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LFXP2-40E-6FN484I

Lattice Semiconductor

LFXP2-40E-6FN484I by Lattice Semiconductor

LFXP2-40E-6FN484I by Lattice Semiconductor is a 40000 logic cell FPGA with 5000 CLBs, operating at max 435 MHz clock frequency. It uses CMOS technology, has 363 inputs/outputs, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment and industrial automation systems.

Median Price

$272.700

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Arrow

USA . 1,024 parts In-Stock

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$271.270

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$231.210

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Verical

USA . 4 parts In-Stock

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$272.700

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$231.320

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$231.320

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$231.320

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$272.700

$231.320

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$231.320

DigiKey

USA . 20 parts In-Stock

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$299.970

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$261.362

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$261.362

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Nova Conductors

Japan . 10 parts In-Stock

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$215.950

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Vyrian

USA . 3,874 parts In-Stock

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Chip Stock

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LIBRA Elektronik GmbH

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Vigor

Singapore . 1,200 parts In-Stock

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$140.760

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Aranea Global

USA . 1,000 parts In-Stock

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$211.631

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$203.166

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Continental Prestige Electronics

USA . 659 parts In-Stock

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$215.950

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$211.631

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Microchip USA

USA . 2,912 parts In-Stock

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$216.450

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Ampacity Inc.

Singapore . 19 parts In-Stock

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$230.720

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Argo Parts USA

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Overview

Unleash the power of cutting-edge technology with the LFXP2-40E-6FN484I by Lattice Semiconductor. This top-of-the-line Field Programmable Gate Array (FPGA) boasts 40000 logic cells, 5000 CLBs, and 363 inputs and outputs, making it a versatile solution for a wide range of applications. With a maximum clock frequency of 435 MHz and a maximum combinatorial delay of 0.399 ns, this FPGA delivers unmatched performance and precision. Trust in Lattice Semiconductor's reputation for quality and innovation, and elevate your projects to new heights with the LFXP2-40E-6FN484I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 40000

High number of logic cells allow for complex designs and implementations.

Surface Mount: YES

Ease of installation and compatibility with modern PCB designs.

Maximum Supply Voltage: 1.26 V

Efficient power consumption and higher voltage tolerance.

Technology Used: CMOS

Low power consumption and high noise immunity.

No. of Inputs: 363

Provides flexibility and scalability for input interfaces.

Package Shape: SQUARE

Optimal use of space and efficient layout in PCB designs.

Nominal Supply Voltage (V): 1.2

Stable voltage supply for reliable performance.

Power Supplies (V): 1.2,1.2/3.3,3.3

Compatibility with multiple power supply configurations for diverse applications.

No. of Terminals: 484

Sufficient number of terminals for connectivity and interface options.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Flexibility to customize logic functions without the need for physical changes.

Package Style (Meter): GRID ARRAY

Provides high density and efficient routing capabilities.

Minimum Supply Voltage: 1.14 V

Wide operating voltage range for adaptability in different scenarios.

Maximum Operating Temperature: 100 °C

Suitable for operation in high temperature environments.

Pitch Of Terminal: 1 mm

Allows for fine pitch designs and space-saving layouts.

Maximum Combinatorial Delay of a CLB: 0.399 ns

Low delay for faster signal processing and efficient operation.

Minimum Operating Temperature: -40 °C

Suitable for operation in low temperature environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Provides corrosion resistance and optimal electrical conductivity.

Position Of Terminal: BOTTOM

Ease of connectivity and PCB layout considerations.

Moisture Sensitivity Level (MSL): 3

Suitable for standard solder reflow processes.

Maximum Seated Height: 2.6 mm

Low profile design for compact system integration.

Width: 23 mm

Compact form factor for space-constrained applications.

Maximum Clock Frequency: 435 MHz

High clock frequency for fast data processing and operation.

No. of Outputs: 363

Provides flexibility and scalability for output interfaces.

Peak Reflow Temperature °C: 250

Suitable for lead-free soldering processes.

Length: 23 mm

Compact form factor for space-constrained applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFXP2-40E-6FN484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

40000

No. of Inputs:

363

No. of Outputs:

363

No. of CLBs:

5000

Maximum Clock Frequency:

435 MHz

CLB Maximum Delay:

0.399 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

250 °C (482 °F)

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LFXP2-40E-6FN484I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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