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16 Cellphone ICs 27

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
SE5007BT-R by Skyworks Solutions

SE5007BT-R

Skyworks Solutions

SE5007BT-R by Skyworks Solutions is a cellphone IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, operates at 3.3V supply voltage, and has a terminal pitch of 0.5mm for telecom applications.

S-XQCC-N16

3 mm

1

16

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.6 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

CC1150RSTG3 by Texas Instruments

CC1150RSTG3

Texas Instruments

CC1150RSTG3 by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.8/3.6V. This RF and baseband circuit has a terminal pitch of 0.65mm, making it ideal for industrial telecom applications.

S-XQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

CC1150RSTRG3 by Texas Instruments

CC1150RSTRG3

Texas Instruments

The Texas Instruments CC1150RSTRG3 is a cellphone IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 1.8/3.6V and peak reflow temperature of 260°C. Ideal for RF and baseband circuits in industrial telecom applications due to its CMOS technology and compact size.

S-XQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

CC1150RSTR by Texas Instruments

CC1150RSTR

Texas Instruments

The Texas Instruments CC1150RSTR is a cellphone IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 1.8/3.6V and peak reflow temperature of 260°C. Ideal for RF and baseband circuits in industrial telecom applications due to its CMOS technology and compact size.

S-XQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

CC1150RST by Texas Instruments

CC1150RST

Texas Instruments

CC1150RST by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.8/3.6V. This RF and baseband circuit has a terminal pitch of 0.65mm, making it ideal for industrial telecom applications.

S-XQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

1605C by Murata Manufacturing

1605C

Murata Manufacturing

Murata Manufacturing's 1605C is a BASEBAND CIRCUIT for cellphones. It has 16 terminals in IN-LINE package style, with dimensions of 7.62mm width and 22.5mm length. Operating temperature range is 0-70°C, making it ideal for commercial telecom applications.

R-XDIP-T16

22.5 mm

1

16

70 Cel

0 Cel

UNSPECIFIED

DIP

RECTANGULAR

IN-LINE

NOT SPECIFIED

Not Qualified

6.84 mm

NO

BASEBAND CIRCUIT

COMMERCIAL

THROUGH-HOLE

2.54 mm

DUAL

NOT SPECIFIED

7.62 mm

CC2591RGVRG4 by Texas Instruments

CC2591RGVRG4

Texas Instruments

CC2591RGVRG4 by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates at temperatures from -40 to 85°C and has a supply voltage of 3V. This RF front end circuit has a max supply current of 4mA, making it ideal for industrial telecom applications.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other Telecom ICs

4 mA

3 V

YES

RF FRONT END CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

CC2591RGVTG4 by Texas Instruments

CC2591RGVTG4

Texas Instruments

RF FRONT END CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other Telecom ICs

4 mA

3 V

YES

RF FRONT END CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

MAX2685EEE-T by Maxim Integrated

MAX2685EEE-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

4.89 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Not Qualified

1.73 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

TRF3702IRHCG4 by Texas Instruments

TRF3702IRHCG4

Texas Instruments

TRF3702IRHCG4 by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and a compact square chip carrier package suitable for surface mounting.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,32

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

.17 mA

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.8 mm

QUAD

30

4 mm

BGU7060Y by NXP Semiconductors

BGU7060Y

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7061,518 by NXP Semiconductors

BGU7061,518

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7062,518 by NXP Semiconductors

BGU7062,518

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7063,115 by NXP Semiconductors

BGU7063,115

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

8 mm

BGU7063,518 by NXP Semiconductors

BGU7063,518

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;

S-PQCC-N16

8 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

1.4 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

1.42 mm

QUAD

30

8 mm

BLM6G10-30G,118 by NXP Semiconductors

BLM6G10-30G,118

NXP Semiconductors

BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: TIN;

R-PDSO-G16

e3

15.9 mm

3

1

16

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

245

3.6 mm

28 V

YES

BASEBAND CIRCUIT

TIN

GULL WING

1.37 mm

DUAL

30

11 mm

BLM6G10-30G,135 by NXP Semiconductors

BLM6G10-30G,135

NXP Semiconductors

BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 15.9 mm;

R-PDSO-G16

e3

15.9 mm

1

16

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

3.6 mm

28 V

YES

BASEBAND CIRCUIT

Tin (Sn)

GULL WING

1.37 mm

DUAL

11 mm

CC1150RGVT by Texas Instruments

CC1150RGVT

Texas Instruments

The Texas Instruments CC1150RGVT is a cellphone IC with a package style of chip carrier, suitable for RF and baseband circuits. It operates at temperatures ranging from -40 to 85°C, with a supply voltage of 3V and data rate of 0.5 Mbps. This surface-mount IC has 16 terminals in a square shape, ideal for industrial applications requiring compact design and high performance.

.5 Mbps

S-PQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

NO LEAD

.65 mm

QUAD

30

4 mm

RFX2411 by Skyworks Solutions

RFX2411

Skyworks Solutions

RFX2411 by Skyworks Solutions is a cellphone IC with 16 terminals in a square package. It operates b/w -40 to 125°C, suitable for automotive use. This RF and baseband circuit has a nominal voltage of 3.3V, utilizing CMOS technology for high performance in telecom applications.

S-XQCC-N16

3 mm

1

16

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

AUTOMOTIVE

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

3 mm

RFX5000B by Skyworks Solutions

RFX5000B

Skyworks Solutions

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N16

3 mm

1

16

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.6 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

3 mm

SKY66291-11 by Skyworks Solutions

SKY66291-11

Skyworks Solutions

RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; No. of Terminals: 16; Terminal Position: UNSPECIFIED; Peak Reflow Temperature (C): 260;

S-XXSS-X16

3

1

16

260

5 V

RF AND BASEBAND CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

HPA00420RGVR by Texas Instruments

HPA00420RGVR

Texas Instruments

Texas Instruments' HPA00420RGVR is a cellphone IC with 16 terminals in a square chip carrier package. Operating from -40 to 85°C, it's ideal for RF and baseband circuits. With nickel palladium gold finish, it offers a nominal voltage of 3V and terminal pitch of 0.65mm.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

HPA01083RGVR by Texas Instruments

HPA01083RGVR

Texas Instruments

Texas Instruments' HPA01083RGVR is a cellphone IC with 16 terminals in a square chip carrier package. Operating from -40 to 85°C, it's ideal for RF and baseband circuits. With a compact size of 4x4mm and no-lead terminal form, it suits industrial telecom applications.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

HPA02142RGVR by Texas Instruments

HPA02142RGVR

Texas Instruments

Texas Instruments' HPA02142RGVR is a Cellphone IC with 16 terminals in a square chip carrier package. Operating b/w -40 to 85°C, it has a supply voltage of 3V and max current of 4mA. Ideal for RF and baseband circuits, this IC is surface mountable with nickel palladium gold finish.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

4 mA

3 V

YES

RF AND BASEBAND CIRCUIT

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

HPA00452RSTR by Texas Instruments

HPA00452RSTR

Texas Instruments

Texas Instruments' HPA00452RSTR is a Cellphone IC with 16 terminals in a square chip carrier package. Operating b/w -40 to 85°C, it features RF and baseband circuit technology, NO LEAD terminal form, and 3V supply voltage. Ideal for telecom applications requiring a compact design with high performance.

S-PQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.95 mm

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

LX5584BLQ-TR by Microchip Technology

LX5584BLQ-TR

Microchip Technology

LX5584BLQ-TR by Microchip Technology is a Cellphone IC with 16 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for cellphone applications.

S-XQCC-N16

3 mm

1

16

85 Cel

-40 Cel

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.023 mm

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

3 mm

WLAN7102CZ by NXP Semiconductors

WLAN7102CZ

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .7 mm;

S-PQCC-N16

2 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.07SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.7 mm

214 mA

3.85 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

.4 mm

QUAD

2 mm