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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC7A200T-1FB484I by Xilinx

XC7A200T-1FB484I

Xilinx

The Xilinx XC7A200T-1FB484I is a FPGA with 215360 logic cells, 16825 CLBs, and 285 inputs/outputs. It operates b/w -40 to 100°C and has a max supply voltage of 1.05V. Ideal for applications requiring high-speed processing and programmable ICs in compact designs.

FPGA

215360

285

285

16825

1.27 ns

16825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

23 mm

23 mm

2.54 mm

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

XC7A200T-L2FBV484E by Xilinx

XC7A200T-L2FBV484E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: 1.51 ns;

FPGA

16825

1.51 ns

16825 CLBS

.9

.87 V

.93 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7K70T-1FBV484C by Xilinx

XC7K70T-1FBV484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

5125

0.74 ns

5125 CLBS

1

.97 V

1.03 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XA7A75T-1FGG484I by Xilinx

XA7A75T-1FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 5900;

FPGA

75520

285

285

5900

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XA7A75T-1FGG484Q by Xilinx

XA7A75T-1FGG484Q

Xilinx

XA7A75T-1FGG484Q by Xilinx is a FPGA with 75520 logic cells, 5900 CLBs, and 285 inputs/outputs. It operates at max frequency of 1098 MHz, suitable for automotive applications due to AEC-Q100 screening and HKMG technology.

FPGA

75520

285

285

5900

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA7A75T-2FGG484I by Xilinx

XA7A75T-2FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

75520

285

285

5900

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

5900 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XA7A100T-1FGG484I by Xilinx

XA7A100T-1FGG484I

Xilinx

XA7A100T-1FGG484I by Xilinx is a FPGA with 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. It operates at max frequency of 1098 MHz, ideal for high-performance applications in various industries like telecommunications and aerospace due to its advanced HKMG technology.

FPGA

101440

285

285

7925

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XA7A100T-2FGG484I by Xilinx

XA7A100T-2FGG484I

Xilinx

Xilinx XA7A100T-2FGG484I FPGA features 101440 logic cells, 7925 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with PLASTIC/EPOXY body material.

FPGA

101440

285

285

7925

1286 MHz

1.05 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

LCMXO3L-9400C-5BG484C by Lattice Semiconductor

LCMXO3L-9400C-5BG484C

Lattice Semiconductor

LCMXO3L-9400C-5BG484C by Lattice Semiconductor is a 1175 CLBs FPGA with max supply voltage of 3.465V and square package. Ideal for applications requiring high flexibility and customization in electronics design, operating b/w 0 to 85°C temperature range.

FPGA

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

Bottom

Ball

.8 mm

484

S-PBGA-B484

LCMXO3LF-9400C-6BG484C by Lattice Semiconductor

LCMXO3LF-9400C-6BG484C

Lattice Semiconductor

LCMXO3LF-9400C-6BG484C by Lattice Semiconductor is a 1175 CLBs FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring high flexibility and performance in a compact 19mm square GRID ARRAY package.

FPGA

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

Bottom

Ball

.8 mm

484

S-PBGA-B484

LCMXO3LF-9400C-6BG484I by Lattice Semiconductor

LCMXO3LF-9400C-6BG484I

Lattice Semiconductor

LCMXO3LF-9400C-6BG484I by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 9400 logic cells, 1175 CLBs, and 384 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 2.375V to 3.465V. Ideal for applications requiring high-performance programmable ICs in a compact GRID ARRAY package.

FPGA

9400

384

384

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

Bottom

Ball

.8 mm

484

S-PBGA-B484

XC7A75T-2FG484I by Xilinx

XC7A75T-2FG484I

Xilinx

Xilinx XC7A75T-2FG484I FPGA features 75520 logic cells, 5900 CLBs, and 285 inputs/outputs. It operates b/w -40 to 100°C and has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

75520

285

285

5900

5900 CLBS

It also has core voltage 0.9 V

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

XC7S100-1FGGA484C by Xilinx

XC7S100-1FGGA484C

Xilinx

The Xilinx XC7S100-1FGGA484C is a FPGA with 102400 logic cells, 8000 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

102400

400

400

8000

1098 MHz

1.27 ns

HKMG

8000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S100-1FGGA484I by Xilinx

XC7S100-1FGGA484I

Xilinx

Xilinx XC7S100-1FGGA484I FPGA features 102400 logic cells, 8000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 484 terminals.

