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DMN2710UW-13

Diodes Incorporated

DMN2710UW-13 by Diodes Incorporated

DMN2710UW-13 by Diodes Inc. is a N-channel FET with 20V DS breakdown voltage, 0.9A max drain current, and 0.45 ohm max on-resistance. Ideal for switching applications, it operates in enhancement mode with a temp range of -55 to 150°C. This small outline package features a built-in diode and matte tin terminal finish.

Median Price

$0.026

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 150,000 parts In-Stock

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-

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$0.026

150,000

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-

$0.026

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.056

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10

$0.056

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Vyrian

USA . 4,246 parts In-Stock

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4,246

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Distributors (Availability)

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Ampacity Inc.

Singapore . 149,641 parts In-Stock

1+ parts

$0.022

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149,641

$0.022

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Continental Prestige Electronics

USA . 6,171 parts In-Stock

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$0.056

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$0.055

6,171

$0.056

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$0.055

Argo Parts USA

USA . 3,527 parts In-Stock

1+ parts

$0.056

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$0.054

3,527

$0.056

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$0.054

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.056

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1,000

$0.056

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AZTECH Wire

Italy . 820 parts In-Stock

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$17.240

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820

$17.240

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Overview

Unlock the power of next-generation electronics with the DMN2710UW-13 by Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated brings you a high-quality N-CHANNEL Small Signal Field Effect Transistor (FET) that is perfect for switching applications. With a built-in diode, this transistor offers enhanced performance and reliability. Whether you're designing cutting-edge technology or upgrading existing systems, the DMN2710UW-13 delivers superior power dissipation and operating temperature range. Trust Diodes Incorporated to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and helps protect the components inside the transistor, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors generally have better conductivity and switching characteristics compared to P-CHANNEL transistors, making them a good choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse currents, enhancing the overall performance of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers excellent performance in quickly turning on and off circuits.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 20 V

This high breakdown voltage ensures reliable operation and protection against voltage spikes, making it suitable for a wide range of applications.

Maximum Drain Current (ID): 0.9 A

With a high maximum drain current rating, this transistor can handle higher currents without overheating, making it ideal for power switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) DMN2710UW-13 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.9 A

Maximum Drain-Source On Resistance:

.45 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

6.5 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN2710UW-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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