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DMN53D0L-13

Diodes Incorporated

DMN53D0L-13 by Diodes Incorporated

DMN53D0L-13 by Diodes Inc. is a N-CHANNEL FET with 50V DS breakdown voltage, ideal for SWITCHING applications. It features SINGLE configuration with built-in diode, GULL WING terminals, and operates in ENHANCEMENT MODE. With max power dissipation of 0.54W and operating temp range of -55 to 150°C, it offers reliable performance in various electronic devices.

Median Price

$0.192

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 78 parts In-Stock

1+ parts

$0.350

100+ parts

$0.136

1k+ parts

$0.085

10k+ parts

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78

$0.350

$0.136

$0.085

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Verical

USA . 10,000 parts In-Stock

1+ parts

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$0.035

10,000

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$0.035

Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.075

100+ parts

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150

$0.075

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Vyrian

USA . 12,076 parts In-Stock

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12,076

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NAC Semi

USA . 10,000 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 11,502 parts In-Stock

1+ parts

$0.030

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11,502

$0.030

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Argo Parts USA

USA . 3,714 parts In-Stock

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$0.075

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$0.073

3,714

$0.075

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$0.073

Continental Prestige Electronics

USA . 837 parts In-Stock

1+ parts

$0.075

100+ parts

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$0.074

837

$0.075

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$0.074

iodParts Technologies Inc.

India . 50,000 parts In-Stock

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50,000

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QUARKTWIN TECHNOLOGY LTD

USA . 26,355 parts In-Stock

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Lixinc

USA . 14,541 parts In-Stock

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Eastek

USA . 10,000 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$0.074

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$0.071

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$0.070

500

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$0.074

$0.071

$0.070

Overview

Upgrade your electronics with the DMN53D0L-13 by Diodes Incorporated, a top-quality N-channel small signal field-effect transistor with a built-in diode. Perfect for switching applications, this enhancement mode transistor offers reliable performance and efficiency. With a minimum breakdown voltage of 50V and a maximum drain current of 0.5A, this FET is designed to meet your needs. Trust in Diodes Incorporated for high-quality components that deliver exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable electronics.

Polarity or Channel Type: N-CHANNEL

N-channel transistors have high input impedance and low output impedance, providing efficient signal amplification.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy implementation of protection circuits, enhancing the reliability of the overall system.

Transistor Application: SWITCHING

Designed for switching applications, this transistor offers fast operational speed and low power consumption.

Surface Mount: YES

The surface mount design saves space on the PCB, making it suitable for compact electronic devices.

Minimum DS Breakdown Voltage: 50 V

With a high breakdown voltage, this transistor can handle higher voltages, ensuring reliable performance in various applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into circuit boards, optimizing space utilization.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and easy soldering, ensuring a secure connection on the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer excellent control over the output signal, making them ideal for precise switching operations.

No. of Terminals: 3

This transistor with three terminals simplifies circuit design and offers flexibility in connecting to other components.

Maximum Power Dissipation (Abs): 0.54 W

The high power dissipation capability allows this transistor to handle heavy loads without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for miniaturized electronics.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers low power consumption and high efficiency, making it ideal for battery-operated devices.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this transistor is reliable in harsh environments with elevated temperatures.

Transistor Element Material: SILICON

Silicon-based transistors offer high reliability and stability, ensuring consistent performance over time.

Minimum Operating Temperature: -55 °C

The wide operating temperature range allows this transistor to function in extreme cold conditions, making it versatile for various applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a reliable solder connection and prevents oxidation, ensuring long-term performance.

Maximum Drain Current (ID): 0.5 A

With a high drain current rating, this transistor can handle higher loads, making it suitable for power applications.

Maximum Drain-Source On Resistance: 1.6 ohm

The low drain-source on resistance minimizes power loss and improves efficiency during operation.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit mounting and component orientation, simplifying the design process.

Maximum Time At Peak Reflow Temperature (s): 30

This transistor can withstand peak reflow temperatures for a specified duration, making it suitable for automated soldering processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this transistor maintains its structural integrity during the soldering process, ensuring reliable connection.

Maximum Feedback Capacitance (Crss): 4 pF

The low feedback capacitance reduces signal distortion and improves high-frequency performance, making it suitable for high-speed applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) DMN53D0L-13 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (ID):

.5 A

Maximum Drain-Source On Resistance:

1.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

4 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN53D0L-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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