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INDUSTRIAL Microprocessors 294

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan CPU Family Maximum Clock Frequency DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width Peripheral IC Type Data EEPROM Size Connectivity
LX2160XE71826B by NXP Semiconductors

LX2160XE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XE72029B by NXP Semiconductors

LX2160XE72029B

NXP Semiconductors

NXP Semiconductors' LX2160XE72029B microprocessor features 64-bit architecture, 128-bit external data bus width, and 36-bit address bus. Ideal for industrial applications requiring high-speed processing with low power consumption. Package style is a grid array with a max operating temperature of 105°C.

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XE71826B by NXP Semiconductors

LX2080XE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XE72029B by NXP Semiconductors

LX2120XE72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XN72232B by NXP Semiconductors

LX2080XN72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XE71826B by NXP Semiconductors

LX2120XE71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XN72232B by NXP Semiconductors

LX2120XN72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XC71826B by NXP Semiconductors

LX2160XC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XE72232B by NXP Semiconductors

LX2160XE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XN71826B by NXP Semiconductors

LX2160XN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XN72232B by NXP Semiconductors

LX2160XN72232B

NXP Semiconductors

The NXP Semiconductors LX2160XN72232B microprocessor features a 64-bit architecture, 128-bit external data bus width, and 36-bit address bus width. Ideal for industrial applications requiring high-speed processing and low power consumption.

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XC72232B by NXP Semiconductors

LX2080XC72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XE72029B by NXP Semiconductors

LX2080XE72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2080XN71826B by NXP Semiconductors

LX2080XN71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XC71826B by NXP Semiconductors

LX2120XC71826B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

1800 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XC72232B by NXP Semiconductors

LX2120XC72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2120XE72232B by NXP Semiconductors

LX2120XE72232B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XC72029B by NXP Semiconductors

LX2160XC72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XC72232B by NXP Semiconductors

LX2160XC72232B

NXP Semiconductors

The NXP Semiconductors LX2160XC72232B microprocessor features a 64-bit architecture with 128 external data bus width and integrated cache. It is designed for industrial applications, offering low power mode and operating temperature range from -40 to 105°C. With 1517 terminals in a grid array package style, it supports boundary scan and RISC technology for efficient performance.

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2200 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LX2160XN72029B by NXP Semiconductors

LX2160XN72029B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

36

64

YES

128

FIXED POINT

YES

S-PBGA-B1517

e1

40 mm

YES

3

12

17

1517

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1517.39X39,40

SQUARE

GRID ARRAY

245

3.51 mm

2000 rpm

.05 mA

.88 V

.82 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

LS1012AXE7HKB by NXP Semiconductors

LS1012AXE7HKB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

800 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012AXN7KKB by NXP Semiconductors

LS1012AXN7KKB

NXP Semiconductors

LS1012AXN7KKB by NXP Semiconductors is a 64-bit microprocessor with 16-bit address and data bus width, operating at up to 25 MHz. Ideal for industrial applications, it features low power mode, integrated cache, and boundary scan support for efficient performance in compact designs.

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

1000 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012AXN7EKB by NXP Semiconductors

LS1012AXN7EKB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

600 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012AXN7HKB by NXP Semiconductors

LS1012AXN7HKB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

800 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012AXE7EKB by NXP Semiconductors

LS1012AXE7EKB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

600 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

T1040NXN7PQB by NXP Semiconductors

T1040NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

8

12

780

105 Cel

-40 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1040NXN7MQB by NXP Semiconductors

T1040NXN7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

8

12

780

105 Cel

-40 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

P1010NXE5FFB by NXP Semiconductors

P1010NXE5FFB

NXP Semiconductors

The NXP Semiconductors P1010NXE5FFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at speeds up to 667 rpm with a temperature range of -40 to 105°C.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5KHB by NXP Semiconductors

P1010NXN5KHB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXE5HFB by NXP Semiconductors

P1010NXE5HFB

NXP Semiconductors

The NXP Semiconductors P1010NXE5HFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with a max supply voltage of 1.05V. This CMOS technology-based processor is designed for high-speed performance in various embedded systems.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXE5KHB by NXP Semiconductors

P1010NXE5KHB

NXP Semiconductors

The NXP Semiconductors P1010NXE5KHB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a max supply voltage of 1.05V.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5FFB by NXP Semiconductors

P1010NXN5FFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5DFB by NXP Semiconductors

P1010NXN5DFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

533 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

MIMXRT1024CAG4A by NXP Semiconductors

MIMXRT1024CAG4A

NXP Semiconductors

The NXP Semiconductors MIMXRT1024CAG4A microprocessor features 32-bit architecture, 262144 RAM words, and a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

0

32

YES

24 MHz

0

FLOATING-POINT

YES

S-PQFP-G144

20 mm

YES

3

32

0

20

144

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

262144

1.6 mm

396 rpm

90 mA

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

QUAD

40

20 mm

MICROPROCESSOR, RISC

LS1012AXE7HKA by NXP Semiconductors

LS1012AXE7HKA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

800 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012AXN7EKA by NXP Semiconductors

LS1012AXN7EKA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

600 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

T1023NXN7KQA by NXP Semiconductors

T1023NXN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXN7MQA by NXP Semiconductors

T1023NXN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXE7KQA by NXP Semiconductors

T1023NXE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXE7MQA by NXP Semiconductors

T1023NXE7MQA

NXP Semiconductors

The NXP Semiconductors T1023NXE7MQA microprocessor features a 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with low power mode support. With a package style of grid array and fine pitch, it offers 525 terminals for versatile connectivity.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXN7PQA by NXP Semiconductors

T1023NXN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7KQA by NXP Semiconductors

T1013NXE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7MQA by NXP Semiconductors

T1013NXE7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7PQA by NXP Semiconductors

T1013NXE7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7PQA by NXP Semiconductors

T1013NXN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7MQA by NXP Semiconductors

T1013NXN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7KQA by NXP Semiconductors

T1013NXN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

AM6548BACDXEAF by Texas Instruments

AM6548BACDXEAF

Texas Instruments

Texas Instruments AM6548BACDXEAF is a 32-bit microprocessor with 1.05-1.15 V supply voltage range, operating from -40 to 105 °C. Features include 27 MHz clock frequency, 16-bit external data bus width, and integrated cache for industrial applications requiring low power mode and boundary scan capabilities.

28

32

YES

27 MHz

16

FIXED POINT

YES

S-PBGA-B784

e1

23 mm

YES

3

2

1

5

784

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA784,28X28,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

250

2097152

1.63 mm

1100 rpm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

23 mm

MICROPROCESSOR, RISC