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400 Other Function uPs,uCs & Peripheral ICs 28

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XC7Z010-1CLG400C by Xilinx

XC7Z010-1CLG400C

Xilinx

XC7Z010-1CLG400C by Xilinx is a 400-terminal, low-profile, fine-pitch grid array package with a max supply voltage of 1.05V. It is a system-on-chip (SoC) peripheral IC that operates in temperatures ranging from 0 to 85°C. This versatile device is commonly used in various applications requiring high-performance computing and integrated functionality.

S-PBGA-B400

e1

17 mm

3

400

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-1CLG400I by Xilinx

XC7Z010-1CLG400I

Xilinx

The Xilinx XC7Z010-1CLG400I is a System on Chip with 400 terminals, operating b/w -40 to 100 °C. It features a low profile grid array package style and CMOS technology, suitable for various applications requiring high performance in a compact form factor. With a supply voltage range of 0.95V to 1.05V, it is ideal for projects demanding efficient power consumption and advanced processing capabilities.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-2CLG400E by Xilinx

XC7Z010-2CLG400E

Xilinx

The Xilinx XC7Z010-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact form factors.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-2CLG400I by Xilinx

XC7Z010-2CLG400I

Xilinx

XC7Z010-2CLG400I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z010-3CLG400E by Xilinx

XC7Z010-3CLG400E

Xilinx

XC7Z010-3CLG400E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. This low-profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-1CLG400I by Xilinx

XC7Z020-1CLG400I

Xilinx

The Xilinx XC7Z020-1CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-2CLG400E by Xilinx

XC7Z020-2CLG400E

Xilinx

The Xilinx XC7Z020-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact designs.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-3CLG400E by Xilinx

XC7Z020-3CLG400E

Xilinx

The Xilinx XC7Z020-3CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B400

e1

17 mm

3

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XA7Z010-1CLG400I by Xilinx

XA7Z010-1CLG400I

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA400,20X20,32;

S-PBGA-B400

e1

17 mm

3

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

N

17 mm

MICROPROCESSOR CIRCUIT

XA7Z010-1CLG400Q by Xilinx

XA7Z010-1CLG400Q

Xilinx

XA7Z010-1CLG400Q by Xilinx is a MICROPROCESSOR CIRCUIT with 400 terminals in a GRID ARRAY package. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. The CMOS technology, low profile design, and fine pitch make it ideal for compact electronic systems.

S-PBGA-B400

e1

17 mm

3

400

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

N

17 mm

MICROPROCESSOR CIRCUIT

XA7Z020-1CLG400I by Xilinx

XA7Z020-1CLG400I

Xilinx

XA7Z020-1CLG400I by Xilinx is a MICROPROCESSOR CIRCUIT with 400 terminals in a GRID ARRAY package. It operates at 1-1.8V, CMOS technology, and has a terminal pitch of 0.8mm. Ideal for applications requiring low profile and fine pitch components in automotive electronics or industrial control systems.

S-PBGA-B400

e1

17 mm

3

400

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

N

17 mm

MICROPROCESSOR CIRCUIT

XA7Z020-1CLG400Q by Xilinx

XA7Z020-1CLG400Q

Xilinx

XA7Z020-1CLG400Q by Xilinx is an automotive-grade microprocessor circuit with 400 terminals in a low-profile grid array package. Operating b/w -40 to 125°C, it features power supplies of 1V and 1.8V, making it ideal for automotive applications requiring high-performance computing capabilities.

S-PBGA-B400

e1

17 mm

3

400

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

N

17 mm

MICROPROCESSOR CIRCUIT

MCIMX6X1CVO08AC by NXP Semiconductors

MCIMX6X1CVO08AC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;

24MHZ NOMINAL FREQUENCY AVAILABLE

S-PBGA-B400

e1

17 mm

3

400

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

1.5 V

1.275 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MCIMX6X3CVK08AC by NXP Semiconductors

MCIMX6X3CVK08AC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;

24MHZ NOMINAL FREQUENCY AVAILABLE

S-PBGA-B400

e1

14 mm

3

400

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

1.5 V

1.275 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

XC7Z010-L1CLG400I by Xilinx

XC7Z010-L1CLG400I

Xilinx

XC7Z010-L1CLG400I by Xilinx is a 400-terminal System on Chip with CMOS technology. It operates b/w -40°C to 100°C, with supply voltage ranging from 0.95V to 1.05V. This low-profile, fine-pitch IC is ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B400

17 mm

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-L1CLG400I by Xilinx

XC7Z020-L1CLG400I

Xilinx

The Xilinx XC7Z020-L1CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 400 terminals in a low profile grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B400

17 mm

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z007S-1CLG400C by Xilinx

XC7Z007S-1CLG400C

Xilinx

The Xilinx XC7Z007S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch designs in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B400

17 mm

400

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z007S-2CLG400E by Xilinx

XC7Z007S-2CLG400E

Xilinx

The Xilinx XC7Z007S-2CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components.

S-PBGA-B400

17 mm

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z007S-2CLG400I by Xilinx

XC7Z007S-2CLG400I

Xilinx

The Xilinx XC7Z007S-2CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This low profile chip has 400 terminals and is ideal for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B400

17 mm

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z014S-1CLG400C by Xilinx

XC7Z014S-1CLG400C

Xilinx

The Xilinx XC7Z014S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 400 terminals in a low profile grid array package, it's ideal for various embedded applications.

S-PBGA-B400

17 mm

400

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z014S-1CLG400I by Xilinx

XC7Z014S-1CLG400I

Xilinx

XC7Z014S-1CLG400I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile, fine pitch grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B400

17 mm

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z014S-2CLG400E by Xilinx

XC7Z014S-2CLG400E

Xilinx

The Xilinx XC7Z014S-2CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring low profile and fine pitch grid array packages in Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B400

17 mm

400

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z014S-2CLG400I by Xilinx

XC7Z014S-2CLG400I

Xilinx

The Xilinx XC7Z014S-2CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 400 terminals in a low profile grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B400

17 mm

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

MCIMX6X1EVO10AC by NXP Semiconductors

MCIMX6X1EVO10AC

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

S-PBGA-B400

e1

17 mm

3

400

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

SoC

MCIMX6X3EVN10AC by NXP Semiconductors

MCIMX6X3EVN10AC

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B400

e1

17 mm

3

400

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

SoC

MCIMX6X3EVO10AC by NXP Semiconductors

MCIMX6X3EVO10AC

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Length: 17 mm;

S-PBGA-B400

e1

17 mm

3

400

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

1.5 V

1.35 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

17 mm

SoC

CC-WMX-J97C-TN by Digi International

CC-WMX-J97C-TN

Digi International

CC-WMX-J97C-TN by Digi International is a 400-terminal microprocessor circuit with CMOS technology. It operates b/w -20°C to 70°C, in a square grid array package style measuring 50mm x 50mm. Ideal for applications requiring high-performance processing in compact spaces.

S-XBGA-N400

50 mm

400

70 Cel

-20 Cel

UNSPECIFIED

LGA

SQUARE

GRID ARRAY

YES

CMOS

OTHER

NO LEAD

2 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

CC-WMX-L87C-TE by Digi International

CC-WMX-L87C-TE

Digi International

CC-WMX-L87C-TE by Digi International is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 400 terminals in a SQUARE GRID ARRAY package style, suitable for INDUSTRIAL applications. Operating temperature ranges from -40 to 85°C, making it ideal for various embedded systems requiring high performance.

S-XBGA-N400

50 mm

400

85 Cel

-40 Cel

UNSPECIFIED

LGA

SQUARE

GRID ARRAY

YES

CMOS

INDUSTRIAL

NO LEAD

2 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT