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STM32MP151AAA3T

STMicroelectronics

STM32MP151AAA3T by STMicroelectronics

STM32MP151AAA3T by STMicroelectronics is a 32-bit microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 48 MHz, suitable for low power applications in various industries such as IoT, automotive, and consumer electronics. With a package style of grid array and low profile, it offers high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Martec Srl

Italy . 75,525 parts In-Stock

1+ parts

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75,525

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Cyclops Electronics Ltd

UK . 62,000 parts In-Stock

1+ parts

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62,000

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HZD GmbH

Germany . 24,000 parts In-Stock

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24,000

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Vyrian

USA . 3,309 parts In-Stock

1+ parts

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3,309

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Anansix

USA . 2,218 parts In-Stock

1+ parts

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2,218

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Digiode

USA . 1,537 parts In-Stock

1+ parts

-

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1,537

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Nova Conductors

Japan . 20 parts In-Stock

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-

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,826 parts In-Stock

1+ parts

$8.560

100+ parts

-

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10k+ parts

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3,826

$8.560

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iBuyXS LLC

. 5,000 parts In-Stock

1+ parts

$10.500

100+ parts

-

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5,000

$10.500

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AZTECH Wire

Italy . 298 parts In-Stock

1+ parts

$14.695

100+ parts

-

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298

$14.695

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Ampacity Inc.

Singapore . 2,616 parts In-Stock

1+ parts

$23.000

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-

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2,616

$23.000

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Microchip USA

USA . 3,312 parts In-Stock

1+ parts

$28.715

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3,312

$28.715

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IDEA Electronic Components Group

UK . 729 parts In-Stock

1+ parts

$71.337

100+ parts

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$64.203

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729

$71.337

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$64.203

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MKK Technologies

India . 220 parts In-Stock

1+ parts

$134.144

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220

$134.144

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DigiPath Technology Company

USA . 220 parts In-Stock

1+ parts

$134.144

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220

$134.144

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Eastek

USA . 79,500 parts In-Stock

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$11.040

10k+ parts

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79,500

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$11.040

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BidChips

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 3,179 parts In-Stock

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3,179

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Parana Technologies

USA . 1,546 parts In-Stock

1+ parts

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100+ parts

$85.294

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1,546

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$85.294

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Aranea Global

USA . 50 parts In-Stock

1+ parts

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50

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Overview

Discover the STM32MP151AAA3T by STMicroelectronics, a top-quality microprocessor that offers unmatched performance and reliability. Designed by the reputable manufacturer, STMicroelectronics, this product is perfect for a wide range of applications. With integrated cache and low power mode, this microprocessor provides exceptional value and benefits to customers looking for efficient and high-speed processing capabilities. Upgrade your projects with the STM32MP151AAA3T and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this microprocessor lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having integrated cache enhances the performance of the microprocessor by reducing access time to frequently used data, improving overall system efficiency.

Maximum Supply Voltage: 1.25 V

Operating at a maximum supply voltage of 1.25 V ensures energy efficiency and helps in minimizing power consumption.

On Chip Data RAM Width: 8

With a data RAM width of 8 bits, this microprocessor can handle and process data effectively, contributing to smooth operations and fast execution.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor, this product is optimized for performance-critical applications, offering efficient execution of instructions.

Technology: CMOS

Utilizing CMOS technology enables this microprocessor to operate at low power levels while delivering high performance, making it suitable for energy-efficient applications.

Technical Specifications

Microprocessors STM32MP151AAA3T attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B448

JESD-609 Code:

e2

Length:

18 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

48

No. of Serial I/Os:

8

No. of Terminals:

448

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA448,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

724992

Maximum Seated Height:

1.32 mm

Speed:

650 rpm

Maximum Supply Current:

940 mA

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.18 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

18 mm

Peripheral IC Type:

Trade Compliance

STM32MP151AAA3T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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