FPGA

102400

400

400

8000

1098 MHz

1.27 ns

HKMG

8000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S100-2FGGA484C by Xilinx

XC7S100-2FGGA484C

Xilinx

Xilinx XC7S100-2FGGA484C FPGA features 102400 logic cells, 8000 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

102400

400

400

8000

1286 MHz

1.05 ns

HKMG

8000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S100-2FGGA484I by Xilinx

XC7S100-2FGGA484I

Xilinx

The Xilinx XC7S100-2FGGA484I is a FPGA with 102400 logic cells, 8000 CLBs, and max clock frequency of 1286 MHz. It operates in industrial temperature range (-40 to 100°C) and uses HKMG technology. Ideal for applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

102400

400

400

8000

1286 MHz

1.05 ns

HKMG

8000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S100-L1FGGA484I by Xilinx

XC7S100-L1FGGA484I

Xilinx

Xilinx XC7S100-L1FGGA484I FPGA features 102400 logic cells, 8000 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing with a wide operating temperature range from -40 to 100°C. Package style is grid array with plastic/epoxy material and ball terminals.

FPGA

102400

400

400

8000

1098 MHz

1.27 ns

HKMG

8000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S50-1FGGA484I by Xilinx

XC7S50-1FGGA484I

Xilinx

Xilinx XC7S50-1FGGA484I FPGA features 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a max operating temp of 100°C.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S50-2FGGA484C by Xilinx

XC7S50-2FGGA484C

Xilinx

The Xilinx XC7S50-2FGGA484C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

52160

250

250

4075

1286 MHz

1.05 ns

4075 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S50-2FGGA484I by Xilinx

XC7S50-2FGGA484I

Xilinx

The Xilinx XC7S50-2FGGA484I is a Field Programmable Gate Array with 52160 logic cells and 4075 CLBs. It operates at a max clock frequency of 1286 MHz, making it ideal for industrial applications requiring high-speed processing. With a package style of grid array and surface mount capability, this FPGA offers versatile programmability in various electronic systems.

FPGA

52160

250

250

4075

1286 MHz

1.05 ns

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S50-L1FGGA484I by Xilinx

XC7S50-L1FGGA484I

Xilinx

Xilinx XC7S50-L1FGGA484I FPGA offers 52160 logic cells, 4075 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a wide operating temperature range from -40 to 100°C.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S75-1FGGA484C by Xilinx

XC7S75-1FGGA484C

Xilinx

Xilinx XC7S75-1FGGA484C FPGA features 76800 logic cells, 6000 CLBs, and max clock freq of 1098 MHz. Ideal for applications requiring high-speed processing in a compact form factor with PLASTIC/EPOXY package material.

FPGA

76800

400

400

6000

1098 MHz

1.27 ns

HKMG

6000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S75-1FGGA484I by Xilinx

XC7S75-1FGGA484I

Xilinx

Xilinx XC7S75-1FGGA484I FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with surface mount technology.

FPGA

76800

400

400

6000

1098 MHz

1.27 ns

HKMG

6000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S75-2FGGA484C by Xilinx

XC7S75-2FGGA484C

Xilinx

Xilinx XC7S75-2FGGA484C FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package with surface mount technology.

FPGA

76800

400

400

6000

1286 MHz

1.05 ns

HKMG

6000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S75-2FGGA484I by Xilinx

XC7S75-2FGGA484I

Xilinx

Xilinx XC7S75-2FGGA484I FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 484 terminals.

FPGA

76800

400

400

6000

1286 MHz

1.05 ns

HKMG

6000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S75-L1FGGA484I by Xilinx

XC7S75-L1FGGA484I

Xilinx

Xilinx XC7S75-L1FGGA484I FPGA features 76800 logic cells, 6000 CLBs, and max clock freq of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor. Operates b/w -40 to 100 °C with low supply voltage range of 0.92-0.98 V.

FPGA

76800

400

400

6000

1098 MHz

1.27 ns

HKMG

6000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S100-1FGGA484Q by Xilinx

XC7S100-1FGGA484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

400

400

8000

1098 MHz

1.27 ns

HKMG

8000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S50-1FGGA484Q by Xilinx

XC7S50-1FGGA484Q

Xilinx

Xilinx XC7S50-1FGGA484Q FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1098 MHz. Ideal for automotive applications with a temperature range of -40 to 125 °C, this grid array package offers high performance in a compact design.

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7S75-1FGGA484Q by Xilinx

XC7S75-1FGGA484Q

Xilinx

Xilinx XC7S75-1FGGA484Q FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1098 MHz. Ideal for automotive applications with a temperature range of -40 to 125 °C, it offers high performance in a compact square package with 484 terminals.

FPGA

76800

400

400

6000

1098 MHz

1.27 ns

HKMG

6000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.44 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7A100T-1FG484I by Xilinx

XC7A100T-1FG484I

Xilinx

Xilinx XC7A100T-1FG484I FPGA features 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. Utilized in various applications due to its CMOS technology, with a max operating temperature of 100°C and a min of -40°C. Ideal for high-performance computing tasks requiring fast combinatorial delays.

FPGA

101440

285

285

7925

1.27 ns

CMOS

7925 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin/Lead

1 mm

484

S-PBGA-B484

e0

10CX085YU484E6G by Intel

10CX085YU484E6G

Intel

Intel's 10CX085YU484E6G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for applications requiring high-speed processing and low power consumption in a compact form factor.

FPGA

85000

188

188

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX085YU484I5G by Intel

10CX085YU484I5G

Intel

Intel's 10CX085YU484I5G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for industrial applications requiring high performance with a max operating temperature of 100°C.

FPGA

85000

188

188

31000

TSMC

31000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX105YU484E5G by Intel

10CX105YU484E5G

Intel

Intel's 10CX105YU484E5G FPGA boasts 104,000 logic cells and 38,000 CLBs. Operating at a max temp of 100°C, it features TSMC technology with 0.93V supply voltage. Ideal for applications requiring high-performance programmable ICs in a square grid array package.

FPGA

104000

188

188

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX105YU484I5G by Intel

10CX105YU484I5G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

104000

188

188

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX105YU484I6G by Intel

10CX105YU484I6G

Intel

Intel's 10CX105YU484I6G FPGA boasts 104,000 logic cells and TSMC technology. With 38,000 CLBs and 188 inputs/outputs, it operates in industrial settings with a temperature range of -40 to 100°C. Ideal for applications requiring high-performance programmable ICs in grid array packaging.

FPGA

104000

188

188

38000

TSMC

38000 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX150YU484E5G by Intel

10CX150YU484E5G

Intel

Intel's 10CX150YU484E5G FPGA boasts 150,000 logic cells and 54770 CLBs, utilizing TSMC technology. With 188 inputs/outputs, it operates at 0.87-0.93V and up to 100°C. Ideal for applications requiring high-performance programmable ICs in a grid array package.

FPGA

150000

188

188

54770

TSMC

54770 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX150YU484I6G by Intel

10CX150YU484I6G

Intel

Intel's 10CX150YU484I6G FPGA boasts 150,000 logic cells and TSMC technology. With 54770 CLBs, it operates in industrial settings with a temperature range of -40 to 100°C. Ideal for applications requiring high-performance programmable ICs.

FPGA

150000

188

188

54770

TSMC

54770 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX220YU484E5G by Intel

10CX220YU484E5G

Intel

Intel's 10CX220YU484E5G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at 0.93V with TSMC technology, it offers 188 inputs/outputs for versatile applications in electronics requiring high-speed processing and programmable ICs. With a wide temperature range of 0-100°C, it is ideal for industrial automation and telecommunications systems.

FPGA

220000

188

188

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CX220YU484I6G by Intel

10CX220YU484I6G

Intel

Intel's 10CX220YU484I6G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it features TSMC technology and supports industrial-grade applications. With 188 inputs/outputs and a supply voltage range of 0.87V to 0.93V, this grid array package is ideal for high-performance computing tasks.

FPGA

220000

188

188

80330

TSMC

80330 CLBS

.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CL016YU484C8G by Intel

10CL016YU484C8G

Intel

Intel's 10CL016YU484C8G FPGA features 963 CLBs, operates at 1.15-1.25V, and has a max temp of 85°C. Ideal for applications requiring high-speed data processing in industries like telecommunications and automotive.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

484

S-PBGA-B484

10CL016YF484C6G by Intel

10CL016YF484C6G

Intel

Intel's 10CL016YF484C6G is a Field Programmable Gate Array with 963 CLBs. Operating voltage range of 1.15V to 1.25V, suitable for applications requiring high flexibility and customization in electronics design. Features square package shape, grid array style, and surface mount compatibility for versatile integration in various electronic systems.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.4 mm

Bottom

Ball

1 mm

484

S-PBGA-B484

10CL016YF484C8G by Intel

10CL016YF484C8G

Intel

Intel's 10CL016YF484C8G is a FPGA with 963 CLBs, operating voltage of 1.15-1.25V, and temp range of 0-85°C. It features a grid array package style, square shape, and ball terminals. Ideal for applications requiring high flexibility and customization in electronic circuit design.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.4 mm

Bottom

Ball

1 mm

484

S-PBGA-B484

10CL016YF484I7G by Intel

10CL016YF484I7G

Intel

Intel 10CL016YF484I7G is a FPGA with 963 CLBs, operating at -40 to 100 °C. It has a max supply voltage of 1.25 V and package style in grid array shape. Ideal for industrial applications requiring high flexibility and programmability in electronic systems.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.4 mm

Bottom

Ball

1 mm

484

S-PBGA-B484

10CL016YU484C6G by Intel

10CL016YU484C6G

Intel

Intel's 10CL016YU484C6G FPGA features 963 CLBs, operates at 1.15-1.25V, and has a grid array package with 0.8mm terminal pitch. Ideal for applications requiring high flexibility and performance in a compact form factor, such as telecommunications equipment and industrial automation systems.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.05 mm

Bottom

Ball

.8 mm

484

S-PBGA-B484

10CL016YU484I7G by Intel

10CL016YU484I7G

Intel

Intel's 10CL016YU484I7G FPGA features 963 CLBs, operates at 1.15-1.25V, and withstands -40 to 100°C temperatures. Ideal for industrial applications requiring high customization and performance in a compact 19x19mm grid array package with 0.8mm terminal pitch.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.05 mm

Bottom

Ball

.8 mm

484

S-PBGA-B484

10CL016ZF484I8G by Intel

10CL016ZF484I8G

Intel

Intel's 10CL016ZF484I8G FPGA features 15408 logic cells, 963 CLBs, and 340 inputs/outputs. Ideal for industrial applications requiring a programmable IC with a max supply voltage of 1.03 V and operating temperature range from -40 to 100°C.

FPGA

15408

340

340

963

963 CLBS

-40 to 125 °C range is available as extended industrial

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.4 mm

BGA484,22X22,40

Bottom

Ball

1 mm

484

S-PBGA-B484

10CL016ZU484I8G by Intel

10CL016ZU484I8G

Intel

Intel's 10CL016ZU484I8G FPGA features 15408 logic cells, 963 CLBs, and 340 inputs/outputs. With a package style of grid array, it is ideal for industrial applications requiring high-performance programmable ICs in a compact form factor.

FPGA

15408

340

340

963

963 CLBS

-40 to 125 °C range is available as extended industrial

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.05 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

10CL040YF484C6G by Intel

10CL040YF484C6G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

2475

2475 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.4 mm

Bottom

Ball

1 mm

484

S-PBGA-B484