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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6SLX75-2CSG484C by Xilinx

XC6SLX75-2CSG484C

Xilinx

Xilinx XC6SLX75-2CSG484C FPGA features 74637 logic cells, 5831 CLBs, and a max clock frequency of 667 MHz. Ideal for applications requiring high-speed processing and programmable ICs in various industries like telecommunications and automotive.

FPGA

74637

310

310

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-2CSG484I by Xilinx

XC6SLX75-2CSG484I

Xilinx

Xilinx XC6SLX75-2CSG484I FPGA features 74637 logic cells, 5831 CLBs, and max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs with a supply voltage range of 1.14V to 1.26V.

FPGA

74637

310

310

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-2FG484C by Xilinx

XC6SLX75-2FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

280

280

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX75-2FG484I by Xilinx

XC6SLX75-2FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

280

280

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX75-2FGG484C by Xilinx

XC6SLX75-2FGG484C

Xilinx

Xilinx XC6SLX75-2FGG484C FPGA features 74637 logic cells, 5831 CLBs, and a max clock frequency of 667 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package with surface mount capability.

FPGA

74637

280

280

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75-2FGG484I by Xilinx

XC6SLX75-2FGG484I

Xilinx

Xilinx XC6SLX75-2FGG484I FPGA offers 74637 logic cells, 5831 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.

FPGA

74637

280

280

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75-3CSG484C by Xilinx

XC6SLX75-3CSG484C

Xilinx

Xilinx XC6SLX75-3CSG484C FPGA features 74637 logic cells, 5831 CLBs, and 310 inputs/outputs. Utilized in applications requiring high clock frequencies up to 862 MHz, such as telecommunications equipment and industrial automation systems. Operating temperature range from 0 to 85°C with a compact grid array package style.

FPGA

74637

310

310

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-3CSG484I by Xilinx

XC6SLX75-3CSG484I

Xilinx

The Xilinx XC6SLX75-3CSG484I is a FPGA with 74637 logic cells, 5831 CLBs, and 328 inputs/outputs. It operates at max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for industrial applications requiring high-speed processing in compact form factors due to its advanced CMOS technology and fine pitch grid array package style.

FPGA

74637

328

328

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-3FG484I by Xilinx

XC6SLX75-3FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

280

280

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX75-3FGG484C by Xilinx

XC6SLX75-3FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

280

280

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75-3FGG484I by Xilinx

XC6SLX75-3FGG484I

Xilinx

Xilinx XC6SLX75-3FGG484I FPGA features 74637 logic cells, 5831 CLBs, and max clock frequency of 862 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package.

FPGA

74637

280

280

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75-L1CSG484C by Xilinx

XC6SLX75-L1CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

328

328

5831

0.46 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-L1CSG484I by Xilinx

XC6SLX75-L1CSG484I

Xilinx

Xilinx XC6SLX75-L1CSG484I FPGA features 74637 logic cells, 5831 CLBs, and 310 inputs/outputs. Utilized in industrial applications, it operates at -40 to 100°C with a max supply voltage of 1.05V. The package is a grid array with fine pitch terminals for surface mounting.

FPGA

74637

310

310

5831

0.46 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-L1FGG484C by Xilinx

XC6SLX75-L1FGG484C

Xilinx

Xilinx XC6SLX75-L1FGG484C is a CMOS FPGA with 74637 logic cells, 5831 CLBs, and 280 inputs/outputs. It operates at 0-85°C, with supply voltage of 0.95-1.05 V. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment and industrial automation systems.

FPGA

74637

280

280

5831

0.46 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75-L1FGG484I by Xilinx

XC6SLX75-L1FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

280

280

5831

0.46 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-2CSG484C by Xilinx

XC6SLX75T-2CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

290

290

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-2CSG484I by Xilinx

XC6SLX75T-2CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

290

290

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-2FG484I by Xilinx

XC6SLX75T-2FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

268

268

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX75T-2FGG484C by Xilinx

XC6SLX75T-2FGG484C

Xilinx

Xilinx XC6SLX75T-2FGG484C FPGA features 74637 logic cells, 5831 CLBs, and 268 inputs/outputs. Utilized in applications requiring high-speed processing up to 667 MHz with a max operating temperature of 85°C. Ideal for designs needing programmable ICs with low power consumption and compact form factor.

FPGA

74637

268

268

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-2FGG484I by Xilinx

XC6SLX75T-2FGG484I

Xilinx

Xilinx XC6SLX75T-2FGG484I FPGA features 74637 logic cells, 5831 CLBs, and 268 inputs/outputs. It operates at a max frequency of 667 MHz with a combinatorial delay of 0.26 ns per CLB. Ideal for industrial applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

74637

268

268

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-3CSG484C by Xilinx

XC6SLX75T-3CSG484C

Xilinx

Xilinx XC6SLX75T-3CSG484C is a FPGA with 74637 logic cells, 5831 CLBs, and max clock frequency of 862 MHz. It operates at 1.2V nominal voltage and is used in applications requiring high-speed processing and programmable ICs.

