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DMN5L06DWK-7

Diodes Incorporated

DMN5L06DWK-7 by Diodes Incorporated

DMN5L06DWK-7 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage and 0.305A max drain current, suitable for switching applications. It features a separate configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. This small outline transistor has a max power dissipation of 0.25W and can withstand temperatures up to 150°C.

Median Price

$0.144

Lifecycle Status

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10

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1k+

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Verical

USA . 3,000 parts In-Stock

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Arrow

USA . 3,000 parts In-Stock

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$0.144

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Nova Conductors

Japan . 800 parts In-Stock

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$0.172

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USA . 67,430 parts In-Stock

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Vyrian

USA . 7,322 parts In-Stock

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Sensible Micro Corp

USA . 1,000 parts In-Stock

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Prism Electronics

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Elcom Components

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Inventory MP

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Bristol Electronics

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Ampacity Inc.

Singapore . 6,503 parts In-Stock

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$0.122

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Semicontronic

India . 2,933 parts In-Stock

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$0.122

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$0.119

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$0.118

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Continental Prestige Electronics

USA . 3,743 parts In-Stock

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$0.172

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$0.169

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Argo Parts USA

USA . 2,108 parts In-Stock

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$0.167

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Modulus Dynamics

Lithuania . 15,818 parts In-Stock

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$1.331

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$1.331

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$1.331

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Corohmni

South Africa . 151 parts In-Stock

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$1.577

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$1.825

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$1.734

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$1.734

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$1.825

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Aztec Data Supply Inc.

USA . 2,654 parts In-Stock

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$1.950

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AZTECH Wire

Italy . 898 parts In-Stock

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$10.850

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GreenTree Electronics

Israel . 102,000 parts In-Stock

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RC Electronics

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Kepictronics

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iodParts Technologies Inc.

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Alle Elektronik GmbH

Germany . 5,052 parts In-Stock

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Lixinc

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Lucentia Tech

USA . 1,040 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Overview

Enhance your electronic projects with the DMN5L06DWK-7 Small Signal Field Effect Transistor by Diodes Incorporated. Designed for switching applications, this N-channel transistor offers a maximum drain current of 0.305 A and a low on-resistance of 3 ohms. With a durable plastic/epoxy package and built-in diode elements, this transistor is perfect for compact circuits requiring high performance. Trust in Diodes Incorporated's reputation for quality and reliability, and experience the value and benefits of the DMN5L06DWK-7 in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring it can withstand various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this transistor a good choice for many applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The built-in diode allows for more versatile applications and the separate elements provide flexibility in circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in those scenarios.

Surface Mount: YES

Easy to mount on circuit boards, saving space and simplifying the manufacturing process.

Maximum Drain Current (Abs) (ID): 0.305 A

Capable of handling a relatively high current, suitable for many small signal applications.

Maximum Power Dissipation (Abs): 0.25 W

Can dissipate heat effectively, preventing overheating and ensuring reliable operation.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, making it suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 3 ohm

Low on-resistance allows for efficient power transfer and minimal power loss in the circuit.

Maximum Feedback Capacitance (Crss): 5 pF

Low feedback capacitance minimizes the risk of oscillations and interference in the circuit, ensuring stable operation.

Technical Specifications

Small Signal Field Effect Transistors (FET) DMN5L06DWK-7 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

HIGH RELIABILITY

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (Abs) (ID):

.305 A

Maximum Drain Current (ID):

.305 A

Maximum Drain-Source On Resistance:

3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN5L06DWK-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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