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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
MPF300TL-FCVG484I by Microchip Technology

MPF300TL-FCVG484I

Microchip Technology

MPF300TL-FCVG484I by Microchip Technology is a CMOS-based FPGA with 300,000 logic cells. It operates at a voltage range of 0.97V to 1.03V and has a max operating temperature of 100°C. This programmable IC is commonly used in applications requiring high-performance computing and advanced digital signal processing.

FPGA

300000

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

MPF300TLS-FCG484I by Microchip Technology

MPF300TLS-FCG484I

Microchip Technology

MPF300TLS-FCG484I by Microchip: 300K logic cells, CMOS tech, 244 inputs/outputs. Ideal for FPGA applications with a grid array package style and operating temp range of -40 to 100°C.

FPGA

300000

244

244

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.87 mm

BGA484,22X22,40

Bottom

Ball

1 mm

484

S-PBGA-B484

XC6SLX100-N3CSG484I by Xilinx

XC6SLX100-N3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

338

338

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100-N3FG484C by Xilinx

XC6SLX100-N3FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

326

326

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX100-N3FG484I by Xilinx

XC6SLX100-N3FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

326

326

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX100T-N3CSG484C by Xilinx

XC6SLX100T-N3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

296

296

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100T-N3CSG484I by Xilinx

XC6SLX100T-N3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

296

296

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100T-N3FG484C by Xilinx

XC6SLX100T-N3FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

296

296

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX100T-N3FG484I by Xilinx

XC6SLX100T-N3FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

296

296

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX100T-N3FGG484I by Xilinx

XC6SLX100T-N3FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

296

296

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX150-N3CSG484I by Xilinx

XC6SLX150-N3CSG484I

Xilinx

Xilinx XC6SLX150-N3CSG484I FPGA features 147443 logic cells, 11519 CLBs, and 338 inputs/outputs. Utilized in industrial applications, it operates at up to 806 MHz clock frequency with a combinatorial delay of 0.26 ns per CLB. With a max supply voltage of 1.26 V and operating temperature range from -40 to 100 °C, this FPGA is ideal for high-performance computing tasks.

FPGA

147443

338

338

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150-N3FG484C by Xilinx

XC6SLX150-N3FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

338

338

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX150-N3FG484I by Xilinx

XC6SLX150-N3FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

338

338

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX150-N3FGG484C by Xilinx

XC6SLX150-N3FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

338

338

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX150T-N3CSG484C by Xilinx

XC6SLX150T-N3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

147443

296

296

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150T-N3CSG484I by Xilinx

XC6SLX150T-N3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

147443

296

296

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150T-N3FG484C by Xilinx

XC6SLX150T-N3FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

296

296

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX150T-N3FG484I by Xilinx

XC6SLX150T-N3FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

296

296

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX150T-N3FGG484C by Xilinx

XC6SLX150T-N3FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

296

296

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX150T-N3FGG484I by Xilinx

XC6SLX150T-N3FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

147443

296

296

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX25-N3FG484C by Xilinx

XC6SLX25-N3FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

24051

266

266

1879

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX25T-N3FG484C by Xilinx

XC6SLX25T-N3FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

24051

250

250

1879

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX25T-N3FGG484C by Xilinx

XC6SLX25T-N3FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

24051

250

250

1879

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX45-N3CSG484C by Xilinx

XC6SLX45-N3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

43661

320

320

3411

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX45-N3FG484C by Xilinx

XC6SLX45-N3FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

43661

316

316

3411

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX45-N3FG484I by Xilinx

XC6SLX45-N3FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

43661

316

316

3411

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX45-N3FGG484C by Xilinx

XC6SLX45-N3FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

43661

316

316

3411

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX45T-N3FG484C by Xilinx

XC6SLX45T-N3FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

43661

296

296

3411

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX45T-N3FGG484C by Xilinx

XC6SLX45T-N3FGG484C

Xilinx

Xilinx XC6SLX45T-N3FGG484C FPGA features 43661 logic cells, 3411 CLBs, and 296 inputs/outputs. Operating at a max frequency of 806 MHz, it is ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation. With a compact square package style and low power consumption at 1.2V nominal voltage, it offers efficient performance in various electronic systems.

FPGA

43661

296

296

3411

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75-N3CSG484C by Xilinx

XC6SLX75-N3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

328

328

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-N3CSG484I by Xilinx

XC6SLX75-N3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

328

328

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-N3FG484C by Xilinx

XC6SLX75-N3FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

280

280

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX75-N3FG484I by Xilinx

XC6SLX75-N3FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

280

280

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX75-N3FGG484C by Xilinx

XC6SLX75-N3FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

280

280

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75-N3FGG484I by Xilinx

XC6SLX75-N3FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

280

280

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-N3CSG484I by Xilinx

XC6SLX75T-N3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

292

292

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-N3FG484C by Xilinx

XC6SLX75T-N3FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

268

268

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX75T-N3FGG484C by Xilinx

XC6SLX75T-N3FGG484C

Xilinx

Xilinx XC6SLX75T-N3FGG484C FPGA features 74637 logic cells, 5831 CLBs, and 268 inputs/outputs. Utilized in applications requiring high clock frequencies up to 806 MHz, with a max operating temperature of 85°C. Ideal for designs needing programmable ICs with low power consumption and compact form factor.

FPGA

74637

268

268

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A100T-L1FGG484I by Xilinx

XC7A100T-L1FGG484I

Xilinx

Xilinx XC7A100T-L1FGG484I is a FPGA with 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. It operates b/w -40 to 100°C, has a max supply voltage of 0.98V, and combinatorial delay of 1.27ns. Ideal for applications requiring high-speed processing in compact designs.

FPGA

101440

285

285

7925

1.27 ns

7925 CLBS

.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7A15T-1FGG484I by Xilinx

XC7A15T-1FGG484I

Xilinx

The Xilinx XC7A15T-1FGG484I is a Field Programmable Gate Array (FPGA) with 1300 CLBs and a max supply voltage of 1.05V. It features a grid array package style, operates in industrial temperatures (-40 to 100°C), and is suitable for applications requiring high-speed processing and programmable logic capabilities.

FPGA

1300

1.27 ns

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7A15T-2FGG484C by Xilinx

XC7A15T-2FGG484C

Xilinx

Xilinx XC7A15T-2FGG484C is a 1300 CLB FPGA with max supply voltage of 1.05V and combinatorial delay of 1.05ns. Ideal for applications requiring high-speed processing in compact form factors, such as IoT devices and industrial automation systems.

FPGA

1300

1.05 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7A15T-2FGG484I by Xilinx

XC7A15T-2FGG484I

Xilinx

The Xilinx XC7A15T-2FGG484I is a 1300 CLB FPGA with max supply voltage of 1.05V and combinatorial delay of 1.05ns. It is used in applications requiring high-speed processing and programmable logic capabilities, featuring a grid array package style for easy mounting on PCBs.

FPGA

1300

1.05 ns

1300 CLBS

1

.95 V

1.05 V

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7A15T-3FGG484E by Xilinx

XC7A15T-3FGG484E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Width: 23 mm;

FPGA

1300

0.94 ns

1300 CLBS

1

.95 V

1.05 V

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7A200T-L1FBG484I by Xilinx

XC7A200T-L1FBG484I

Xilinx

Xilinx XC7A200T-L1FBG484I is a FPGA with 215360 logic cells, 16825 CLBs, and 285 inputs/outputs. Operating b/w -40 to 100 °C, it's ideal for applications requiring high-speed processing and programmable ICs in compact spaces. Package style: Grid Array; Supply voltage range: 0.92V to 0.98V.

FPGA

215360

285

285

16825

1.27 ns

16825 CLBS

.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7A200T-L1SBG484I by Xilinx

XC7A200T-L1SBG484I

Xilinx

Xilinx XC7A200T-L1SBG484I is a FPGA with 215360 logic cells, 16825 CLBs, and 285 inputs/outputs. It operates b/w -40 to 100°C, has a max supply voltage of 0.98V, and uses PLASTIC/EPOXY package material. Ideal for applications requiring high-speed processing and customization in compact designs.

FPGA

215360

285

285

16825

1.27 ns

16825 CLBS

.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.44 mm

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

XC7A35T-L1FGG484I by Xilinx

XC7A35T-L1FGG484I

Xilinx

Xilinx XC7A35T-L1FGG484I is a 2600 CLB FPGA with 0.98V max supply voltage and 1.27ns combinatorial delay. Ideal for applications requiring high-speed processing in compact form factors, such as telecommunications equipment and industrial automation systems.

FPGA

2600

1.27 ns

2600 CLBS

.95

.92 V

.98 V

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7A50T-L1FGG484I by Xilinx

XC7A50T-L1FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Length: 23 mm;

FPGA

52160

250

250

4075

1.27 ns

4075 CLBS

.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

XC7K160T-L2FBG484I by Xilinx

XC7K160T-L2FBG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

12675

0.61 ns

12675 CLBS

.95

.93 V

.97 V

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.54 mm

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1