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484 Other Function uPs,uCs & Peripheral ICs 56

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XC7Z020-1CLG484C by Xilinx

XC7Z020-1CLG484C

Xilinx

XC7Z020-1CLG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05 V. This low profile, fine pitch chip in a grid array package is ideal for various applications requiring high performance and integration.

S-PBGA-B484

19 mm

484

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-1CLG484I by Xilinx

XC7Z020-1CLG484I

Xilinx

XC7Z020-1CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. This low profile chip in grid array package is ideal for various applications requiring high performance and compact design.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-2CLG484E by Xilinx

XC7Z020-2CLG484E

Xilinx

The Xilinx XC7Z020-2CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 484 terminals in a low profile grid array package, it's ideal for various embedded applications requiring high-performance processing capabilities.

S-PBGA-B484

19 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-2CLG484I by Xilinx

XC7Z020-2CLG484I

Xilinx

The Xilinx XC7Z020-2CLG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it is ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-3CLG484E by Xilinx

XC7Z020-3CLG484E

Xilinx

The Xilinx XC7Z020-3CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. This low profile chip in a square package is ideal for various applications requiring high performance and integration capabilities.

S-PBGA-B484

19 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-1FBG484C by Xilinx

XC7Z030-1FBG484C

Xilinx

XC7Z030-1FBG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0°C to 85°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, making it suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B484

23 mm

484

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-1FBG484I by Xilinx

XC7Z030-1FBG484I

Xilinx

The Xilinx XC7Z030-1FBG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 484 terminals, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B484

23 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-2FBG484E by Xilinx

XC7Z030-2FBG484E

Xilinx

XC7Z030-2FBG484E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, suitable for various applications requiring high-performance processing capabilities.

S-PBGA-B484

23 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-2FBG484I by Xilinx

XC7Z030-2FBG484I

Xilinx

The Xilinx XC7Z030-2FBG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, suitable for various applications requiring high-performance processing capabilities.

S-PBGA-B484

23 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-3FBG484E by Xilinx

XC7Z030-3FBG484E

Xilinx

The Xilinx XC7Z030-3FBG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 484 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessors and peripheral ICs.

S-PBGA-B484

23 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

M82710-14 by Mindspeed Technologies

M82710-14

Mindspeed Technologies

Mindspeed Technologies' M82710-14 is a CMOS microprocessor circuit with 484 terminals in a grid array package. It operates b/w -25°C to 110°C, suitable for various applications requiring high-performance processing capabilities in compact form factors. The surface-mountable rectangular package makes it ideal for space-constrained designs.

R-PBGA-B484

484

110 Cel

-25 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

OTHER

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

XA7Z020-1CLG484Q by Xilinx

XA7Z020-1CLG484Q

Xilinx

XA7Z020-1CLG484Q by Xilinx is a MICROPROCESSOR CIRCUIT with 484 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Features include 1.8V power supply, 0.8mm terminal pitch, and TIN SILVER COPPER finish.

S-PBGA-B484

e1

19 mm

3

484

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

N

19 mm

MICROPROCESSOR CIRCUIT

XA7Z030-1FBG484I by Xilinx

XA7Z030-1FBG484I

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Ultraviolet Erasable: N;

S-PBGA-B484

e1

23 mm

4

484

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

250

1,1.8

Not Qualified

AEC-Q100

2.54 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

N

23 mm

MICROPROCESSOR CIRCUIT

XA7Z030-1FBG484Q by Xilinx

XA7Z030-1FBG484Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B484

e1

23 mm

4

484

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

250

1,1.8

Not Qualified

AEC-Q100

2.54 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

N

23 mm

MICROPROCESSOR CIRCUIT

XC7Z020-L1CLG484I by Xilinx

XC7Z020-L1CLG484I

Xilinx

XC7Z020-L1CLG484I by Xilinx is a CMOS technology System on Chip (SoC) with 484 terminals. It operates at a voltage range of 0.95V to 1.05V and has a max seated height of 1.6mm. This versatile IC is commonly used in various applications requiring low profile, fine pitch grid array packages.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-L2FBG484I by Xilinx

XC7Z030-L2FBG484I

Xilinx

XC7Z030-L2FBG484I by Xilinx is a CMOS technology System on Chip (SoC) with 484 terminals and a package size of 23mm x 23mm. It operates at a supply voltage range of 0.95V to 1.05V and can withstand temperatures from -40°C to 100°C. This versatile IC is commonly used in various applications requiring high-performance microcontrollers and peripheral integration.

S-PBGA-B484

23 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XA7Z030-1FBV484Q by Xilinx

XA7Z030-1FBV484Q

Xilinx

The Xilinx XA7Z030-1FBV484Q is a CMOS microprocessor circuit with 484 ball terminals. It operates in automotive-grade temperatures (-40 to 125 °C) and is AEC-Q100 screened. This square grid array package is ideal for automotive applications requiring high-performance processing capabilities.

S-PBGA-B484

484

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

AEC-Q100

YES

CMOS

AUTOMOTIVE

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

XCZU2CG-1SBVA484E by Xilinx

XCZU2CG-1SBVA484E

Xilinx

XCZU2CG-1SBVA484E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for various applications requiring high-performance processing in a compact form factor.

R-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-1SBVA484I by Xilinx

XCZU2CG-1SBVA484I

Xilinx

XCZU2CG-1SBVA484I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-2SBVA484I by Xilinx

XCZU2CG-2SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2CG-L1SBVA484I by Xilinx

XCZU2CG-L1SBVA484I

Xilinx

XCZU2CG-L1SBVA484I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature range of -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. This GRID ARRAY package with 484 terminals is suitable for various applications requiring high-performance processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-1SBVA484E by Xilinx

XCZU2EG-1SBVA484E

Xilinx

XCZU2EG-1SBVA484E by Xilinx is a CMOS PROGRAMMABLE SoC with 484 BALL terminals. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing in compact form factors.

R-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU2EG-1SBVA484I by Xilinx

XCZU2EG-1SBVA484I

Xilinx

The Xilinx XCZU2EG-1SBVA484I is a programmable SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. With 484 terminals in a grid array package, it's ideal for industrial applications requiring high-performance processing capabilities.

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU2EG-3SBVA484E by Xilinx

XCZU2EG-3SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.9 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-L1SBVA484I by Xilinx

XCZU2EG-L1SBVA484I

Xilinx

The Xilinx XCZU2EG-L1SBVA484I is a programmable SoC with CMOS technology. It operates in industrial temperature range (-40 to 100 °C) and has 484 terminals in a grid array package. With a supply voltage range of 0.698V to 0.742V, it's suitable for various applications requiring high-performance processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU3CG-1SBVA484E by Xilinx

XCZU3CG-1SBVA484E

Xilinx

XCZU3CG-1SBVA484E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has 0.825-0.876 V supply voltage range. Suitable for applications requiring high-performance processing in a compact form factor.

R-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-1SBVA484I by Xilinx

XCZU3CG-1SBVA484I

Xilinx

XCZU3CG-1SBVA484I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-2SBVA484I by Xilinx

XCZU3CG-2SBVA484I

Xilinx

XCZU3CG-2SBVA484I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This industrial-grade IC in grid array package is ideal for various applications requiring high-performance processing capabilities.

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-L1SBVA484I by Xilinx

XCZU3CG-L1SBVA484I

Xilinx

XCZU3CG-L1SBVA484I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature range of -40 to 100 °C and has a max supply voltage of 0.742 V. This GRID ARRAY package with 484 terminals is ideal for applications requiring high-performance processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-L2SBVA484E by Xilinx

XCZU3CG-L2SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B484

e1

4

484

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-1SBVA484E by Xilinx

XCZU3EG-1SBVA484E

Xilinx

The Xilinx XCZU3EG-1SBVA484E is a programmable SoC with CMOS technology. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. With 484 terminals in a grid array package, it's ideal for various applications requiring high-performance microprocessors and peripheral ICs.

R-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU3EG-1SBVA484I by Xilinx

XCZU3EG-1SBVA484I

Xilinx

XCZU3EG-1SBVA484I by Xilinx is a programmable SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. With 484 terminals in a grid array package, it's ideal for industrial applications requiring high-performance processing capabilities.

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU3EG-2SBVA484I by Xilinx

XCZU3EG-2SBVA484I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU3EG-L1SBVA484I by Xilinx

XCZU3EG-L1SBVA484I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU2CG-2SBVA484E by Xilinx

XCZU2CG-2SBVA484E

Xilinx

XCZU2CG-2SBVA484E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high performance and low power consumption in compact designs.

R-PBGA-B484

e1

19 mm

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

2.61 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

XCZU3EG-2SBVA484E by Xilinx

XCZU3EG-2SBVA484E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B484

e1

19 mm

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

2.61 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

19 mm

PROGRAMMABLE SoC

XAZU2EG-1SBVA484Q by Xilinx

XAZU2EG-1SBVA484Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B484

e1

19 mm

3

484

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

XC7Z014S-1CLG484C by Xilinx

XC7Z014S-1CLG484C

Xilinx

XC7Z014S-1CLG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. This low profile chip in a square package is ideal for various applications requiring high performance and compact design.

S-PBGA-B484

19 mm

484

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z014S-1CLG484I by Xilinx

XC7Z014S-1CLG484I

Xilinx

XC7Z014S-1CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With a grid array package style, it's ideal for applications requiring low profile and fine pitch components.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z014S-2CLG484E by Xilinx

XC7Z014S-2CLG484E

Xilinx

The Xilinx XC7Z014S-2CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and integration capabilities.

S-PBGA-B484

19 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z014S-2CLG484I by Xilinx

XC7Z014S-2CLG484I

Xilinx

XC7Z014S-2CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. This package, measuring 19mm x 19mm, features a grid array style and is ideal for various applications requiring low profile, fine pitch ICs.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-1FB484I by Xilinx

XC7Z030-1FB484I

Xilinx

PROGRAMMABLE SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B484

23 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z030-2FB484I by Xilinx

XC7Z030-2FB484I

Xilinx

PROGRAMMABLE SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

S-PBGA-B484

23 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

PROGRAMMABLE SYSTEM ON CHIP

MPFS025T-FCVG484I by Microchip Technology

MPFS025T-FCVG484I

Microchip Technology

Microchip Technology's MPFS025T-FCVG484I is a 484-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.97V to 1.03V. This square-shaped IC in grid array package is ideal for various applications requiring fine pitch surface mount technology.

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

2.92 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

PROGRAMMABLE SoC

MPFS250T-1FCVG484E by Microchip Technology

MPFS250T-1FCVG484E

Microchip Technology

The Microchip Technology MPFS250T-1FCVG484E is a SoC peripheral IC with CMOS technology. It operates b/w 0°C to 100°C, with a supply voltage range of 0.97V to 1.03V. This grid array IC, measuring 19mm x 19mm, is ideal for applications requiring fine pitch and surface mount capabilities.

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

S-PBGA-B484

19 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

2.92 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SoC

MPFS250TFCVG484E by Microchip Technology

MPFS250TFCVG484E

Microchip Technology

MPFS250TFCVG484E by Microchip Tech features 484 terminals, operates b/w 0-100°C, and has a supply voltage range of 0.97-1.03V. This SoC peripheral IC in a grid array package is ideal for applications requiring fine pitch technology and CMOS design.

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

S-PBGA-B484

19 mm

484

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

2.92 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SoC

MPFS250TFCVG484I by Microchip Technology

MPFS250TFCVG484I

Microchip Technology

Microchip Technology's MPFS250TFCVG484I is a 484-terminal SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.97V to 1.03V. The grid array package is square-shaped, measuring 19mm x 19mm, suitable for various uPs and uCs applications.

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

2.92 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SoC

MPFS250TS-1FCVG484I by Microchip Technology

MPFS250TS-1FCVG484I

Microchip Technology

MPFS250TS-1FCVG484I by Microchip: 484-terminal SoC IC with CMOS tech. Operates b/w -40 to 100°C, voltage range of 0.97V to 1.03V. Ideal for applications requiring fine pitch grid array package style in plastic/epoxy material.

ALSO OPERATES AT 1.05V NOMINAL SUPPLY

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

2.92 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SoC