 RAM bytes. Ideal for industrial applications requiring high-speed processing and low power consumption. Features include boundary scan, flash ROM programmability, and multiple internal bus architecture.

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Overview

Experience superior performance and efficiency with the MC56F8367VVFE by Freescale Semiconductor. As a leader in the industry, Freescale Semiconductor delivers top-quality Digital Signal Processors (DSPs) like this one, offering unparalleled value to customers. Ideal for a wide range of applications, this product stands out for its reliability, power, and versatility. Upgrade your projects with the MC56F8367VVFE and unlock new possibilities in digital signal processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 2.75 V

Provides a safe operating range for the DSP.

Address Bus Width: 24

Allows for efficient communication with external devices and memory.

Package Shape: SQUARE

Facilitates easy handling and integration into circuit board layouts.

Bit Size: 16

Provides sufficient processing power for various applications.

Power Supplies (V): 2.5,3.3

Offers flexibility in power requirements for different system configurations.

No. of Terminals: 160

Provides ample connectivity options for input and output devices.

Package Style (Meter): GRID ARRAY

Enhances thermal dissipation and helps maintain stable operating temperatures.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with varying temperature conditions.

CPU Family: 56800E

Indicates a high-performance DSP with advanced features.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Facilitates easy soldering and connection to the circuit board.

ROM Words: 524288

Ample memory capacity for storing program instructions and data.

Maximum Seated Height: 1.75 mm

Low profile design suitable for compact electronic devices.

Width: 15 mm

Compact size for efficient use of space on the circuit board.

Boundary Scan: YES

Facilitates testing and debugging during the manufacturing process.

External Data Bus Width: 16

Efficient data transfer between the DSP and external devices.

Maximum Clock Frequency: 120 MHz

High clock speed for fast processing of signals and data.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper soldering and component attachment during manufacturing.

Peak Reflow Temperature °C: 260

Sufficient temperature for proper solder reflow without damaging the components.

Internal Bus Architecture: MULTIPLE

Efficient data transfer within the DSP for optimal performance.

Length: 15 mm

Compact size for integration into various electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for use in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile DSP capable of handling various signal processing tasks.

RAM Bytes: 36864

Sufficient memory for storing data and temporary program variables.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Facilitates easy rework and replacement of the DSP.

Nominal Supply Voltage: 2.5 V

Standard voltage level for stable operation of the DSP.

ROM Programmability: FLASH

Allows for flexible programming and updating of the ROM contents.

Terminal Pitch: 1 mm

Suitable for precise soldering and connection on the circuit board.

Format: FIXED POINT

Optimized for fixed-point arithmetic calculations in signal processing applications.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture damage during storage and handling.

Speed: 60 rpm

Capable of processing data at high speeds for real-time signal processing applications.

Low Power Mode: YES

Enables power-saving operation when full processing power is not required.

Barrel Shifter: YES

Provides efficient shifting of data for complex signal processing algorithms.

Technical Specifications

Digital Signal Processors (DSPs) MC56F8367VVFE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Freescale Semiconductor

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

CPU Family:

56800E

Maximum Clock Frequency:

120 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B160

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

160

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA160,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.75 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

MC56F8367VVFE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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