Loading...

INDUSTRIAL Microprocessors 294

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan CPU Family Maximum Clock Frequency DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width Peripheral IC Type Data EEPROM Size Connectivity
ATSAMA5D27C-CN by Microchip Technology

ATSAMA5D27C-CN

Microchip Technology

Microchip's ATSAMA5D27C-CN is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at up to 24 MHz, suitable for industrial applications requiring low power mode. The package style is grid array, low profile, fine pitch, making it ideal for compact designs.

ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED

26

32

YES

24 MHz

16

FLOATING POINT

YES

S-PBGA-B289

14 mm

YES

32

1

289

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

131072

1.4 mm

500 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

14 mm

MICROPROCESSOR, RISC

ATSAMA5D27C-CU by Microchip Technology

ATSAMA5D27C-CU

Microchip Technology

ATSAMA5D27C-CU by Microchip Technology is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power mode. The package style is grid array, low profile, fine pitch, making it ideal for compact designs.

ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED

26

32

YES

24 MHz

16

FLOATING POINT

YES

S-PBGA-B289

14 mm

YES

32

1

289

8

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

131072

1.4 mm

500 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

14 mm

MICROPROCESSOR, RISC

ATSAMA5D225C-D1M-CU by Microchip Technology

ATSAMA5D225C-D1M-CU

Microchip Technology

ATSAMA5D225C-D1M-CU by Microchip Technology is a microprocessor with integrated cache and a max clock frequency of 24 MHz. It is used in industrial applications, has a temperature range of -40 to 85 °C, and features low power mode for energy efficiency.

0

16

YES

24 MHz

0

FIXED POINT

YES

S-PBGA-B196

e2

11 mm

YES

51

1

196

16

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA196,14X14,30

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

65536

1.2 mm

500 rpm

1.3 V

1.14 V

1.2 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER NICKEL

BALL

.75 mm

BOTTOM

11 mm

MICROPROCESSOR, RISC

ATSAMA5D41B-CU by Microchip Technology

ATSAMA5D41B-CU

Microchip Technology

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

26

32

YES

50 MHz

16

FLOATING POINT

YES

S-PBGA-B289

14 mm

YES

32

1

2

289

8

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

131072

TS 16949

1.4 mm

600 rpm

1.32 V

1.16 V

1.26 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

14 mm

MICROPROCESSOR, RISC

ATSAMA5D42B-CU by Microchip Technology

ATSAMA5D42B-CU

Microchip Technology

ATSAMA5D42B-CU by Microchip Technology is a 32-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 50 MHz, suitable for industrial applications requiring low power mode and high-speed processing. The package style is grid array, thin profile, fine pitch, making it ideal for compact designs in automotive or embedded systems.

26

32

YES

50 MHz

32

FLOATING POINT

YES

S-PBGA-B361

16 mm

YES

32

1

2

361

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

131072

TS 16949

1.2 mm

600 rpm

1.32 V

1.16 V

1.26 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

16 mm

MICROPROCESSOR, RISC

ATSAMA5D44B-CU by Microchip Technology

ATSAMA5D44B-CU

Microchip Technology

ATSAMA5D44B-CU by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 50 MHz clock frequency, and 32 DMA channels. Ideal for industrial applications, it features low power mode, floating point format, and RISC technology for efficient processing.

26

32

YES

50 MHz

32

FLOATING POINT

YES

S-PBGA-B361

16 mm

YES

32

1

2

361

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA361,19X19,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

131072

TS 16949

1.2 mm

600 rpm

1.32 V

1.16 V

1.26 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

16 mm

MICROPROCESSOR, RISC

MCIMX6L2EVN10AC by NXP Semiconductors

MCIMX6L2EVN10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; Package Code: TFBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;

S-PBGA-B

e1

13 mm

3

105 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.5 V

1.375 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

40

13 mm

MICROPROCESSOR, RISC

MCIMX6L3EVN10AC by NXP Semiconductors

MCIMX6L3EVN10AC

NXP Semiconductors

MCIMX6L3EVN10AC by NXP Semiconductors is a MICROPROCESSOR with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.375V to 1.5V. Ideal for industrial applications requiring high performance in a compact GRID ARRAY package.

S-PBGA-B

e1

13 mm

3

105 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.5 V

1.375 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

40

13 mm

MICROPROCESSOR, RISC

AMIC120BZDNA30 by Texas Instruments

AMIC120BZDNA30

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 491; Package Code: LFBGA; Package Shape: SQUARE;

ALSO HAVING 28-BIT ADDRESS AND 16-BIT DATA OF GPMC

16

32

YES

32

FIXED POINT

YES

S-PBGA-B491

e1

17 mm

YES

3

64

4

491

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

524288

0

1.3 mm

300 rpm

600 mA

1.144 V

1.056 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

17 mm

MICROPROCESSOR, RISC

0

CAN, ETHERNET, I2C, SPI(2), UART, USB

STA1080EOA by STMicroelectronics

STA1080EOA

STMicroelectronics

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;

YES

FIXED POINT

YES

S-PBGA-B361

16 mm

NO

361

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.7 mm

450 rpm

1.26 V

1.14 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

16 mm

MICROPROCESSOR, RISC

STA1090HOA by STMicroelectronics

STA1090HOA

STMicroelectronics

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;

YES

FIXED POINT

YES

S-PBGA-B361

16 mm

NO

361

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.7 mm

533 rpm

1.26 V

1.14 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

16 mm

MICROPROCESSOR, RISC

T2081NXE8MQLB by NXP Semiconductors

T2081NXE8MQLB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXE8P1B by NXP Semiconductors

T2081NXE8P1B

NXP Semiconductors

The NXP Semiconductors T2081NXE8P1B microprocessor features a 64-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates in temperatures ranging from -40 to 105°C and offers low power mode for energy efficiency.

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXE8PTB by NXP Semiconductors

T2081NXE8PTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXE8T1B by NXP Semiconductors

T2081NXE8T1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXE8TTB by NXP Semiconductors

T2081NXE8TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8MQLB by NXP Semiconductors

T2081NXN8MQLB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8P1B by NXP Semiconductors

T2081NXN8P1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8PTB by NXP Semiconductors

T2081NXN8PTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8T1B by NXP Semiconductors

T2081NXN8T1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NXN8TTB by NXP Semiconductors

T2081NXN8TTB

NXP Semiconductors

The NXP Semiconductors T2081NXN8TTB microprocessor features a 64-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with low power mode support. The package style is grid array with 780 terminals in a square shape.

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

FS32V232BMN1VUB by NXP Semiconductors

FS32V232BMN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V234BJN1VUB by NXP Semiconductors

FS32V234BJN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

e2

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V234BLN1VUB by NXP Semiconductors

FS32V234BLN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

e2

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V234BMN1VUB by NXP Semiconductors

FS32V234BMN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

e2

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V234CKN1VUB by NXP Semiconductors

FS32V234CKN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

e2

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

2.44 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V234CMN1VUB by NXP Semiconductors

FS32V234CMN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

e2

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V234CON1VUB by NXP Semiconductors

FS32V234CON1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

e2

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

2.44 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

SVF311R3K2CKU2 by NXP Semiconductors

SVF311R3K2CKU2

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: HLFQFP; Package Shape: SQUARE;

0

YES

0

FLOATING POINT

YES

S-PQFP-G176

e3

24 mm

YES

3

176

85 Cel

-40 Cel

PLASTIC/EPOXY

HLFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

260

1.6 mm

266 rpm

1.26 V

1.16 V

1.23 V

YES

CMOS

INDUSTRIAL

TIN

GULL WING

.5 mm

QUAD

40

24 mm

MICROPROCESSOR, RISC

CP3CN37VVAWQX/NOPB by Texas Instruments

CP3CN37VVAWQX/NOPB

Texas Instruments

CP3CN37VVAWQX/NOPB by Texas Instruments is a Microprocessor with 20-bit Address Bus, 16-bit External Data Bus, and Integrated Cache. It operates b/w -40 to 85°C, suitable for industrial applications requiring low power consumption and high-speed processing. The package style is flatpack with matte tin terminal finish, making it ideal for surface mount assembly in compact electronic devices.

20

YES

16

FIXED POINT

YES

S-PQFP-G144

e3

20 mm

YES

3

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

1.6 mm

96 rpm

3.7 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

MATTE TIN

GULL WING

.5 mm

QUAD

30

20 mm

MICROPROCESSOR, RISC

LS1043AXE7QQB by NXP Semiconductors

LS1043AXE7QQB

NXP Semiconductors

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V NOMINAL SUPPLY

16

64

YES

32

FIXED POINT

YES

S-PBGA-B621

e1

21 mm

YES

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1600 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SoC

SAM9X60D5M-I/4FB by Microchip Technology

SAM9X60D5M-I/4FB

Microchip Technology

SAM9X60D5M-I/4FB by Microchip Technology is a microprocessor with 16 DMA channels, 50 MHz clock frequency, and 1.8V nominal voltage. Ideal for industrial applications requiring low power mode, it features a CMOS technology, 233 terminals in a grid array package style, and operates b/w -40 to 85 °C temperature range.

512-Mbit DDR2--SDRAM AVAILABLE

6

YES

50 MHz

16

FIXED POINT

YES

R-PBGA-B233

e1

14 mm

YES

3

16

233

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA233,17X17,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

260

69632

1.2 mm

600 rpm

1.9 V

1.7 V

1.8 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

14 mm

MICROPROCESSOR, RISC

AT97SC3205T-H3M4C00B by Microchip Technology

AT97SC3205T-H3M4C00B

Microchip Technology

Microchip AT97SC3205T-H3M4C00B is an 8-bit RISC microprocessor with CMOS technology. It operates b/w -40 to 85°C, ideal for industrial applications. The chip carrier package has a very thin profile, measures 4x4 mm, and requires a nominal voltage of 3.3V.

0

8

NO

0

FIXED POINT

NO

S-PQCC-N32

4 mm

NO

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.16SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.4 mm

QUAD

4 mm

MICROPROCESSOR, RISC

AT97SC3205T-H3M4C10B by Microchip Technology

AT97SC3205T-H3M4C10B

Microchip Technology

Microchip Technology's AT97SC3205T-H3M4C10B is an 8-bit RISC microprocessor with 32 terminals in a square chip carrier package. Operating at -40 to 85°C, it has a nominal voltage of 3.3V and CMOS technology. Ideal for industrial applications requiring a compact, surface-mount solution with very thin profile and no-lead terminal form.

0

8

NO

0

FIXED POINT

NO

S-PQCC-N32

4 mm

NO

32

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC32,.16SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

.4 mm

QUAD

4 mm

MICROPROCESSOR, RISC

T1023NXE7PQA by NXP Semiconductors

T1023NXE7PQA

NXP Semiconductors

The NXP Semiconductors T1023NXE7PQA microprocessor features a 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for industrial applications requiring high-speed processing with low power consumption. Package style is grid array with fine pitch terminals for compact design.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T2080NXE8MQLB by NXP Semiconductors

T2080NXE8MQLB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

64

NO

FIXED POINT

YES

S-PBGA-B896

NO

3

896

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA896(UNSPEC)

SQUARE

GRID ARRAY

250

1200 rpm

YES

CMOS

INDUSTRIAL

BALL

BOTTOM

30

MICROPROCESSOR, RISC

T2080NXN8P1B by NXP Semiconductors

T2080NXN8P1B

NXP Semiconductors

T2080NXN8P1B by NXP Semiconductors is a 64-bit microprocessor with integrated cache. It is surface mountable and has 896 terminals in a grid array package style. This industrial-grade processor operates at temperatures ranging from -40 to 105°C and is suitable for various applications requiring high-speed processing.

64

NO

FIXED POINT

YES

S-PBGA-B896

e1

NO

3

896

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA896(UNSPEC)

SQUARE

GRID ARRAY

250

1533 rpm

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR, RISC

STM32MP157DAC1 by STMicroelectronics

STM32MP157DAC1

STMicroelectronics

STM32MP157DAC1 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 64 MHz clock frequency. Ideal for industrial applications, it features 48 DMA channels, low power mode, and operates in a temperature range of -20 to 105 °C.

26

32

YES

64 MHz

0

FLOATING POINT

YES

S-PBGA-B361

12 mm

YES

48

361

8

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

724992

1.2 mm

800 rpm

865 mA

1.25 V

.85 V

.9 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

12 mm

MICROPROCESSOR, RISC

STM32MP157DAA1 by STMicroelectronics

STM32MP157DAA1

STMicroelectronics

STM32MP157DAA1 by STMicroelectronics is a 32-bit microprocessor with 64 MHz clock frequency, 448 terminals, and 724992 RAM words. Ideal for industrial applications, it features low power mode, boundary scan support, and 48 DMA channels for efficient data transfer.

26

32

YES

64 MHz

0

FLOATING POINT

YES

S-PBGA-B448

18 mm

YES

48

448

8

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA448,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

724992

1.32 mm

800 rpm

865 mA

1.25 V

.85 V

.9 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

18 mm

MICROPROCESSOR, RISC

OSD3358-512M-IND by Octavo Systems

OSD3358-512M-IND

Octavo Systems

OSD3358-512M-IND by Octavo Systems is a microprocessor with 8-bit RAM and 28-bit address bus. It features a grid array package, operates in industrial temperature range (-40 to 85 °C), and has a supply voltage of 1.1V. Ideal for applications requiring high-speed processing in compact spaces.

64kbytes shared l3 ram also available

28

YES

16

FIXED POINT

NO

S-PBGA-B400

27 mm

NO

4

1

400

8

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA400,20X20,50

SQUARE

GRID ARRAY

245

65536

2.6 mm

1000 rpm

2000 mA

1.1 V

YES

CMOS

INDUSTRIAL

BALL

1.27 mm

BOTTOM

27 mm

MICROPROCESSOR, RISC

MC8640DTHJ1250HE by NXP Semiconductors

MC8640DTHJ1250HE

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1023; Package Code: HBGA; Package Shape: SQUARE;

32

32

YES

166.66 MHz

32

FLOATING POINT

YES

S-CBGA-B1023

33 mm

NO

3

4

1023

105 Cel

-40 Cel

CERAMIC

HBGA

BGA1023,32X32,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

245

2.97 mm

1250 rpm

1.1 V

1 V

1.05 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

33 mm

MICROPROCESSOR, RISC

LX2080XC71826B by NXP Semiconductors

LX2080XC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XC72029B by NXP Semiconductors

LX2080XC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XE72232B by NXP Semiconductors

LX2080XE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XN72029B by NXP Semiconductors

LX2080XN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XC72029B by NXP Semiconductors

LX2120XC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XN71826B by NXP Semiconductors

LX2120XN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XN72029B by NXP Semiconductors

LX2120XN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC