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DMP3017SFK-7

Diodes Incorporated

DMP3017SFK-7 by Diodes Incorporated

DMP3017SFK-7 by Diodes Inc. is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 80A IDM, 104mJ EAS, and 0.014 ohm RDS(ON). With a small outline package style and -55 to 150 °C operating temperature range, it offers high performance in various electronic designs.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,171 parts In-Stock

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Nova Conductors

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$0.949

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$0.864

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$0.778

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$0.949

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Corohmni

South Africa . 46 parts In-Stock

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$1.596

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AZTECH Wire

Italy . 556 parts In-Stock

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Ampacity Inc.

Singapore . 722 parts In-Stock

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$19.050

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Argo Parts USA

USA . 3,892 parts In-Stock

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Aranea Global

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Overview

Enhance your power management systems with the DMP3017SFK-7 by Diodes Incorporated. Known for their top-notch quality and reliability, Diodes Incorporated offers a wide range of power field effect transistors for various applications. The DMP3017SFK-7, a P-channel transistor with built-in diode, is perfect for switching operations. With a small outline package and no lead terminals, this transistor is ideal for space-constrained designs. Experience enhanced performance and efficiency with a maximum drain-source on resistance of 0.014 ohm and a maximum pulsed drain current of 80 A. Upgrade your power systems with Diodes Incorporated's DMP3017SFK-7 for unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the FET, ensuring a longer lifespan and reliable performance.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-resistance and high efficiency, making them suitable for power switching applications where energy efficiency is a priority.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse voltage, enhancing the overall functionality and reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high speed and low power dissipation, making it ideal for various electronic systems that require rapid on/off switching.

Surface Mount: YES

Being surface mountable allows for easy and compact integration into circuit boards, saving space and enabling efficient assembly.

Maximum Pulsed Drain Current (IDM): 80 A

With a high pulsed drain current rating, this FET can handle sudden surges of current without overheating or failure, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 17 W

The high power dissipation rating ensures that the FET can handle the maximum power without getting damaged, providing reliable operation under varying load conditions.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows the FET to operate efficiently in harsh environments, making it suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) DMP3017SFK-7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Avalanche Energy Rating (EAS):

104 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

7.8 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

686 pF

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Reference Standard:

MIL-STD-202

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

170 ns

Maximum Turn On Time (ton):

45 ns

Trade Compliance

DMP3017SFK-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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