FPGA

74637

290

290

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-3CSG484I by Xilinx

XC6SLX75T-3CSG484I

Xilinx

Xilinx XC6SLX75T-3CSG484I FPGA features 74637 logic cells, 5831 CLBs, and max clock freq of 862 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with fine pitch terminals. Operating temp range -40 to 100°C makes it versatile for various environments.

FPGA

74637

292

292

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-3FG484I by Xilinx

XC6SLX75T-3FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

268

268

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX75T-3FGG484C by Xilinx

XC6SLX75T-3FGG484C

Xilinx

Xilinx XC6SLX75T-3FGG484C FPGA features 74637 logic cells, 5831 CLBs, and 268 inputs/outputs. Utilized in applications requiring high clock frequencies up to 862 MHz, with a max operating temperature of 85°C. Ideal for designs needing programmable ICs with low combinatorial delay and compact form factor.

FPGA

74637

268

268

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-3FGG484I by Xilinx

XC6SLX75T-3FGG484I

Xilinx

Xilinx XC6SLX75T-3FGG484I FPGA features 74637 logic cells, 5831 CLBs, and 268 inputs/outputs. Utilized in industrial applications, it operates at a max clock frequency of 862 MHz with a combinatorial delay of 0.21 ns per CLB. The package style is grid array with a moisture sensitivity level of 3.

FPGA

74637

268

268

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-4CSG484C by Xilinx

XC6SLX75T-4CSG484C

Xilinx

Xilinx XC6SLX75T-4CSG484C is a CMOS FPGA with 74637 logic cells, 292 inputs/outputs, and operates at temperatures from 0 to 85°C. It features a grid array package style with 0.8mm terminal pitch, suitable for various applications requiring high-performance programmable ICs.

FPGA

74637

292

292

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-4FGG484C by Xilinx

XC6SLX75T-4FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

268

268

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

484

S-PBGA-B484

e1

No

XA3S1600E-4FGG484Q by Xilinx

XA3S1600E-4FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

376

294

3688

1600000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XC6VCX130T-1FFG484C by Xilinx

XC6VCX130T-1FFG484C

Xilinx

The Xilinx XC6VCX130T-1FFG484C is a FPGA with 128,000 logic cells and 10,000 CLBs. Operating at a max frequency of 1098 MHz, it's ideal for high-performance applications requiring advanced programmable ICs in a compact grid array package. With low combinatorial delay and multiple power supply options, this CMOS technology device offers versatile solutions for various electronic designs.

FPGA

128000

240

240

10000

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VCX130T-1FFG484I by Xilinx

XC6VCX130T-1FFG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1,1.2/2.5,2.5;

FPGA

128000

240

240

10000

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XA7A100T-1FGG484Q by Xilinx

XA7A100T-1FGG484Q

Xilinx

XA7A100T-1FGG484Q by Xilinx is a FPGA with 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. It operates at max frequency of 1098 MHz, suitable for automotive applications due to AEC-Q100 screening and HKMG technology. With a compact form factor (23mm x 23mm), it's ideal for high-performance computing in harsh environments.

FPGA

101440

285

285

7925

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45-2FGG484Q by Xilinx

XA6SLX45-2FGG484Q

Xilinx

XA6SLX45-2FGG484Q by Xilinx is a 1.2V FPGA with 43661 logic cells, 316 inputs/outputs, and max clock frequency of 62.5MHz. Ideal for automotive applications due to AEC-Q100 screening level and operating temperature range of -40 to 125°C.

FPGA

43661

316

316

62.5 MHz

Field Programmable Gate Arrays

1.2

1.2,2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

LFXP2-30E-5FN484C by Lattice Semiconductor

LFXP2-30E-5FN484C

Lattice Semiconductor

LFXP2-30E-5FN484C by Lattice Semiconductor is a 29000 logic cell FPGA with 3625 CLBs, operating at max 1.26V. Ideal for applications requiring high clock frequency up to 435MHz, it features a grid array package style and CMOS technology, suitable for various electronic designs.

FPGA

29000

363

363

3625

435 MHz

0.494 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFXP2-40E-5FN484C by Lattice Semiconductor

LFXP2-40E-5FN484C

Lattice Semiconductor

LFXP2-40E-5FN484C by Lattice Semiconductor is a 40000 logic cell FPGA with 5000 CLBs, operating at max 435 MHz clock frequency. It uses CMOS technology, has 363 inputs/outputs, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs.

FPGA

40000

363

363

5000

435 MHz

0.494 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFXP2-40E-5FN484I by Lattice Semiconductor

LFXP2-40E-5FN484I

Lattice Semiconductor

LFXP2-40E-5FN484I by Lattice Semiconductor is a 40000 logic cell FPGA with 5000 CLBs, operating at max 435 MHz clock frequency. It uses CMOS technology, has 363 inputs/outputs, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs.

FPGA

40000

363

363

5000

435 MHz

0.494 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFXP2-40E-6FN484C by Lattice Semiconductor

LFXP2-40E-6FN484C

Lattice Semiconductor

LFXP2-40E-6FN484C by Lattice Semiconductor is a 40000 logic cell FPGA with 5000 CLBs, operating at max 435 MHz clock frequency. It uses CMOS technology, has 363 inputs/outputs, and supports supply voltages of 1.2V. Ideal for applications requiring high-speed processing in compact designs.

FPGA

40000

363

363

5000

435 MHz

0.399 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFXP2-40E-6FN484I by Lattice Semiconductor

LFXP2-40E-6FN484I

Lattice Semiconductor

LFXP2-40E-6FN484I by Lattice Semiconductor is a 40000 logic cell FPGA with 5000 CLBs, operating at max 435 MHz clock frequency. It uses CMOS technology, has 363 inputs/outputs, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment and industrial automation systems.

FPGA

40000

363

363

5000

435 MHz

0.399 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFXP2-40E-7F484C by Lattice Semiconductor

LFXP2-40E-7F484C

Lattice Semiconductor

LFXP2-40E-7F484C by Lattice Semiconductor is a 40000 logic cell FPGA with CMOS technology. It operates at 1.2V, has 363 inputs/outputs, and supports a max clock frequency of 435MHz. Ideal for applications requiring high-speed processing in compact designs.

FPGA

40000

363

363

435 MHz

0.304 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XA3SD1800A-4CSG484Q by Xilinx

XA3SD1800A-4CSG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

37440

309

249

4160

37440

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 37440 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA3SD3400A-4CSG484I by Xilinx

XA3SD3400A-4CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 1.8 mm;

FPGA

53712

309

249

5968

53712

667 MHz

CMOS

Field Programmable Gate Arrays

5968 CLBS, 53712 Gates

1.2,1.2/3.3,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

AEC-Q100

LFEC10E-5F484C by Lattice Semiconductor

LFEC10E-5F484C

Lattice Semiconductor

LFEC10E-5F484C by Lattice Semiconductor is a 10200 logic cell FPGA with 1280 CLBs, 288 inputs/outputs, and max clock frequency of 420 MHz. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment and industrial automation systems.

FPGA

10200

288

288

1280

420 MHz

0.4 ns

Field Programmable Gate Arrays

1280 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin/Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S1600E-4FG484C by Xilinx

XC3S1600E-4FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

376

294

3688

1600000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S1600E-4FG484I by Xilinx

XC3S1600E-4FG484I

Xilinx

Xilinx XC3S1600E-4FG484I is a FPGA with 33192 logic cells, 3688 CLBs, and 1600000 gates. Operating at max frequency of 572 MHz, it's ideal for industrial applications requiring high-speed processing and low power consumption. With a wide temperature range (-40 to 100°C), it suits various embedded systems needing reliable performance.

FPGA

33192

376

294

3688

1600000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S1600E-4FGG484C by Xilinx

XC3S1600E-4FGG484C

Xilinx

Xilinx XC3S1600E-4FGG484C FPGA offers 33192 logic cells, 3688 CLBs, and 1600000 gates. With a max clock frequency of 572 MHz, it is ideal for high-performance applications in various industries like telecommunications and aerospace.

FPGA

33192

376

294

3688

1600000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S1600E-4FGG484I by Xilinx

XC3S1600E-4FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

376

294

3688

1600000

572 MHz

0.76 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S1600E-5FGG484C by Xilinx

XC3S1600E-5FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

376

294

3688

1600000

657 MHz

0.66 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFE3-17EA-6FN484C by Lattice Semiconductor

LFE3-17EA-6FN484C

Lattice Semiconductor

Lattice Semiconductor's LFE3-17EA-6FN484C FPGA offers 17000 logic cells, 222 inputs/outputs, and a max clock frequency of 375 MHz. Ideal for applications requiring high-speed processing and complex logic functions in a compact package with a grid array style design.

FPGA

17000

222

222

375 MHz

0.379 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LFE3-17EA-6FN484I by Lattice Semiconductor

LFE3-17EA-6FN484I

Lattice Semiconductor

Lattice Semiconductor's LFE3-17EA-6FN484I FPGA offers 17000 logic cells, 222 inputs/outputs, and a max clock frequency of 375 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a grid array package style.

FPGA

17000

222

222

375 MHz

0.379 ns

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No