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624 Microprocessors 31

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MCIMX6D6AVT10ADR by NXP Semiconductors

MCIMX6D6AVT10ADR

NXP Semiconductors

MCIMX6D6AVT10ADR by NXP Semiconductors is a 32-bit microprocessor with integrated cache, suitable for automotive applications. It features a grid array package style with 624 terminals and operates b/w -40 to 125°C. The processor utilizes RISC technology, has a terminal pitch of 0.8mm, and supports boundary scan testing.

64-BIT BUS WIDTH AVAILABLE

32

YES

FIXED POINT

YES

S-PBGA-B624

e1

21 mm

NO

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

PCIMX6Q6AVT10AC by NXP Semiconductors

PCIMX6Q6AVT10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; Length: 21 mm;

32

S-PBGA-B624

e1

21 mm

3

624

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

2.16 mm

1000 rpm

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6DP4AVT1AA by NXP Semiconductors

MCIMX6DP4AVT1AA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6DP6AVT1AA by NXP Semiconductors

MCIMX6DP6AVT1AA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP4AVT1AA by NXP Semiconductors

MCIMX6QP4AVT1AA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP4AVT8AA by NXP Semiconductors

MCIMX6QP4AVT8AA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

852 rpm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP6AVT1AA by NXP Semiconductors

MCIMX6QP6AVT1AA

NXP Semiconductors

MCIMX6QP6AVT1AA by NXP Semiconductors is a 32-bit microprocessor with integrated cache and a max supply voltage of 1.5V. It is commonly used in automotive applications due to its temperature grade, low power mode, and boundary scan capability.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S1AVM10AC by NXP Semiconductors

MCIMX6S1AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S4AVM10AC by NXP Semiconductors

MCIMX6S4AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S6AVM10AC by NXP Semiconductors

MCIMX6S6AVM10AC

NXP Semiconductors

MCIMX6S6AVM10AC by NXP Semiconductors is a MICROPROCESSOR with CMOS technology, operating at -40 to 125 °C. It has 624 terminals in a GRID ARRAY package style, suitable for automotive applications due to its low profile design and tin silver copper terminal finish.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U1AVM10AC by NXP Semiconductors

MCIMX6U1AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U4AVM10AC by NXP Semiconductors

MCIMX6U4AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U6AVM10AC by NXP Semiconductors

MCIMX6U6AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6Q4AVT10ADR by NXP Semiconductors

MCIMX6Q4AVT10ADR

NXP Semiconductors

MCIMX6Q4AVT10ADR by NXP is a 32-bit microprocessor with 64-bit external data bus width. It operates at speeds up to 1000 rpm, suitable for automotive applications. Featuring integrated cache and low power mode, it has a temperature range of -40 to 125 °C and boundary scan capability.

PKG DETAIL: HTTP://CACHE.FREESCALE.COM/FILES/SHARED/DOC/PACKAGE_INFO/98ASA00330D.

16

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6DP4AVT1AB by NXP Semiconductors

MCIMX6DP4AVT1AB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP4AVT1AB by NXP Semiconductors

MCIMX6QP4AVT1AB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP4AVT8AB by NXP Semiconductors

MCIMX6QP4AVT8AB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP6AVT1AB by NXP Semiconductors

MCIMX6QP6AVT1AB

NXP Semiconductors

MCIMX6QP6AVT1AB by NXP Semiconductors is a microprocessor with a max supply voltage of 1.5V and operating temperature range of -40 to 125°C. It is commonly used in automotive applications due to its CMOS technology and fine pitch grid array package style.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP6AVT8AB by NXP Semiconductors

MCIMX6QP6AVT8AB

NXP Semiconductors

MCIMX6QP6AVT8AB by NXP Semiconductors is a MICROPROCESSOR with CMOS technology. It operates b/w -40 to 125 °C and has a max supply voltage of 1.5 V. Ideal for automotive applications due to its fine pitch GRID ARRAY package style.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S1AVM08AD by NXP Semiconductors

MCIMX6S1AVM08AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

32

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

800 rpm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S1AVM10AD by NXP Semiconductors

MCIMX6S1AVM10AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

32

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1000 rpm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S4AVM08AD by NXP Semiconductors

MCIMX6S4AVM08AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

32

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

800 rpm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S4AVM10AD by NXP Semiconductors

MCIMX6S4AVM10AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

32

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1000 rpm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S6AVM08AD by NXP Semiconductors

MCIMX6S6AVM08AD

NXP Semiconductors

MCIMX6S6AVM08AD by NXP Semiconductors is a Microprocessor with 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for automotive applications due to its low power mode, operating temperature range of -40 to 125 °C, and boundary scan feature.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

32

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

800 rpm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S6AVM10AD by NXP Semiconductors

MCIMX6S6AVM10AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

32

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1000 rpm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U1AVM08AD by NXP Semiconductors

MCIMX6U1AVM08AD

NXP Semiconductors

MCIMX6U1AVM08AD by NXP is a microprocessor with 64-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for automotive applications due to its low power mode, operating temperature range of -40 to 125 °C, and boundary scan capability.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

800 rpm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U1AVM10AD by NXP Semiconductors

MCIMX6U1AVM10AD

NXP Semiconductors

MCIMX6U1AVM10AD by NXP is a Microprocessor with 64-bit External Data Bus, 16-bit Address Bus, and integrated cache. Ideal for automotive applications due to its low power mode, CMOS technology, and operating temperature range of -40 to 125 °C. Features boundary scan capability and a compact package style with 624 terminals in a square shape.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1000 rpm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U4AVM08AD by NXP Semiconductors

MCIMX6U4AVM08AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

800 rpm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U4AVM10AD by NXP Semiconductors

MCIMX6U4AVM10AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1000 rpm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U6AVM08AD by NXP Semiconductors

MCIMX6U6AVM08AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

800 rpm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U6AVM10AD by NXP Semiconductors

MCIMX6U6AVM10AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1000 rpm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC