Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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SN74ACT72211L35RJ
Texas Instruments
SN74ACT72211L35RJ by Texas Instruments is a 512x9 FIFO chip with synchronous operation and 5V nominal voltage. It features a memory density of 4608 bits, operates in commercial temperature grade up to 70°C, and supports parallel data transfer. This chip is commonly used in applications requiring high-speed data buffering and storage.
R-PQCC-J32
4608 bit
9
1
32
512 words
512
SYNCHRONOUS
70 Cel
0 Cel
512X9
YES
PLASTIC/EPOXY
QCCJ
RECTANGULAR
CHIP CARRIER
PARALLEL
Not Qualified
5.5 V
4.5 V
5
CMOS
COMMERCIAL
J BEND
QUAD
SN74ACT7200L25DV
SN74ACT7200L25DV by Texas Instruments is a FIFO memory with 256x9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is designed for parallel operation in commercial temperature grade applications.
25 ns
28.5 MHz
35 ns
R-PDSO-G28
2304 bit
OTHER FIFO
28
256 words
256
ASYNCHRONOUS
256X9
NO
SOP
SOP28,.45
SMALL OUTLINE
NOT SPECIFIED
.0005 Amp
FIFOs
125 mA
GULL WING
1.27 mm
DUAL
SN74ACT7200L50DV
SN74ACT7200L50DV by Texas Instruments is a FIFO memory with 256x9 organization, operating at 15 MHz clock frequency. It has a cycle time of 65 ns and operates on a nominal voltage of 5V. This CMOS technology device is ideal for applications requiring fast asynchronous data storage and retrieval in commercial temperature environments.
50 ns
15 MHz
65 ns
80 mA
SN74ACT7201LA15NP
SN74ACT7201LA15NP by Texas Instruments is a FIFO memory IC with 512x9 organization, operating at 40 MHz clock frequency. It features a cycle time of 25 ns and operates on a nominal voltage of 5V. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
15 ns
40 MHz
R-PDIP-T28
34.545 mm
DIP
DIP28,.3
IN-LINE
4.57 mm
THROUGH-HOLE
2.54 mm
7.62 mm
SN74ACT7202LA15RJ
SN74ACT7202LA15RJ by Texas Instruments is a FIFO chip with 1Kx9 organization, operating at 40MHz clock frequency. It has a cycle time of 25ns and can be used in applications requiring fast asynchronous data transfer. With a memory density of 9216 bits, it is suitable for commercial temperature grade environments.
13.995 mm
9216 bit
1024 words
1K
1KX9
LDCC32,.5X.6
3.56 mm
11.4554 mm
SN74ACT7202LA25NP
SN74ACT7202LA25NP by Texas Instruments is a FIFO memory with 1Kx9 organization, 35ns cycle time, and 28.5MHz clock frequency. It operates at 5V, has a temperature range of 0-70°C, and is ideal for applications requiring fast data storage and retrieval in parallel processing systems.
SN74ACT7203L25NP
SN74ACT7203L25NP by Texas Instruments is a FIFO memory with 2Kx9 organization, 2048 words, and 18432-bit memory density. It operates at a max clock frequency of 28.8 MHz and has a cycle time of 35 ns. This device is commonly used in applications requiring fast asynchronous data storage and retrieval.
28.8 MHz
18432 bit
2048 words
2K
2KX9
.002 Amp
120 mA
SN74ACT7204L15NP
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
36864 bit
4096 words
4K
4KX9
SN74ACT7204L15RJ
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Output Enable: NO;
SN74ACT7204L25RJ
SN74ACT7204L25RJ by Texas Instruments is a FIFO chip with 4Kx9 organization, operating at 28.8MHz clock frequency and 35ns cycle time. It is designed for parallel operation in commercial temperature grade applications, featuring a memory density of 36864 bits and a max supply voltage of 5.5V.
SN74ACT7205L50NP
SN74ACT7205L50NP by Texas Instruments is a FIFO memory with 8Kx9 organization, 65ns cycle time, and 15MHz max clock frequency. It operates at 5V, has 28 terminals in an in-line package style, and is suitable for commercial temperature grade applications.
73728 bit
8192 words
8K
8KX9
SN74ACT7201LA20NP
SN74ACT7201LA20NP by Texas Instruments is a FIFO with 512x9 organization, operating at 5V. It features an asynchronous mode, CMOS technology, and parallel interface. This device is ideal for applications requiring high-speed data transfer and memory management in commercial temperature environments.
CY7C419-15JXCT
Cypress Semiconductor
CY7C419-15JXCT by Cypress Semiconductor is a FIFO chip with 256x9 organization, operating at 5V. It has a cycle time of 25ns and max access time of 15ns. Ideal for applications requiring fast asynchronous data transfer in commercial temperature environments.
RETRANSMIT
e3
13.97 mm
3.55 mm
MATTE TIN
11.43 mm
7200L25JI8
Integrated Device Technology
7200L25JI8 by Integrated Device Technology is a FIFO chip carrier with 256x9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. Ideal for industrial applications requiring fast access times and parallel memory technology.
e0
85 Cel
-40 Cel
225
INDUSTRIAL
TIN LEAD
20
7201LA15JI8
7201LA15JI8 by Integrated Device Technology is a FIFO chip with 512x9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and can handle a max supply voltage of 5.5 V. Ideal for industrial applications requiring fast data processing and storage in parallel mode.
.005 Amp
7202LA25J8
7202LA25J8 by Integrated Device Technology is a FIFO memory chip with a cycle time of 35 ns and an operating voltage of 5V. It is commonly used in applications that require high-speed data buffering and storage, such as telecommunications and networking systems.
7202LA25JI8
7202LA25JI8 by Integrated Device Technology is a FIFO chip with 1KX9 organization, operating at 5V. It features a cycle time of 35ns and max clock frequency of 28.5MHz, suitable for industrial applications requiring fast data processing in parallel mode.
7202LA25TPI
7202LA25TPI by Integrated Device Technology is a FIFO with 1KX9 organization, 35 ns cycle time, and 28.5 MHz clock frequency. Ideal for industrial applications requiring fast data storage and retrieval in an asynchronous operating mode. Package style is in-line with through-hole terminals, suitable for parallel data processing systems.
34.671 mm
245
4.572 mm
7202LA50J8
7202LA50J8 by Integrated Device Technology is a FIFO chip carrier with 1KX9 organization, 65 ns cycle time, and 15 MHz clock frequency. It operates asynchronously at 5V, ideal for commercial applications requiring fast memory access and parallel data processing.
7203L12J8
7203L12J8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 50 MHz clock frequency. It features a cycle time of 20 ns and can handle memory width of 9 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
12 ns
50 MHz
20 ns
13.9954 mm
3.556 mm
7203L15J8
7203L15J8 by Integrated Device Technology is a FIFO memory chip with a cycle time of 25 ns and an operating frequency of up to 40 MHz. It has a memory capacity of 2Kx9 and is commonly used in applications that require high-speed data buffering and storage.
7203L15JI8
7203L15JI8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and can handle a max supply voltage of 5.5V. Ideal for industrial applications requiring fast data storage and retrieval in parallel mode.
.012 Amp
7203L15JI
7203L15JI by Integrated Device Technology is a FIFO chip carrier with 2Kx9 organization, operating at 40MHz clock frequency. It has a cycle time of 25ns and can handle temperatures from -40 to 85°C. Ideal for industrial applications requiring fast asynchronous data storage and retrieval.
7203L15TPI
7203L15TPI by Integrated Device Technology is a FIFO with 2KX9 organization, 25 ns cycle time, and 40 MHz clock frequency. Ideal for industrial applications requiring fast data processing and storage in an asynchronous operating mode. Package style is rectangular with 28 terminals in-line, suitable for parallel operations at a max supply voltage of 5.5 V.
7203L25J8
7203L25J8 by Integrated Device Technology is a FIFO chip with 2KX9 organization, operating at 5V. It features a cycle time of 35ns and max clock frequency of 28.5MHz. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7203L25JI8
7203L25JI8 by Integrated Device Technology is a FIFO chip with 2KX9 organization, operating at 5V. It has a cycle time of 35ns and max clock frequency of 28.5MHz. Ideal for industrial applications requiring fast data storage and retrieval in parallel mode.
7204L15J8
7204L15J8 by Integrated Device Technology is a FIFO chip carrier with 4Kx9 organization, operating at 40MHz clock frequency. It has a cycle time of 25ns and can be used in commercial applications requiring fast asynchronous memory access.
7280L20PA
7280L20PA by Integrated Device Technology is a FIFO with 512x9 organization, operating at 33.3 MHz clock frequency and 30 ns cycle time. It is designed for commercial applications requiring fast asynchronous data storage and retrieval in a compact small outline package.
33.3 MHz
30 ns
R-PDSO-G56
14 mm
56
TSSOP
TSSOP56,.3,20
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
240
1.1 mm
.5 mm
6.1 mm
72V36100L10PF
72V36100L10PF FIFO by Integrated Device Technology features a cycle time of 10 ns, operating at 100 MHz clock frequency. With an organization of 64KX36, it is ideal for applications requiring fast data processing and storage in commercial temperature environments. The FIFO supports synchronous operation with a supply voltage of 3.3 V, making it suitable for various parallel data transfer tasks.
6.5 ns
RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
100 MHz
10 ns
R-PQFP-G128
20 mm
2359296 bit
36
3
128
65536 words
64K
64KX36
LFQFP
QFP128,.63X.87,20
FLATPACK, LOW PROFILE, FINE PITCH
3.3
1.6 mm
.015 Amp
60 mA
3.45 V
3.15 V
30
72V36100L15PFI
72V36100L15PFI by Integrated Device Technology is a FIFO with 64Kx36 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. Ideal for industrial applications, it features synchronous operation, low profile flatpack package style, and a memory density of 2359296 bits.
66.7 MHz
40 mA
72V36110L15PFI8
72V36110L15PFI8 FIFO by Integrated Device Technology features a cycle time of 15ns, operating at 3.3V with an organization of 128KX36. Ideal for industrial applications, this FIFO offers parallel operation and a max clock frequency of 66.7MHz, making it suitable for high-speed data buffering needs.
4718592 bit
131072 words
128K
128KX36
72V845L15PFI8
72V845L15PFI8 FIFO by Integrated Device Technology features a cycle time of 15ns, operating at 3.3V with an organization of 4KX18. Ideal for industrial applications, this CMOS technology device offers parallel operation and a memory width of 18 bits.
18
4KX18
.01 Amp
3.6 V
3 V
74HC40105DB,118
NXP Semiconductors
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
600 ns
71.428 ns
R-PDSO-G16
e4
6.2 mm
64 bit
4
16
16 words
125 Cel
16X4
SSOP
SMALL OUTLINE, SHRINK PITCH
260
2 mm
6 V
2 V
4.5
AUTOMOTIVE
Nickel/Palladium/Gold (Ni/Pd/Au)
.65 mm
5.3 mm
74HC7030D,652
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2 V;
104 ns
REGISTER BASED; BUBBLE BACK 3US
9.2 MHz
108.7 ns
17.9 mm
576 bit
64 words
64
64X9
3-STATE
SOP28,.4
2/6
2.65 mm
1 mA
7.5 mm
74HC7030D,653
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;
74HC7030N,652
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
35.5 mm
DIP28,.6
5.1 mm
15.24 mm
74HC7403D,518
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Current: 1 mA;
98 ns
REGISTER BASED; BUBBLE BACK 2.7US
12 MHz
83.33 ns
10.3 mm
256 bit
64X4
SOP16,.25
NICKEL PALLADIUM GOLD
74HCT40105D,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
120 ns
REGISTER BASED; BUBBLE BACK 750NS
31 MHz
100 ns
9.9 mm
1.75 mm
3.9 mm
74HCT40105D,118
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words Code: 16;
74HCT40105N,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16;
R-PDIP-T16
21.6 mm
DIP16,.3
4.7 mm
74HCT7030D,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 64X9;
117 ns
10 MHz
116.28 ns
74HCT7030D,118
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 576 bit;
74HCT7030N,112
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 10 MHz;
74HCT7403D,512
OTHER FIFO; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Cycle Time: 83.33 ns;
108 ns
SOP16,.4
74HCT7403D,518
SN74V3640-10PEU
SN74V3640-10PEU by Texas Instruments is a FIFO memory with 1Kx36 organization, operating at 100MHz with 10ns cycle time. It has a low profile flatpack package and is suitable for applications requiring fast synchronous data transfer in commercial temperature environments.
1KX36
SN74V3640-15PEU
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.45 V;
SN74V3640-6PEU
SN74V3640-6PEU by Texas Instruments is a FIFO with 1Kx36 organization, operating at 166MHz clock frequency. It features a cycle time of 6ns and synchronous operation mode, suitable for applications requiring fast data transfer and storage in commercial-grade environments. With a low profile flatpack package style and Gull Wing terminal form, it offers parallel access with an output enable function.
4.5 ns
166 MHz
6 ns
220
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