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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
LFXP2-17E-7FN484C by Lattice Semiconductor

LFXP2-17E-7FN484C

Lattice Semiconductor

LFXP2-17E-7FN484C by Lattice Semiconductor is a 17000 Logic Cell FPGA with 2125 CLBs, operating at max 435 MHz clock frequency. It uses CMOS technology, has 358 inputs/outputs, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs like IoT devices and communication systems.

FPGA

17000

358

358

2125

435 MHz

0.304 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S1400A-4FG484C by Xilinx

XC3S1400A-4FG484C

Xilinx

Xilinx XC3S1400A-4FG484C is a FPGA with 25344 logic cells, 2816 CLBs, and 1400000 gates. It operates at max frequency of 667 MHz and has 375 inputs and 288 outputs. Ideal for applications requiring high-speed processing like telecommunications and signal processing due to its advanced CMOS technology.

FPGA

25344

375

288

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S1400A-4FG484I by Xilinx

XC3S1400A-4FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

25344

375

288

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S1400A-4FGG484C by Xilinx

XC3S1400A-4FGG484C

Xilinx

The Xilinx XC3S1400A-4FGG484C is a FPGA with 25344 logic cells, 2816 CLBs, and 1400000 equivalent gates. It operates at a max frequency of 667 MHz and has 375 inputs and 288 outputs. Ideal for applications requiring high-speed processing in fields like telecommunications and industrial automation.

FPGA

25344

375

288

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S1400A-4FGG484I by Xilinx

XC3S1400A-4FGG484I

Xilinx

Xilinx XC3S1400A-4FGG484I FPGA offers 25344 logic cells, 2816 CLBs, and 1400000 gates. Ideal for industrial applications with a max clock frequency of 667 MHz, operating temperature range from -40 to 100°C, and a compact package size of 23x23 mm.

FPGA

25344

375

288

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S1400A-5FGG484C by Xilinx

XC3S1400A-5FGG484C

Xilinx

Xilinx XC3S1400A-5FGG484C FPGA features 25344 logic cells, 2816 CLBs, and 1400000 gates. Operating at a max frequency of 770 MHz, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a package style of grid array and surface mount compatibility, it offers versatile integration options.

FPGA

25344

375

288

2816

1400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S700A-4FG484C by Xilinx

XC3S700A-4FG484C

Xilinx

The Xilinx XC3S700A-4FG484C is a FPGA with 13248 logic cells, 1472 CLBs, and 700000 equivalent gates. It operates at a max frequency of 667 MHz and has 372 inputs and 288 outputs. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S700A-4FG484I by Xilinx

XC3S700A-4FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S700A-4FGG484C by Xilinx

XC3S700A-4FGG484C

Xilinx

Xilinx XC3S700A-4FGG484C FPGA features 13248 logic cells, 1472 CLBs, and 700000 equivalent gates. With a max clock frequency of 667 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S700A-4FGG484I by Xilinx

XC3S700A-4FGG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S700A-5FGG484C by Xilinx

XC3S700A-5FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3SD1800A-4CSG484C by Xilinx

XC3SD1800A-4CSG484C

Xilinx

The Xilinx XC3SD1800A-4CSG484C FPGA features 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. It operates at a max clock frequency of 250 MHz and is suitable for applications requiring high-speed processing and programmable ICs in commercial extended temperature environments.

FPGA

37440

309

249

4160

1800000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD1800A-4CSG484I by Xilinx

XC3SD1800A-4CSG484I

Xilinx

Xilinx XC3SD1800A-4CSG484I FPGA features 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. With a max clock frequency of 250 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

37440

309

249

4160

1800000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD1800A-5CSG484C by Xilinx

XC3SD1800A-5CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

37440

309

249

4160

1800000

280 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD3400A-4CS484C by Xilinx

XC3SD3400A-4CS484C

Xilinx

Xilinx XC3SD3400A-4CS484C FPGA features 53712 logic cells, 5968 CLBs, and 3400000 gates. Operating at a max frequency of 250 MHz, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a package style of grid array and dimensions of 19mm x 19mm, this device is suitable for surface mount designs in commercial extended temperature environments.

FPGA

53712

309

249

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Lead

.8 mm

484

S-PBGA-B484

e0

No

XC3SD3400A-4CS484I by Xilinx

XC3SD3400A-4CS484I

Xilinx

Xilinx XC3SD3400A-4CS484I FPGA features 53712 logic cells, 5968 CLBs, and 3400000 gates. With a max clock frequency of 250 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. The device operates at temperatures ranging from -40 to 100°C and supports supply voltages of 1.14V to 1.26V.

FPGA

53712

309

249

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Lead

.8 mm

484

S-PBGA-B484

e0

No

XC3SD3400A-4CSG484C by Xilinx

XC3SD3400A-4CSG484C

Xilinx

XC3SD3400A-4CSG484C by Xilinx is a FPGA with 53712 logic cells, 5968 CLBs, and 3400000 gates. It operates at max frequency of 250 MHz and supports up to 309 inputs and 249 outputs. Ideal for applications requiring high-speed processing such as telecommunications and industrial automation.

FPGA

53712

309

249

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD3400A-4CSG484I by Xilinx

XC3SD3400A-4CSG484I

Xilinx

XC3SD3400A-4CSG484I by Xilinx is a Field Programmable Gate Array (FPGA) with 53712 logic cells and 3400000 equivalent gates. It operates at a max clock frequency of 250 MHz and is commonly used in applications requiring high-performance programmable logic solutions.

FPGA

53712

309

249

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD3400A-5CSG484C by Xilinx

XC3SD3400A-5CSG484C

Xilinx

XC3SD3400A-5CSG484C by Xilinx is a Field Programmable Gate Array (FPGA) with 53,712 logic cells and 3,400,000 equivalent gates. It operates at a max clock frequency of 280 MHz and is commonly used in applications requiring high-speed data processing and programmable logic control.

FPGA

53712

309

249

5968

3400000

280 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3S700AN-4FG484C by Xilinx

XC3S700AN-4FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S700AN-4FG484I by Xilinx

XC3S700AN-4FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC3S700AN-4FGG484C by Xilinx

XC3S700AN-4FGG484C

Xilinx

Xilinx XC3S700AN-4FGG484C FPGA features 13248 logic cells, 1472 CLBs, and 700000 equivalent gates. It operates at a max frequency of 667 MHz with a combinatorial delay of 0.71 ns per CLB. Ideal for high-performance applications requiring fast processing speeds in telecommunications, aerospace, and industrial automation.

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S700AN-4FGG484I by Xilinx

XC3S700AN-4FGG484I

Xilinx

The Xilinx XC3S700AN-4FGG484I is a FPGA with 13248 logic cells, 1472 CLBs, and 700000 equivalent gates. It operates at a max frequency of 667 MHz and has a combinatorial delay of 0.71 ns. Ideal for industrial applications requiring high-speed processing in compact form factors.

FPGA

13248

372

288

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC3S700AN-5FGG484C by Xilinx

XC3S700AN-5FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

13248

372

288

1472

700000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XA3S1600E-4FGG484I by Xilinx

XA3S1600E-4FGG484I

Xilinx

XA3S1600E-4FGG484I by Xilinx is a FPGA with 33192 logic cells, 3688 CLBs, and 1600000 gates. Operating at 572 MHz, it's ideal for industrial applications requiring high-speed processing and low power consumption. With a max supply voltage of 1.26V and operating temperature range from -40 to 85°C, it offers reliable performance in various environments.

FPGA

33192

376

294

3688

1600000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XC3SD1800A-4CS484LI by Xilinx

XC3SD1800A-4CS484LI

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 1800000;

FPGA

37440

309

249

4160

1800000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Lead

.8 mm

484

S-PBGA-B484

e0

No

XC3SD1800A-4CSG484LI by Xilinx

XC3SD1800A-4CSG484LI

Xilinx

Xilinx XC3SD1800A-4CSG484LI FPGA features 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. With a max clock frequency of 250 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

37440

309

249

4160

1800000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 1800000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC3SD3400A-4CS484LI by Xilinx

XC3SD3400A-4CS484LI

Xilinx

The Xilinx XC3SD3400A-4CS484LI is a FPGA with 53712 logic cells, 5968 CLBs, and 3400000 equivalent gates. It operates at a max frequency of 250 MHz and has 309 inputs and 249 outputs. Ideal for applications requiring high-speed processing in industries like telecommunications and aerospace.

FPGA

53712

309

249

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Lead

.8 mm

484

S-PBGA-B484

e0

No

XC3SD3400A-4CSG484LI by Xilinx

XC3SD3400A-4CSG484LI

Xilinx

The Xilinx XC3SD3400A-4CSG484LI is a FPGA with 53712 logic cells, 5968 CLBs, and 3400000 equivalent gates. It operates at a max frequency of 250 MHz and has 309 inputs and 249 outputs. Ideal for applications requiring high-speed processing in fields like telecommunications and industrial automation.

FPGA

53712

309

249

5968

3400000

250 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

5968 CLBS, 3400000 Gates

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

19 mm

19 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6VLX130T-1FF484I by Xilinx

XC6VLX130T-1FF484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

240

240

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6VLX130T-1FFG484C by Xilinx

XC6VLX130T-1FFG484C

Xilinx

Xilinx XC6VLX130T-1FFG484C FPGA features 128000 logic cells, 240 inputs/outputs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

128000

240

240

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX130T-1FFG484I by Xilinx

XC6VLX130T-1FFG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

240

240

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX130T-2FFG484C by Xilinx

XC6VLX130T-2FFG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

240

240

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX130T-2FFG484I by Xilinx

XC6VLX130T-2FFG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

240

240

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX130T-L1FFG484C by Xilinx

XC6VLX130T-L1FFG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

240

240

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX75T-1FF484I by Xilinx

XC6VLX75T-1FF484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6VLX75T-1FFG484C by Xilinx

XC6VLX75T-1FFG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX75T-1FFG484I by Xilinx

XC6VLX75T-1FFG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX75T-2FF484C by Xilinx

XC6VLX75T-2FF484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6VLX75T-2FF484I by Xilinx

XC6VLX75T-2FF484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6VLX75T-2FFG484C by Xilinx

XC6VLX75T-2FFG484C

Xilinx

The Xilinx XC6VLX75T-2FFG484C is a CMOS FPGA with 74496 logic cells, 240 inputs/outputs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

74496

240

240

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX75T-2FFG484I by Xilinx

XC6VLX75T-2FFG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VLX75T-L1FFG484C by Xilinx

XC6VLX75T-L1FFG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

240

240

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX100-2CSG484C by Xilinx

XC6SLX100-2CSG484C

Xilinx

The Xilinx XC6SLX100-2CSG484C is a FPGA with 101261 logic cells, 7911 CLBs, and 320 inputs/outputs. It operates at max frequency of 667 MHz, suitable for high-speed applications like telecommunications and signal processing. With a package style of grid array and fine pitch, it offers versatile integration options in electronic designs.

FPGA

101261

320

320

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100-2CSG484I by Xilinx

XC6SLX100-2CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

320

320

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100-2FG484C by Xilinx

XC6SLX100-2FG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

326

326

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX100-2FG484I by Xilinx

XC6SLX100-2FG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

101261

326

326

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

No

XC6SLX100-2FGG484C by Xilinx

XC6SLX100-2FGG484C

Xilinx

Xilinx XC6SLX100-2FGG484C FPGA features 101261 logic cells, 7911 CLBs, and 326 inputs/outputs. Utilized in applications requiring high-speed processing up to 667 MHz with a max operating temperature of 85°C. Ideal for projects demanding versatile programmable ICs in a compact grid array package.

FPGA

101261

326

326

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No