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OTHER Cellphone ICs 23

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
SKY65174-21 by Skyworks Solutions

SKY65174-21

Skyworks Solutions

SKY65174-21 by Skyworks Solutions is a RF Front End Circuit for cellphones. It operates b/w -35°C to 85°C with 3.3V supply voltage. With a square shape, it has 10 terminals in a microelectronic assembly package, measuring 4x4mm and 0.95mm seated height.

S-XDMA-N10

4 mm

1

10

85 Cel

-35 Cel

UNSPECIFIED

SQUARE

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

.95 mm

3.3 V

NO

RF FRONT END CIRCUIT

OTHER

NO LEAD

.5 mm

DUAL

NOT SPECIFIED

4 mm

SKY13437-11 by Skyworks Solutions

SKY13437-11

Skyworks Solutions

SKY13437-11 by Skyworks Solutions is a Cellphone IC with 22 terminals in RECTANGULAR package. Telecom IC Type: RF AND BASEBAND CIRCUIT, Nominal Voltage: 2.85V, Terminal Pitch: 0.4mm. Ideal for cellphone applications due to its compact MICROELECTRONIC ASSEMBLY and low operating temperatures of -35°C to 90°C.

R-XQMA-N22

3.2 mm

3

1

22

90 Cel

-35 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

.9 mm

2.85 V

YES

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.4 mm

QUAD

2.5 mm

BGA713N7E6327XTSA1 by Infineon Technologies

BGA713N7E6327XTSA1

Infineon Technologies

BGA713N7E6327XTSA1 by Infineon Technologies is a cellphone IC with 6 terminals in a small outline package. It operates b/w -30°C to 85°C, suitable for RF and baseband circuits. With a nominal voltage of 2.8V, it features tin terminal finish and measures 1.3mm in width and 2mm in length.

R-PDSO-N6

e3

2 mm

1

1

6

85 Cel

-30 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

2.8 V

YES

RF AND BASEBAND CIRCUIT

OTHER

TIN

NO LEAD

.5 mm

DUAL

1.3 mm

CC1111F32RSPG3 by Texas Instruments

CC1111F32RSPG3

Texas Instruments

CC1111F32RSPG3 by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. Operating b/w 0-85°C, it features RF and baseband circuit technology, with a supply voltage of 3V. Ideal for telecom applications, this surface-mount IC has a terminal pitch of 0.5mm and MSL rating of 3.

S-PQCC-N36

e4

3

36

85 Cel

0 Cel

PLASTIC/EPOXY

QCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER

260

3

Not Qualified

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

CC1111F32RSPRG3 by Texas Instruments

CC1111F32RSPRG3

Texas Instruments

The Texas Instruments CC1111F32RSPRG3 is a cellphone IC with 36 terminals in a square chip carrier package. Operating at temperatures from 0 to 85°C, it features RF and baseband circuit technology with a supply voltage of 3V. Ideal for telecom applications, this IC has a terminal pitch of 0.5mm and is surface mountable.

S-PQCC-N36

e4

3

36

85 Cel

0 Cel

PLASTIC/EPOXY

QCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER

260

3

Not Qualified

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

CC1111F8RSPG3 by Texas Instruments

CC1111F8RSPG3

Texas Instruments

The Texas Instruments CC1111F8RSPG3 is a cellphone IC with 36 terminals in a square chip carrier package. Operating at 3V, it features RF and baseband circuit technology, suitable for telecom applications. With a temperature range of 0-85°C, this CMOS device has a terminal pitch of 0.5mm and is surface mountable.

S-PQCC-N36

e4

3

36

85 Cel

0 Cel

PLASTIC/EPOXY

QCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER

260

3

Not Qualified

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

AD607ARS-REEL by Analog Devices

AD607ARS-REEL

Analog Devices

AD607ARS-REEL by Analog Devices is a Cellphone IC with 20 terminals in a small outline package. It operates b/w -25°C to 85°C, with a nominal voltage of 3V. Ideal for baseband circuits, this IC has Gull Wing terminals and is surface mountable.

R-PDSO-G20

e0

7.2 mm

1

1

20

85 Cel

-25 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

240

Not Qualified

2 mm

3 V

YES

BASEBAND CIRCUIT

OTHER

TIN LEAD

GULL WING

.65 mm

DUAL

5.3 mm

TCM4400EPN by Texas Instruments

TCM4400EPN

Texas Instruments

Texas Instruments TCM4400EPN is a Cellphone IC with 80 terminals in a square flatpack package. Operating b/w -25 to 85°C, it uses BICMOS technology and requires 3V supply voltage. Ideal for baseband circuits, this IC has a low supply current of 0.03mA and compact dimensions of 12x12mm.

S-PQFP-G80

12 mm

1

80

85 Cel

-25 Cel

PLASTIC/EPOXY

LFQFP

QFP80,.55SQ,20

SQUARE

FLATPACK

NOT SPECIFIED

3

Not Qualified

1.6 mm

Other Telecom ICs

.03 mA

3 V

YES

BICMOS

BASEBAND CIRCUIT

OTHER

GULL WING

.5 mm

QUAD

NOT SPECIFIED

12 mm

TCM4400EGGM by Texas Instruments

TCM4400EGGM

Texas Instruments

Texas Instruments TCM4400EGGM is a BICMOS technology Cellphone IC with 80 terminals in a square package. It operates at -25 to 85 °C, consuming 0.03 mA at 3V. Ideal for BASEBAND CIRCUIT applications due to its low profile and fine pitch design.

S-PBGA-B80

10 mm

1

80

85 Cel

-25 Cel

PLASTIC/EPOXY

LFBGA

BGA80,10X10,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

3

Not Qualified

1.4 mm

Other Telecom ICs

.03 mA

3 V

YES

BICMOS

BASEBAND CIRCUIT

OTHER

BALL

.8 mm

BOTTOM

10 mm

TRF4400PWG4 by Texas Instruments

TRF4400PWG4

Texas Instruments

TRF4400PWG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.

R-PDSO-G24

7.8 mm

1

24

60 Cel

-20 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

3

Not Qualified

1.2 mm

Other Telecom ICs

.075 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

TRF4400PWRG4 by Texas Instruments

TRF4400PWRG4

Texas Instruments

TRF4400PWRG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.

R-PDSO-G24

7.8 mm

1

24

60 Cel

-20 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

3

Not Qualified

1.2 mm

Other Telecom ICs

.075 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

SI4710-B30-GMR by Silicon Labs

SI4710-B30-GMR

Silicon Labs

SI4710-B30-GMR by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. Operating temp range -20 to 85°C, CMOS tech, and 3.3V supply voltage make it ideal for RF and baseband circuits in telecom applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4710-B30-GM by Silicon Labs

SI4710-B30-GM

Silicon Labs

SI4710-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20 to 85°C, ideal for RF and baseband circuits. With CMOS technology and 3.3V supply voltage, it's perfect for compact telecom applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4711-B30-GMR by Silicon Labs

SI4711-B30-GMR

Silicon Labs

SI4711-B30-GMR by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuitry, CMOS technology, and a nominal voltage of 3.3V. Ideal for telecom applications due to its compact size and surface-mount capability.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4711-B30-GM by Silicon Labs

SI4711-B30-GM

Silicon Labs

SI4711-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square chip carrier package. Operating temperature ranges from -20 to 85°C. It features RF and baseband circuit technology, suitable for cellphone applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4712-B30-GMR by Silicon Labs

SI4712-B30-GMR

Silicon Labs

SI4712-B30-GMR by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, utilizing CMOS technology and requiring 3.3V supply voltage. This RF and baseband circuit is ideal for compact mobile devices due to its very thin profile and small dimensions of 3mm x 3mm.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4713-B30-GMR by Silicon Labs

SI4713-B30-GMR

Silicon Labs

SI4713-B30-GMR by Silicon Labs is a Cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this CMOS technology IC has a compact size of 3x3mm and terminal pitch of 0.5mm.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SI4713-B30-GM by Silicon Labs

SI4713-B30-GM

Silicon Labs

SI4713-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, suitable for RF and baseband circuits. With a compact size of 3x3mm and CMOS technology, it's ideal for mobile phone applications.

S-XQCC-N20

3 mm

1

20

85 Cel

-20 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

AD6654BBC by Analog Devices

AD6654BBC

Analog Devices

AD6654BBC by Analog Devices is a Cellphone IC with 256 terminals in a square grid array package. It operates b/w -25 °C to 85°C, with a nominal voltage of 1.8V. This BASEBAND CIRCUIT IC is designed for telecom applications, featuring surface mount capability and TIN LEAD SILVER terminal finish.

S-PBGA-B256

e0

17 mm

3

1

256

85 Cel

-25 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

240

Not Qualified

1.85 mm

1.8 V

YES

BASEBAND CIRCUIT

OTHER

TIN LEAD SILVER

BALL

1 mm

BOTTOM

17 mm

AD607ARSZ by Analog Devices

AD607ARSZ

Analog Devices

AD607ARSZ by Analog Devices is a cellphone IC with 20 terminals in a small outline package. Operating temp range -25 to 85°C, nominal voltage of 3V, and peak reflow temp of 260°C. Ideal for telecom applications as a baseband circuit due to its compact size and gull wing terminal form.

R-PDSO-G20

e3

7.2 mm

1

1

20

85 Cel

-25 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

260

Not Qualified

2 mm

3 V

YES

BASEBAND CIRCUIT

OTHER

MATTE TIN

GULL WING

.65 mm

DUAL

5.3 mm

AD607ARSZ-REEL by Analog Devices

AD607ARSZ-REEL

Analog Devices

AD607ARSZ-REEL by Analog Devices is a BASEBAND CIRCUIT for cellphones. It operates b/w -25 to 85°C with a supply voltage of 3V. This SMALL OUTLINE IC has 20 terminals, matte tin finish, and measures 7.2mm x 5.3mm in size for telecom applications.

R-PDSO-G20

e3

7.2 mm

1

1

20

85 Cel

-25 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

260

Not Qualified

2 mm

3 V

YES

BASEBAND CIRCUIT

OTHER

MATTE TIN

GULL WING

.65 mm

DUAL

5.3 mm

SKY13524-639LF by Skyworks Solutions

SKY13524-639LF

Skyworks Solutions

SKY13524-639LF by Skyworks Solutions is a cellphone IC with 14 terminals in a square package style. Operating b/w -30°C to 90°C, it's ideal for RF and baseband circuits at 3.3V supply voltage. With a compact size of 1.6mm x 1.6mm and terminal pitch of 0.4mm, it's suitable for telecom applications requiring surface mount technology.

S-XQCC-N14

1.6 mm

1

14

90 Cel

-30 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.5 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

1.6 mm

SKY66291-11 by Skyworks Solutions

SKY66291-11

Skyworks Solutions

RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; No. of Terminals: 16; Terminal Position: UNSPECIFIED; Peak Reflow Temperature (C): 260;

S-XXSS-X16

3

1

16

260

5 V

RF AND BASEBAND CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED