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BALL Microprocessors 758

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan CPU Family Maximum Clock Frequency DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width Peripheral IC Type Data EEPROM Size Connectivity
MCIMX6D6AVT10ADR by NXP Semiconductors

MCIMX6D6AVT10ADR

NXP Semiconductors

MCIMX6D6AVT10ADR by NXP Semiconductors is a 32-bit microprocessor with integrated cache, suitable for automotive applications. It features a grid array package style with 624 terminals and operates b/w -40 to 125°C. The processor utilizes RISC technology, has a terminal pitch of 0.8mm, and supports boundary scan testing.

64-BIT BUS WIDTH AVAILABLE

32

YES

FIXED POINT

YES

S-PBGA-B624

e1

21 mm

NO

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

T2080NXE8TTB by NXP Semiconductors

T2080NXE8TTB

NXP Semiconductors

The NXP Semiconductors T2080NXE8TTB microprocessor features a 64-bit architecture, integrated cache, and operates at speeds up to 1800 rpm. Ideal for industrial applications, this CMOS technology-based processor has a temperature range of -40 to 105°C and comes in a square package with 896 terminals for surface mount assembly.

64

NO

FIXED POINT

YES

S-PBGA-B896

e1

25 mm

NO

3

896

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR, RISC

XAM5728BABCXE by Texas Instruments

XAM5728BABCXE

Texas Instruments

XAM5728BABCXE by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and max clock frequency of 38.4 MHz. It is used in applications requiring low power mode, such as embedded systems and IoT devices.

16

YES

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.55 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

D6417750RBA240HVU0 by Renesas Electronics

D6417750RBA240HVU0

Renesas Electronics

Renesas Electronics D6417750RBA240HVU0 microprocessor features 32-bit architecture, 64-bit external data bus width, and 34 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing with low power consumption. Terminal pitch of 1.27 mm and integrated cache make it suitable for compact designs in various electronic devices.

26

32

YES

34 MHz

64

FLOATING POINT

YES

S-PBGA-B256

27 mm

YES

3

256

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

2.6 mm

240 rpm

1.6 V

1.35 V

1.5 V

YES

CMOS

INDUSTRIAL

BALL

1.27 mm

BOTTOM

27 mm

MICROPROCESSOR, RISC

PCIMX6Q6AVT10AC by NXP Semiconductors

PCIMX6Q6AVT10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; Length: 21 mm;

32

S-PBGA-B624

e1

21 mm

3

624

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.16 mm

1000 rpm

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6DP4AVT1AA by NXP Semiconductors

MCIMX6DP4AVT1AA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6DP6AVT1AA by NXP Semiconductors

MCIMX6DP6AVT1AA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP4AVT1AA by NXP Semiconductors

MCIMX6QP4AVT1AA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP4AVT8AA by NXP Semiconductors

MCIMX6QP4AVT8AA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

852 rpm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP6AVT1AA by NXP Semiconductors

MCIMX6QP6AVT1AA

NXP Semiconductors

MCIMX6QP6AVT1AA by NXP Semiconductors is a 32-bit microprocessor with integrated cache and a max supply voltage of 1.5V. It is commonly used in automotive applications due to its temperature grade, low power mode, and boundary scan capability.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

X66AK2G02ZBB60 by Texas Instruments

X66AK2G02ZBB60

Texas Instruments

X66AK2G02ZBB60 by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and integrated cache. It operates at a max clock frequency of 26 MHz and is suitable for low power mode applications in various industries.

16

YES

26 MHz

32

FLOATING POINT

YES

S-PBGA-B625

21 mm

YES

625

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.7 mm

600 rpm

.95 V

.85 V

.9 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

21 mm

MICROPROCESSOR, RISC

MCIMX7D7DVK10SC by NXP Semiconductors

MCIMX7D7DVK10SC

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE; Bit Size: 32;

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B488

12 mm

YES

3

488

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1000 rpm

1.155 V

1.045 V

1.1 V

YES

CMOS

BALL

.4 mm

BOTTOM

40

12 mm

MICROPROCESSOR, RISC

MCIMX7S3DVK08SC by NXP Semiconductors

MCIMX7S3DVK08SC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

SEATED-HGT CALCULATED

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B488

12 mm

YES

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

800 rpm

1.155 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

MICROPROCESSOR, RISC

MCIMX7S3EVK08SC by NXP Semiconductors

MCIMX7S3EVK08SC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

SEATED-HGT CALCULATED

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B488

12 mm

YES

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

800 rpm

1.155 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

MICROPROCESSOR, RISC

MCIMX7S5EVM08SC by NXP Semiconductors

MCIMX7S5EVM08SC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE;

SEATED-HGT CALCULATED

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B541

19 mm

YES

3

541

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.42 mm

800 rpm

1.155 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

AM5726BABCXAR by Texas Instruments

AM5726BABCXAR

Texas Instruments

The Texas Instruments AM5726BABCXAR is a microprocessor with 32-bit external data bus width, operating at a max clock frequency of 38.4 MHz. It features a package style of grid array, fine pitch and is suitable for industrial applications requiring low power mode and high-speed processing capabilities.

16

YES

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.55 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

AM5726BABCXA by Texas Instruments

AM5726BABCXA

Texas Instruments

The Texas Instruments AM5726BABCXA microprocessor features a 32-bit external data bus width, operates at a max clock frequency of 38.4 MHz, and has an industrial temperature grade. It is commonly used in applications requiring high-speed processing and low power consumption, such as industrial automation systems and embedded computing devices.

16

YES

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.55 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

AM5726BABCXEA by Texas Instruments

AM5726BABCXEA

Texas Instruments

AM5726BABCXEA by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and max clock frequency of 38.4 MHz. It is used in industrial applications requiring low power mode and features CMOS technology for efficient performance.

16

YES

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.55 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

AM5726BABCX by Texas Instruments

AM5726BABCX

Texas Instruments

AM5726BABCX by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and max clock frequency of 38.4 MHz. It is used in applications requiring low power mode and features a CMOS technology with RISC architecture for efficient processing.

16

YES

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.55 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

AM5728BABCXA by Texas Instruments

AM5728BABCXA

Texas Instruments

AM5728BABCXA by Texas Instruments is a microprocessor with 32-bit external data bus width, operating at max 38.4 MHz clock frequency. Ideal for industrial applications, it features a low power mode and operates in an extended temperature range from -40 to 105°C.

16

YES

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.55 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

AM5728BABCXEA by Texas Instruments

AM5728BABCXEA

Texas Instruments

The Texas Instruments AM5728BABCXEA microprocessor features 32-bit external data bus width, 16-bit address bus width, and a max clock frequency of 38.4 MHz. Ideal for industrial applications requiring high-speed processing in a compact package with low power mode capability.

16

YES

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.55 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

AM5728BABCX by Texas Instruments

AM5728BABCX

Texas Instruments

The Texas Instruments AM5728BABCX microprocessor features 32-bit external data bus width, 16-bit address bus width, and a max clock frequency of 38.4 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and automotive electronics.

16

YES

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.55 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

AM3351BZCEA30 by Texas Instruments

AM3351BZCEA30

Texas Instruments

AM3351BZCEA30 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.65 mm.

16

32

YES

26 MHz

16

FIXED POINT

YES

S-PBGA-B298

e1

13 mm

YES

3

64

298

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

131072

1.3 mm

300 rpm

400 mA

1.144 V

1.056 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR, RISC

MPC8535AVJANGA by NXP Semiconductors

MPC8535AVJANGA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE;

16

32

YES

64

FIXED POINT

YES

S-PBGA-B783

e2

29 mm

YES

3

783

90 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

2.76 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

1 mm

BOTTOM

40

29 mm

MICROPROCESSOR

MPC8535BVJANGA by NXP Semiconductors

MPC8535BVJANGA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE;

16

32

YES

64

FIXED POINT

YES

S-PBGA-B783

e2

29 mm

YES

3

783

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

2.76 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

1 mm

BOTTOM

40

29 mm

MICROPROCESSOR

T4081NSE7PQB by NXP Semiconductors

T4081NSE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NSE7QTB by NXP Semiconductors

T4081NSE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Integrated Cache: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NSE7TTB by NXP Semiconductors

T4081NSE7TTB

NXP Semiconductors

The NXP Semiconductors T4081NSE7TTB microprocessor features a 64-bit external data bus width, 16-bit address bus width, and a max clock frequency of 133.3 MHz. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems and IoT devices.

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NSN7PQB by NXP Semiconductors

T4081NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Length: 45 mm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NSN7QTB by NXP Semiconductors

T4081NSN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NSN7TTB by NXP Semiconductors

T4081NSN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Speed: 1800 rpm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NXE7PQB by NXP Semiconductors

T4081NXE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NXE7QTB by NXP Semiconductors

T4081NXE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; External Data Bus Width: 64;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NXE7TTB by NXP Semiconductors

T4081NXE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NXN7PQB by NXP Semiconductors

T4081NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Integrated Cache: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NXN7QTB by NXP Semiconductors

T4081NXN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1932;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NXN7TTB by NXP Semiconductors

T4081NXN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4160NSE7TTB by NXP Semiconductors

T4160NSE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4160NSN7TTB by NXP Semiconductors

T4160NSN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSE7PQB by NXP Semiconductors

T4161NSE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSE7QTB by NXP Semiconductors

T4161NSE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSE7TTB by NXP Semiconductors

T4161NSE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSN7PQB by NXP Semiconductors

T4161NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Boundary Scan: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSN7QTB by NXP Semiconductors

T4161NSN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSN7TTB by NXP Semiconductors

T4161NSN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXE7PQB by NXP Semiconductors

T4161NXE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXE7QTB by NXP Semiconductors

T4161NXE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXE7TTB by NXP Semiconductors

T4161NXE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Width: 45 mm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC