Loading...

BALL Microprocessors 758

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan CPU Family Maximum Clock Frequency DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width Peripheral IC Type Data EEPROM Size Connectivity
BSC9131NSN1KHKB,557 by NXP Semiconductors

BSC9131NSN1KHKB,557

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 520; Package Code: FBGA; Package Shape: SQUARE;

16

32

YES

32

FIXED POINT

YES

S-PBGA-B520

21 mm

YES

520

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

1.97 mm

1000 rpm

1.05 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

21 mm

MICROPROCESSOR, RISC

P1014NSN5FFA,557 by NXP Semiconductors

P1014NSN5FFA,557

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Length: 19 mm;

0

32

YES

100 MHz

0

FLOATING POINT

YES

S-PBGA-B425

19 mm

YES

425

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR, RISC

P5010NXN7TNB,557 by NXP Semiconductors

P5010NXN7TNB,557

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Integrated Cache: YES;

16

YES

166 MHz

64

FIXED POINT

YES

S-PBGA-B1295

37.5 mm

YES

1295

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

3.53 mm

1800 rpm

1.15 V

1.05 V

1.1 V

YES

CMOS

BALL

1 mm

BOTTOM

37.5 mm

MICROPROCESSOR, RISC

P5020NSN1QMB,557 by NXP Semiconductors

P5020NSN1QMB,557

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

16

YES

166 MHz

64

FIXED POINT

YES

S-PBGA-B1295

37.5 mm

YES

1295

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

3.53 mm

1600 rpm

1.15 V

1.05 V

1.1 V

YES

CMOS

BALL

1 mm

BOTTOM

37.5 mm

MICROPROCESSOR, RISC

P5020NXN7QMB,557 by NXP Semiconductors

P5020NXN7QMB,557

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;

16

YES

166 MHz

64

FIXED POINT

YES

S-PBGA-B1295

37.5 mm

YES

1295

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

3.53 mm

1600 rpm

1.15 V

1.05 V

1.1 V

YES

CMOS

BALL

1 mm

BOTTOM

37.5 mm

MICROPROCESSOR, RISC

T1023NXE7PQA by NXP Semiconductors

T1023NXE7PQA

NXP Semiconductors

The NXP Semiconductors T1023NXE7PQA microprocessor features a 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for industrial applications requiring high-speed processing with low power consumption. Package style is grid array with fine pitch terminals for compact design.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T2080NXE8MQLB by NXP Semiconductors

T2080NXE8MQLB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

64

NO

FIXED POINT

YES

S-PBGA-B896

NO

3

896

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA896(UNSPEC)

SQUARE

GRID ARRAY

250

1200 rpm

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

30

MICROPROCESSOR, RISC

T2080NXN8P1B by NXP Semiconductors

T2080NXN8P1B

NXP Semiconductors

T2080NXN8P1B by NXP Semiconductors is a 64-bit microprocessor with integrated cache. It is surface mountable and has 896 terminals in a grid array package style. This industrial-grade processor operates at temperatures ranging from -40 to 105°C and is suitable for various applications requiring high-speed processing.

64

NO

FIXED POINT

YES

S-PBGA-B896

e1

NO

3

896

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA896(UNSPEC)

SQUARE

GRID ARRAY

250

1533 rpm

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR, RISC

MIMXRT1051DVJ6B by NXP Semiconductors

MIMXRT1051DVJ6B

NXP Semiconductors

NXP Semiconductors' MIMXRT1051DVJ6B is a 32-bit microprocessor with integrated cache, 524288 RAM words, and 29 serial I/Os. Ideal for low power applications, it operates at up to 24 MHz clock frequency and features boundary scan technology. With a package style of grid array, this CMOS processor is suitable for various embedded systems requiring high-speed data processing.

0

32

YES

24 MHz

0

FLOATING-POINT

YES

S-PBGA-B196

e2

12 mm

YES

3

32

0

29

196

8

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

524288

1.52 mm

600 rpm

105 mA

1.3 V

1.25 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

12 mm

MICROPROCESSOR, RISC

STM32MP151AAD3T by STMicroelectronics

STM32MP151AAD3T

STMicroelectronics

STM32MP151AAD3T by STMicroelectronics is a 32-bit microprocessor with a max clock frequency of 48 MHz and operates b/w -40 °C to 125 °C. It features integrated cache, low power mode, and supports automotive applications. Ideal for advanced embedded systems requiring efficiency and reliability.

"TERM PITCH-MAX"

32

YES

48 MHz

FLOATING-POINT

YES

S-PBGA-B257

10 mm

YES

48

8

257

8

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA257,19X19,25/20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

724992

1.2 mm

650 rpm

100 mA

1.25 V

1.18 V

1.2 V

YES

CMOS

AUTOMOTIVE

BALL

.65 mm

BOTTOM

NOT SPECIFIED

10 mm

MICROPROCESSOR, RISC

STM32MP151AAB3T by STMicroelectronics

STM32MP151AAB3T

STMicroelectronics

STM32MP151AAB3T by STMicroelectronics is a 32-bit microprocessor with integrated cache and 48 MHz clock frequency. It features 724992 RAM words, 26-bit address bus width, and low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.

26

32

YES

48 MHz

16

FLOATING POINT

YES

S-PBGA-B354

16 mm

YES

48

8

354

8

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA354,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

724992

1.29 mm

650 rpm

940 mA

1.25 V

1.18 V

1.2 V

YES

CMOS

BALL

.8 mm

BOTTOM

NOT SPECIFIED

16 mm

MICROPROCESSOR, RISC

STM32MP151AAC3T by STMicroelectronics

STM32MP151AAC3T

STMicroelectronics

STM32MP151AAC3T by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz and integrated cache. It operates b/w -40 °C to 125 °C, making it ideal for industrial applications. Its low power mode and extensive I/O support enhance versatility in embedded systems.

26

32

YES

48 MHz

16

FLOATING POINT

YES

S-PBGA-B361

12 mm

YES

48

8

361

8

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA361,23X23,25/20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

724992

1.2 mm

650 rpm

940 mA

1.25 V

1.18 V

1.2 V

YES

CMOS

BALL

.65 mm

BOTTOM

NOT SPECIFIED

12 mm

MICROPROCESSOR, RISC

STM32MP151AAD3 by STMicroelectronics

STM32MP151AAD3

STMicroelectronics

STM32MP151AAD3 by STMicroelectronics is a 32-bit microprocessor with 48MHz clock frequency, 724992 RAM words, and 1.2V nominal voltage. Ideal for low power applications, it features 8 serial I/Os and 48 DMA channels in a compact square package suitable for various embedded systems.

26

32

YES

48 MHz

16

FLOATING POINT

YES

S-PBGA-B257

10 mm

YES

48

8

257

8

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA257,19X19,25/20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

724992

1.2 mm

650 rpm

940 mA

1.25 V

1.18 V

1.2 V

YES

CMOS

BALL

.65 mm

BOTTOM

NOT SPECIFIED

10 mm

MICROPROCESSOR, RISC

STM32MP151AAA3T by STMicroelectronics

STM32MP151AAA3T

STMicroelectronics

STM32MP151AAA3T by STMicroelectronics is a 32-bit microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 48 MHz, suitable for low power applications in various industries such as IoT, automotive, and consumer electronics. With a package style of grid array and low profile, it offers high performance in a compact form factor.

26

32

YES

48 MHz

16

FLOATING POINT

YES

S-PBGA-B448

e2

18 mm

YES

3

48

8

448

8

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA448,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

724992

1.32 mm

650 rpm

940 mA

1.25 V

1.18 V

1.2 V

YES

CMOS

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

.8 mm

BOTTOM

30

18 mm

MICROPROCESSOR, RISC

STM32MP151DAA1 by STMicroelectronics

STM32MP151DAA1

STMicroelectronics

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 448; Package Code: LFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA448,22X22,32;

26

32

YES

48 MHz

16

FLOATING POINT

YES

S-PBGA-B448

18 mm

YES

48

8

448

8

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA448,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

724992

1.32 mm

800 rpm

955 mA

1.38 V

1.3 V

1.34 V

YES

CMOS

BALL

.8 mm

BOTTOM

18 mm

MICROPROCESSOR, RISC

STM32MP151DAB1 by STMicroelectronics

STM32MP151DAB1

STMicroelectronics

STM32MP151DAB1 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 48 MHz max clock frequency. It features 354 terminals, 724992 RAM words, and operates in low power mode. Ideal for applications requiring high-speed processing in compact devices with low power consumption.

26

32

YES

48 MHz

16

FLOATING POINT

YES

S-PBGA-B354

16 mm

YES

48

8

354

8

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA354,19X19,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

724992

1.29 mm

800 rpm

955 mA

1.38 V

1.3 V

1.34 V

YES

CMOS

BALL

.8 mm

BOTTOM

16 mm

MICROPROCESSOR, RISC

STM32MP157DAC1 by STMicroelectronics

STM32MP157DAC1

STMicroelectronics

STM32MP157DAC1 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 64 MHz clock frequency. Ideal for industrial applications, it features 48 DMA channels, low power mode, and operates in a temperature range of -20 to 105 °C.

26

32

YES

64 MHz

0

FLOATING POINT

YES

S-PBGA-B361

12 mm

YES

48

361

8

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

724992

1.2 mm

800 rpm

865 mA

1.25 V

.85 V

.9 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

12 mm

MICROPROCESSOR, RISC

STM32MP157DAA1 by STMicroelectronics

STM32MP157DAA1

STMicroelectronics

STM32MP157DAA1 by STMicroelectronics is a 32-bit microprocessor with 64 MHz clock frequency, 448 terminals, and 724992 RAM words. Ideal for industrial applications, it features low power mode, boundary scan support, and 48 DMA channels for efficient data transfer.

26

32

YES

64 MHz

0

FLOATING POINT

YES

S-PBGA-B448

18 mm

YES

48

448

8

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA448,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

724992

1.32 mm

800 rpm

865 mA

1.25 V

.85 V

.9 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

18 mm

MICROPROCESSOR, RISC

OSD3358-512M-IND by Octavo Systems

OSD3358-512M-IND

Octavo Systems

OSD3358-512M-IND by Octavo Systems is a microprocessor with 8-bit RAM and 28-bit address bus. It features a grid array package, operates in industrial temperature range (-40 to 85 °C), and has a supply voltage of 1.1V. Ideal for applications requiring high-speed processing in compact spaces.

64kbytes shared l3 ram also available

28

YES

16

FIXED POINT

NO

S-PBGA-B400

27 mm

NO

4

1

400

8

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA400,20X20,50

SQUARE

GRID ARRAY

245

65536

2.6 mm

1000 rpm

2000 mA

1.1 V

YES

CMOS

INDUSTRIAL

BALL

1.27 mm

BOTTOM

27 mm

MICROPROCESSOR, RISC

MC8640HJ1250HE by NXP Semiconductors

MC8640HJ1250HE

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1023; Package Code: HBGA; Package Shape: SQUARE;

32

32

YES

166.66 MHz

32

FLOATING POINT

YES

S-CBGA-B1023

33 mm

NO

3

4

1023

105 Cel

0 Cel

CERAMIC

HBGA

BGA1023,32X32,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

2.97 mm

1250 rpm

1.1 V

1 V

1.05 V

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

30

33 mm

MICROPROCESSOR, RISC

MC8640DTHJ1250HE by NXP Semiconductors

MC8640DTHJ1250HE

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1023; Package Code: HBGA; Package Shape: SQUARE;

32

32

YES

166.66 MHz

32

FLOATING POINT

YES

S-CBGA-B1023

33 mm

NO

3

4

1023

105 Cel

-40 Cel

CERAMIC

HBGA

BGA1023,32X32,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

2.97 mm

1250 rpm

1.1 V

1 V

1.05 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

33 mm

MICROPROCESSOR, RISC

MC8640DHJ1067NE by NXP Semiconductors

MC8640DHJ1067NE

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1023; Package Code: HBGA; Package Shape: SQUARE;

32

32

YES

166.66 MHz

32

FLOATING POINT

YES

S-CBGA-B1023

33 mm

NO

3

4

1023

105 Cel

0 Cel

CERAMIC

HBGA

BGA1023,32X32,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

2.97 mm

1067 rpm

1 V

.9 V

.95 V

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

30

33 mm

MICROPROCESSOR, RISC

LX2080SC72029B by NXP Semiconductors

LX2080SC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SN71826B by NXP Semiconductors

LX2080SN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XC71826B by NXP Semiconductors

LX2080XC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XC72029B by NXP Semiconductors

LX2080XC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XE72232B by NXP Semiconductors

LX2080XE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XN72029B by NXP Semiconductors

LX2080XN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SN71826B by NXP Semiconductors

LX2120SN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SN72029B by NXP Semiconductors

LX2120SN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XC72029B by NXP Semiconductors

LX2120XC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XN71826B by NXP Semiconductors

LX2120XN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XN72029B by NXP Semiconductors

LX2120XN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SC72029B by NXP Semiconductors

LX2160SC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160SC72232B by NXP Semiconductors

LX2160SC72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XE71826B by NXP Semiconductors

LX2160XE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XE72029B by NXP Semiconductors

LX2160XE72029B

NXP Semiconductors

NXP Semiconductors' LX2160XE72029B microprocessor features 64-bit architecture, 128-bit external data bus width, and 36-bit address bus. Ideal for industrial applications requiring high-speed processing with low power consumption. Package style is a grid array with a max operating temperature of 105°C.

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SN72029B by NXP Semiconductors

LX2080SN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XE71826B by NXP Semiconductors

LX2080XE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SC71826B by NXP Semiconductors

LX2120SC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SE71826B by NXP Semiconductors

LX2120SE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SE72029B by NXP Semiconductors

LX2120SE72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120SN72232B by NXP Semiconductors

LX2120SN72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XE72029B by NXP Semiconductors

LX2120XE72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SC72232B by NXP Semiconductors

LX2080SC72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SE71826B by NXP Semiconductors

LX2080SE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080SN72232B by NXP Semiconductors

LX2080SN72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XN72232B by NXP Semiconductors

LX2080XN72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC