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XC6SLX100-2FGG484C

Xilinx

XC6SLX100-2FGG484C by Xilinx

Xilinx XC6SLX100-2FGG484C FPGA features 101261 logic cells, 7911 CLBs, and 326 inputs/outputs. Utilized in applications requiring high-speed processing up to 667 MHz with a max operating temperature of 85°C. Ideal for projects demanding versatile programmable ICs in a compact grid array package.

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Overview

Unlock the potential of your projects with the XC6SLX100-2FGG484C by Xilinx, a top-tier Field Programmable Gate Array that offers unparalleled quality and versatility. Manufactured by the trusted name in FPGA technology, this device boasts over 100,000 logic cells, making it ideal for a wide range of applications. With a maximum clock frequency of 667 MHz and a myriad of inputs and outputs, the XC6SLX100-2FGG484C provides unparalleled performance and flexibility. Elevate your designs with this cutting-edge FPGA solution that delivers unmatched value and benefits to customers seeking innovation and reliability.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and flexibility, making the product suitable for a wide range of applications.

No. of Logic Cells:

101261 - With a large number of logic cells, this FPGA offers high processing power and flexibility for complex designs.

Surface Mount:

YES - The surface mount feature enables easy and secure installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage:

1.26 V - The high maximum supply voltage allows for efficient power management and optimization of performance.

No. of CLBs:

7911 - The abundance of Configurable Logic Blocks (CLBs) offers versatility and customization options for various design requirements.

Technology Used:

CMOS - The CMOS technology ensures low power consumption and high-speed performance, making the FPGA energy-efficient and reliable.

No. of Inputs:

326 - With a large number of inputs, this FPGA can accommodate multiple data sources and interfaces, enhancing its connectivity and functionality.

Package Shape:

SQUARE - The square package shape allows for efficient use of space on a circuit board, optimizing overall design layout and integration.

Form Of Terminal:

BALL - The ball terminals offer reliable connections and easy soldering, ensuring secure and stable electrical connections.

Nominal Supply Voltage (V):

1.2 - The nominal supply voltage of 1.2V ensures compatibility with standard power sources and allows for stable and consistent operation.

Power Supplies (V):

1.2,2.5/3.3 - The multiple power supply options provide flexibility in voltage requirements, catering to a variety of design specifications.

No. of Terminals:

484 - The abundance of terminals allows for efficient signal routing and connectivity, facilitating a seamless integration into circuit board designs.

Programmable IC Type:

FIELD PROGRAMMABLE GATE ARRAY - As an FPGA, this IC type offers reconfigurability and adaptability, allowing for easy customization and updates to the design.

Package Style (Meter):

GRID ARRAY - The grid array package style provides a compact and organized layout, simplifying the installation and maintenance of the FPGA.

Minimum Supply Voltage:

1.14 V - The low minimum supply voltage ensures energy efficiency and reliability, reducing power consumption and enhancing performance.

Maximum Operating Temperature:

85 °C - With a high maximum operating temperature, this FPGA can withstand demanding environmental conditions and ensure continuous operation under heat stress.

Pitch Of Terminal:

1 mm - The small pitch of terminals allows for a high-density integration of the FPGA onto circuit boards, optimizing space usage and design efficiency.

Maximum Combinatorial Delay of a CLB:

0.26 ns - The low combinatorial delay ensures fast and efficient logic processing in the FPGA, contributing to high-speed performance and responsiveness.

Organization:

7911 CLBS - The organized configuration of 7911 CLBs in the FPGA offers a structured and efficient design layout, enhancing performance and ease of use.

Minimum Operating Temperature:

0 °C - With a low minimum operating temperature, this FPGA can function reliably in cold environments, ensuring stable operation under varying temperature conditions.

Finishing Of Terminal Used:

TIN SILVER COPPER - The use of multiple finishing materials for terminals ensures corrosion resistance and reliable electrical connections, increasing the longevity and durability of the product.

Position Of Terminal:

BOTTOM - The bottom position of terminals simplifies the installation and maintenance of the FPGA on circuit boards, providing ease of access for soldering and connections.

Moisture Sensitivity Level (MSL):

3 - The MSL 3 rating indicates the level of protection against moisture and humidity, ensuring the durability and reliability of the FPGA in various environmental conditions.

Maximum Seated Height:

2.6 mm - The low seated height of 2.6 mm allows for a compact and slim profile of the FPGA, facilitating space-saving and efficient design integration.

Width:

23 mm - The width of 23 mm provides a balance between compactness and functionality, allowing for easy integration into various circuit board designs.

Maximum Clock Frequency:

667 MHz - With a high maximum clock frequency, this FPGA can process data at high speeds, enabling rapid and efficient operations for demanding applications.

No. of Outputs:

326 - The abundance of outputs allows for versatile signal routing and connectivity options, enhancing the flexibility and functionality of the FPGA.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time at peak reflow temperature of 30 seconds ensures safe and reliable soldering of the FPGA onto circuit boards, preventing damage and ensuring proper connections.

Peak Reflow Temperature °C:

250 - The peak reflow temperature of 250°C enables secure and efficient soldering of the FPGA terminals, ensuring stable and durable electrical connections.

Length:

23 mm - The length of 23 mm provides a compact form factor for the FPGA, allowing for versatile integration into a wide range of circuit board designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX100-2FGG484C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

101261

No. of Inputs:

326

No. of Outputs:

326

No. of CLBs:

7911

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

7911 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX100-2FGG484C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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